CY27S03A
Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Text: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability
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CY7C122
CY27S03A
15JC10
CY7C190
cy7c9101
cy7c122 die
VIC068A user guide
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CY7C9101
Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901
Text: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the
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Untitled
Abstract: No abstract text available
Text: CY7B160 CYPRESS SEMICONDUCTOR Expandable 16,384 x 4 Static RAM Features Functional Description • T h e C Y 7B 160 is a h ig h -p e rfo rm a n c e B iC M O S s ta tic R A M o rg a n iz e d as 16,348 x 4 bits. A m e m o ry ex p a n sio n fe a tu re is p ro v id e d to save access tim e by e lim in a tin g
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CY7B160
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Untitled
Abstract: No abstract text available
Text: _ CY7B160 — — ^ SEMICONDUCTOR Expandable 16,384 x 4 Static RAM Features Functional Description • T h e C Y 7B 160 is a h ig h -p e rfo rm a n c e B iC M O S s ta tic R A M o rg a n iz e d as 16,348 x 4 bits. A m e m o ry ex p a n sio n fe a tu re is
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CY7B160
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Untitled
Abstract: No abstract text available
Text: 1 | s ^ = 7 Z * e S SEMICONDUCTOR Expandable 16,384 x 4 Static RAM Features Functional Description • T h e C Y 7 B 1 6 0 is a h igh -p erform an ce B iC M O S static R A M organ ized as 16,348 x 4 bits. A m em o ry ex p a n sio n featu re is provid ed to save a ccess tim e by elim in a tin g
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CY7B160
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