pitch 0.4mm BGA
Abstract: 14X14 SF-BGA160C-B-11 0.4mm pitch BGA
Text: C Package Code: BGA160C D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 13.00mm [0.512"] X Top View (reference only) 1.00mm pitch typ. 0.53mm [0.021"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.53mm [0.021"]
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BGA160C
FR4/G10
14X14
Allo24
SF-BGA160C-B-11
pitch 0.4mm BGA
14X14
0.4mm pitch BGA
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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BGA PACKAGE OUTLINE
Abstract: 14X14 1537M
Text: connected to H2 15.37mm [0.605"] 1.18mm [0.047"] BGA package outline 3.48mm [0.137"] A1 16.48mm [0.649"] Top View 1 1.00mm 1.59mm [0.063"] Bottom View 2.09mm [0.082"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2
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FR4/G10
14X14
FX-BGA160C/BGA160C-01
FX-BGA160C/160C-01
BGA PACKAGE OUTLINE
1537M
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