94V0 V03
Abstract: No abstract text available
Text: Shrouded headers CID07 4x15 - .100" Grid Features: • • • • • • • • • .100" 2.54 mm grid - 4 rows 60 straight shrouded pins selectively plated gold contact Ni underplate suitable for no-clean operation Sn/Pb plated contact leads for solderability
|
Original
|
PDF
|
CID07
B10003)
CA510
E10008
V03-1173
F0000013
A0784789
94V0 V03
|
Untitled
Abstract: No abstract text available
Text: Shrouded headers CID07 4x15 - .100" Grid Features: • • • • • • • • • .100" 2.54 mm grid - 4 rows 60 straight shrouded pins selectively plated gold contact Ni underplate suitable for no-clean operation Sn/Pb plated contact leads for solderability
|
Original
|
PDF
|
CID07
B10003)
CA510
E10008
V03-1173
F0000013
A0784789
|
Untitled
Abstract: No abstract text available
Text: Straight headers 2 rows, solder tails - .100" Grid Features: • • • • • • • .100" 2.54 mm grid - 2 rows straight unshrouded .025" [.64mm] square pins stackable in both directions: end to end and side to side selectively plated gold contact area
|
Original
|
PDF
|
CBR30
CBR34
CTP22
CID07
A10030-31)
A10034)
A10001-09)
B10001-02)
E10001
A0641267
|
1850R
Abstract: dh 1117 U514 0QQ011
Text: • H Enhanced Memory Systems Inc. Features ciD07S47 DDDG11G 21b DM2M36SJ/DM2M32SJ 2Mbx36/2Mbx32Enhanced DRAMSIMM Product Specification Architecture The DM2M36SJ achieves 2Mb x 36 density by mounting 18 1Mb x 4 EDRAMs, packaged in 28-pin plastic SOJ packages, on both sides
|
OCR Scan
|
PDF
|
iD07S47
DDDG11G
DM2M36SJ/DM2M32SJ
2Mbx36/2Mbx32Enhanced
DM2202J-XX,
DM2212J-XX,
DM2M32SJ)
DM2M36SJ
1850R
dh 1117
U514
0QQ011
|