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Text: □PM DPS256X16A3 Dense-Pac Microsystems, Ina O CERAMIC 256K X 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS256X16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC mounted on a
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DPS256X16A3
DPS256X16A3
A0-A16
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Untitled
Abstract: No abstract text available
Text: □P M DPS256X16A3 Dense-Pac Microsystems, Inc. CERAMIC 256K X 16 C M O S SRAM MODULE O PRELIMINARY DESCRIPTION: The D PS256X16A 3 "D E N S E -S T A C K " module is a revo lutio n ary new m em ory subsystem usin g D e n se -P a c M ic ro s y s te m s ' ceram ic Stackable
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DPS256X16A3
PS256X16A
A0-A16
30A045-00
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Untitled
Abstract: No abstract text available
Text: DPS256X16A3 Dense-Pac Microsystems. Inc. CERAMIC 256K X 16 C M O S SRAM MODULE O PRELIMINARY DESCRIPTION: The D P S 2 5 6 X 1 6 A 3 "D E N S E - S T A C K " m odule is a re v o lu t io n a ry n e w m e m o ry su b sy ste m u sin g D e n s e -P a c M ic r o s y s t e m s ' ce ra m ic S ta c ka b le
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DPS256X16A3
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Untitled
Abstract: No abstract text available
Text: DPS256X16A3 □PM Dense-Pac Microsystems, Inc. ^ CERAM IC 256K X 16 C M O S SRA M M O D U LE PRELIMINARY D E S C R IP T IO N : The DPS256X16A3 "D E N S E -S T A C K " module is a revo lutio n ary n ew m e m o ry subsystem usin g D e n se -P a c M ic ro s y s te m s ' ceram ic Stackab le
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DPS256X16A3
2641-W
30A045-00
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A273D
Abstract: 16J3 512X32 48pin
Text: R E F E R E N C E D R A O RG AN IZA TIO N PART NUMBER SIZE M P R O D 512 M egabit 6 4 0 Megabit 1024 Megabit 1152 Megabit 1152 Megabit S I Î A M P SPEED ns PACKAGE 16M x4 60, 70, 80 26-Pin TStack 19 16M x32 70, 80, 100 72-Pin S IM M 29 DPD16M X32PKW 5 16M x32
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26-Pin
72-Pin
A273D
16J3
512X32
48pin
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