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    CMUT7410 Search Results

    CMUT7410 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CMUT7410 Central Semiconductor SURFACE MOUNT ULTRAmini COMPLEMENTARY LOW VCE(SAT) SILICON TRANSISTORS Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: CMUT3410 NPN CMUT7410 PNP w w w. c e n t r a l s e m i . c o m SURFACE MOUNT COMPLEMENTARY LOW VCE SAT SILICON TRANSISTORS DESCRIPTION: The CENTRAL SEMICONDUCTOR CMUT3410, and CMUT7410, are low VCE(SAT) silicon transistors in an ULTRAmini surface mount package designed for


    Original
    PDF CMUT3410 CMUT7410 CMUT3410, CMUT7410, CMUT3410: CMUT7410: OT-523 100MHz CMUT3410) CMUT7410)

    marking code c43

    Abstract: amplifier marking code a marking c43 complementary npn-pnp complementary npn-pnp power transistors Surface mount NPN/PNP complementary transistor CMUT3410 CMUT7410 Marking codes c43 code
    Text: Central CMUT3410 NPN CMUT7410 PNP Semiconductor Corp. SURFACE MOUNT ULTRAmini COMPLEMENTARY LOW VCE SAT SILICON TRANSISTORS DESCRIPTION: The CENTRAL SEMICONDUCTOR CMUT3410, and CMUT7410, are low VCE(SAT) silicon transistors in an ULTRAminiā„¢ surface mount


    Original
    PDF CMUT3410 CMUT7410 CMUT3410, CMUT7410, CMUT3410 CMUT7410 OT-523 500mA 100MHz CMUT3410) marking code c43 amplifier marking code a marking c43 complementary npn-pnp complementary npn-pnp power transistors Surface mount NPN/PNP complementary transistor Marking codes c43 code

    c43 *pn

    Abstract: marking C43
    Text: CMUT3410 NPN CMUT7410 PNP SURFACE MOUNT COMPLEMENTARY LOW VCE SAT SILICON TRANSISTORS w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMUT3410, and CMUT7410, are low VCE(SAT) silicon transistors in an ULTRAmini surface mount package designed for


    Original
    PDF CMUT3410 CMUT7410 CMUT3410, CMUT7410, CMUT3410: CMUT7410: OT-523 800mA, 100mA 500mA c43 *pn marking C43

    marking c43

    Abstract: CMUT3410 CMUT7410
    Text: CMUT3410 NPN CMUT7410 PNP SURFACE MOUNT COMPLEMENTARY LOW VCE SAT SILICON TRANSISTORS w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMUT3410, and CMUT7410, are low VCE(SAT) silicon transistors in an ULTRAmini surface mount package designed for


    Original
    PDF CMUT3410 CMUT7410 CMUT3410, CMUT7410, CMUT3410: CMUT7410: OT-523 CMUT3410) CMUT7410) marking c43

    CHIP TRANSISTOR

    Abstract: transistor 18x18 CMLT7410 CMPT7410 CMST7410 CMUT7410 CP741V
    Text: PROCESS CP741V Small Signal Transistors PNP - Low VCE SAT Transistor Chip PROCESS DETAILS Process Epitaxial Planar Die Size 18 x 18 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.8 x 3.8 MILS Emitter Bonding Pad Area 3.8 x 3.8 MILS Top Side Metalization


    Original
    PDF CP741V CMLT7410 CMPT7410 CMST7410 CMUT7410 CHIP TRANSISTOR transistor 18x18 CMLT7410 CMPT7410 CMST7410 CMUT7410 CP741V

    cp741

    Abstract: CMLT7410 CMPT7410 CMST7410 CMUT7410 CP741V small signal transistors
    Text: PROCESS CP741V Small Signal Transistors PNP - Low VCE SAT Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 17.7 x 17.7 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.8 x 3.8 MILS Emitter Bonding Pad Area 3.8 x 3.8 MILS Top Side Metalization


    Original
    PDF CP741V CMLT7410 CMPT7410 CMST7410 CMUT7410 22-March cp741 CMLT7410 CMPT7410 CMST7410 CMUT7410 CP741V small signal transistors

    a42e

    Abstract: IC 7410 sot-89 A63 CZT900K npn 2907A 2222a A77 SOT23 2222ae A92E 3906 npn
    Text: Small Signal Transistors Surface Mount Packages Actual Size SOD-923 SOT-923 SOT-953 SOD-523 SOT-523 SOT-563 SOD-323 SOT-323 SOT-363 SOD-123 SOD-123F SOT-23 SOT-23F SOT-143 SOT-26 SOT-28 SOT-89 SOT-223 SOT-228 SMA SMB SMC SOIC-16 HD DIP TLP Tiny Leadless


    Original
    PDF OD-923 OT-923 OT-953 OD-523 OT-523 OT-563 OD-323 OT-323 OT-363 OD-123 a42e IC 7410 sot-89 A63 CZT900K npn 2907A 2222a A77 SOT23 2222ae A92E 3906 npn

    CMLT7410

    Abstract: CMPT7410 CMST7410 CMUT7410 CP741V
    Text: PROCESS CP741V Small Signal Transistors PNP - Low VCE SAT Transistor Chip PROCESS DETAILS Process Epitaxial Planar Die Size 18 x 18 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.8 x 3.8 MILS Emitter Bonding Pad Area 3.8 x 3.8 MILS Top Side Metalization


    Original
    PDF CP741V CMLT7410 CMPT7410 CMST7410 CMUT7410 12-August CMLT7410 CMPT7410 CMST7410 CMUT7410 CP741V