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    thermal camera

    Abstract: IPC-4101 Sn60Pb40 solder Sn60Pb40 JESD22-B102D J-STD-002B 106G 208H 210F Res 2512
    Text: Product Family: RF Chip Power Resistor Part Number Series: CFA2512E50R0JS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:


    Original
    PDF CFA2512E50R0JS Sn100, 25ppm/ Sn60Pb40 MIL-STD-1285D) A50R0 CFA2512E50R0JS-T10) thermal camera IPC-4101 Sn60Pb40 solder JESD22-B102D J-STD-002B 106G 208H 210F Res 2512

    Untitled

    Abstract: No abstract text available
    Text: Product Family: RF Chip Power Resistor Part Number Series: CFA2512E50R0JS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:


    Original
    PDF CFA2512E50R0JS Sn100, 25ppm/Â Sn60Pb40 MIL-STD-1285D) A50R0 CFA2512E50R0JS-T10)

    2512E50R0JS

    Abstract: No abstract text available
    Text: Product Family: RF Power Chip Resistor Part Number: CF*2512E50R0JS Susumu World Group Construction: • BeO or High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard


    Original
    PDF 2512E50R0JS Sn100, 25ppm/ Sn60Pb40 MIL-STD-1285D) A50R0 CFA2512E50R0JS-T10) 2512E50R0JS