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    BGA Solder Ball 1mm

    Abstract: SF-BGA672B-B-11 pitch 0.4mm BGA
    Text: C Package Code: BGA672B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] 1.00mm pitch typ. X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"] dia pads


    Original     		BGA672B FR4/G10 26X26 27mss. SF-BGA672B-B-11 BGA Solder Ball 1mm pitch 0.4mm BGA PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    FP-X4KPG223-01

    Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
    Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators


    Original     		XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01 PDF