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R7F701310EAFP
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Renesas Electronics Corporation
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High-end Automotive Microcomputers for Chassis System |
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R7F701410EABG
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Renesas Electronics Corporation
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High-end Automotive Microcontrollers for Instrument Cluster Supporting Basic or Low-level 2D Drawing |
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77311-125-10LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 10 Positions, 2.54 mm Pitch. |
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98426-S01-25-105LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions, 2.00mm (0.079in) Pitch. |
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98426-G01-25-105LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions, 2.00mm (0.079in) Pitch. |
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