Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1669 May-97 9706 B3 OMEDATA DD642765ABA1 1.2µ OX/NI EEPROM 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):
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Original
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May-97
P-19656
P-19807,
P-19831
DD642765ABA1
DS1669
P-19832
P-19833
P-19834
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PDF
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1669 May-97 9706 B3 OMEDATA DD642765ABA1 1.2µ OX/NI EEPROM 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):
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Original
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May-97
P-19656
P-19807,
P-19831
DD642765ABA1
DS1669
P-19832
P-19833
P-19834
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PDF
|
P-20606
Abstract: c19643 DS1868 p19500 p1908 DD642 P19-50 B59728 P2050
Text: RELIABILITY MONITOR STRESS: Infant / High Voltage Life 125°C, 7.0 V. 6.0 V. DS1302 PRODUCT DS1302 DS1302 DS1302 DS1868 DS21S07A DS21S07A DS21S07A DS2401 DS2401 DS2401 DS80C320 DS80C320 DS80C320 DS80C320 MONITOR DATE JOB NO. Mar-97 Jun-97 Sep-97 Feb-97 Feb-97
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Original
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DS1302)
Mar-97
Jun-97
Sep-97
Feb-97
May-97
Aug-97
P-20606
c19643
DS1868
p19500
p1908
DD642
P19-50
B59728
P2050
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PDF
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