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    DPDD16MX8RSAY5 Search Results

    DPDD16MX8RSAY5 Datasheets (9)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    DPDD16MX8RSAY5-DP-0815 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD16MX8RSAY5-DP-0820 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD16MX8RSAY5-DP-0825 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD16MX8RSAY5-DP-1015 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD16MX8RSAY5-DP-1020 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD16MX8RSAY5-DP-1025 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD16MX8RSAY5-DP-7515 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD16MX8RSAY5-DP-7520 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF
    DPDD16MX8RSAY5-DP-7525 DPAC Technologies DRAM Chip, DDR SDRAM, 16MByte, 2.5V Supply, Commercial, TSOP, 66-Pin Original PDF

    DPDD16MX8RSAY5 Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD16MX8RSAY5 DESCRIPTION: FEATURES: • Electrical characteristics meet semiconductor manufacturers’ datasheet • Memory organization: 2 64Mb memory devices. Each device arranged as 16M x 4 bits (4M x 4 bits x 4 banks)


    Original
    PDF DPDD16MX8RSAY5 IPC-A-610, 66-Pin 30A223-00

    TSOP 56 LAYOUT

    Abstract: TSOP 48 LAYOUT Dense-Pac Microsystems dm 0256
    Text: 128 Megabit CMOS DDR SDRAM DPDD16MX8RSAY5 DESCRIPTION: The 128 Megabit LP-StackTM module DPDD16MX8RSAY5, based on 64 Mbit devices, has been designed to fit the same footprint as the 16 Meg x 4 DDR SDRAM TSOP monolithic. This allows for system upgrade without electrical or


    Original
    PDF DPDD16MX8RSAY5 DPDD16MX8RSAY5, A0-A11 30A223-00 16Mx4 53A001-00 TSOP 56 LAYOUT TSOP 48 LAYOUT Dense-Pac Microsystems dm 0256

    30A223-00

    Abstract: No abstract text available
    Text: 128 Megabit CMOS DDR SDRAM DPDD16MX8RLAY5 DPDD16MX8RSAY5 ADVANCED INFORMATION DESCRIPTION: The PL-Stack series is a family of interchangeable memory devices. The 128 Megabit Double Data Rate Synchronous DRAM is a member of this family which utilizes the new and innovative space saving TSOP


    Original
    PDF DPDD16MX8RLAY5 DPDD16MX8RSAY5 DPDD16MX8RLAY5/ DPDD16MX8RSAY5, 64Mbit DPDD16MX8RLAY5/DPDD16MX8RSAY5 53A001-00 30A223-00 30A223-00

    TSOP 48 LAYOUT

    Abstract: TSOP 66 Package
    Text: ADVANCE D COM P ON E NTS PACKAG I NG 128 Megabit CMOS DDR SDRAM DPDD16MX8RSAY5 DESCRIPTION: The Memory Stack series is a family of interchangeable memory modules. The 128 Megabit Double Data Rate Synchronous DRAM module is a member of this family which utilizes the space saving LP-Stack™ TSOP stacking technology. The devices are


    Original
    PDF DPDD16MX8RSAY5 DPDD16MX8RSAY5, A0-A11 53A001-00 30A223-00 TSOP 48 LAYOUT TSOP 66 Package

    Untitled

    Abstract: No abstract text available
    Text: M t n t» DENSE-PAC MICROSYSTEMS Aa a ^ "7\ /H -T > M S M 128 Megabit C M O S D D R S D R A M D PD D 16M X 8RLA Y5 D pd d 16m x s r s a y s High Density Memory Device A D V A N C E D IN F O R M A T IO N DESCRIPTION: T h e /ti-D e m ia series is a family of interchangeable memory devices.


    OCR Scan
    PDF DPDD16M 64Mbit 30A223-00