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    30A10

    Abstract: ME17 Dense-Pac Microsystems
    Text: DENSE-PAC 16 Megabit CMOS DRAM MICROSYSTEMS DPD1MX16M2H3 PRELIMINARY D E S C R IP T IO N : T he D P D 1 M X 1 6 M 2 H 3 " S T A C K " m odule is a r e v o lu tio n a ry n e w m em o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLC Q stacked and leaded for surface


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    DP5Z

    Abstract: No abstract text available
    Text: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS


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