Untitled
Abstract: No abstract text available
Text: Preliminary V•I Chip Bus Converter Module B384F120T30 BCM V•I Chip – BCM Bus Converter Module TM • 384 V to 12 V V•I Chip Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1036 W/in3
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B384F120T30
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY V•I Chip Bus Converter Module B384F120T30 BCM V•I Chip – BCM Bus Converter Module TM • 384 V to 12 V V•I Chip Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1036 W/in3
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B384F120T30
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Abstract: No abstract text available
Text: B384F120T30 BCMTM Bus Converter • 384 V to 12 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260 W/in2
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B384F120T30
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Text: EOL - Not Recommended for New Designs; Alternate Solution is B384F120T30 BCM Bus Converter BC384A120T030FP Advanced Sine Amplitude Converter SAC™ Technology Features • 100°C baseplate operation • Typical efficiency 95% • 384 V to 12 V Bus Converter
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B384F120T30
BC384A120T030FP
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B384F120T30
Abstract: D496 D505
Text: B384F120T30 BCMTM Bus Converter • 384 V to 12 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1017 W/in3 • <1 µs transient response • Small footprint – 260 W/in2
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B384F120T30
B384F120T30
D496
D505
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B384F120T30
Abstract: D496 D505
Text: B384F120T30 BCMTM Bus Converter • 384 V to 12 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1017 W/in3 • <1 µs transient response • Small footprint – 260 W/in2
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B384F120T30
B384F120T30
D496
D505
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY B384F120T30 BCMTM Bus Converter Module • 384 V to 12 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260
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B384F120T30
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Untitled
Abstract: No abstract text available
Text: B384F120T30 BCMTM Bus Converter • 384 V to 12 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260 W/in2
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B384F120T30
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY V•I Chip Bus Converter Module B384F120T30 BCM V•I Chip – BCM Bus Converter Module TM • 384 V to 12 V V•I Chip Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1036 W/in3
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B384F120T30
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Untitled
Abstract: No abstract text available
Text: B384F120T30 BCMTM Bus Converter • 384 V to 12 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260 W/in2
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B384F120T30
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Untitled
Abstract: No abstract text available
Text: B384F120T30 BCMTM Bus Converter • 384 V to 12 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260 W/in2
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B384F120T30
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY B384F120T30 BCMTM Bus Converter Module • 384 V to 12 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260
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B384F120T30
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Untitled
Abstract: No abstract text available
Text: B384F120T30 BCMTM Bus Converter • 384 V to 12 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260 W/in2
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B384F120T30
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B384F120T30
Abstract: BCM reflow
Text: Preliminary V•I Chip Bus Converter Module B384F120T30 BCM V•I Chip – BCM Bus Converter Module TM • 384 V to 12 V V•I Chip Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1036 W/in3
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B384F120T30
B384F120T30
BCM reflow
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Abstract: No abstract text available
Text: EU Declaration of Conformity Vicor Corporation 25 Frontage Road Andover, MA 01810 USA Declare under sole responsibility that the VI Chip High Voltage BCM Models: B384F120T30, B352F110T30, VIZ0002 DC-DC Component Power Supply designed for Building-In, to which this declaration relates, meets the essential health and safety
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B384F120T30,
B352F110T30,
VIZ0002
73/23/EEC
93/68/EEC
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Text: Not Recommended for New Designs - Replaced by BCM384x120y300A00 B384F120T30 BCMTM Bus Converter • 384 V to 12 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1017 W/in3
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BCM384x120y300A00
B384F120T30
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Powerbank sc
Abstract: VICOR 32497 SMD PJ 899 PRM48BH480T200 BC048 30193 34653 vicor stud diode VTM48EH120T010 BCM48BF120T300A00
Text: VICOR CORPORATION Power Solutions Vicor's product line of modular power components and complete power systems includes thousands of combinations of input voltage, output voltage, and power levels, complete with accessory components that integrate other power system
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VIZ0002
Abstract: VIZ00 vicor MA01810 BCM reflow VIZ0033 B048F120T20 VTM 48 B048F030M21 B048F030T21 B048F060M24
Text: Product Change Notice Notice: #100118 update to PCN #090804 Date: January 18, 2010 To Our Valued Customers: We appreciate your use of V•I Chip products. Our commitment to customer satisfaction is demonstrated by our notification to you of a product enhancement.
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SG 403
Abstract: No abstract text available
Text: 6,73 0.265 V•I Chip BCM HV Bus Converter Family TM TM • Efficiency: 95% Typical –In +In PC RSV TM VICOR CORP. MADE IN USA • Current sharing: 5% BCM 22,0 0.87 ™ S RoHS • Input: HV 270 / 350 / 380 V C • Isolation: 4,242 Vdc 3 –Out 2 • Power Density: >1000 W/in
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Abstract: No abstract text available
Text: Application Note AN:016 Using BCM Bus Converters in High Power Arrays By Paul Yeaman Manager, V•I Chip Applications Introduction Contents Page Introduction 1 Theory 1 Design 1 Symmetrical Input / 2 Output Impedances ROUT Matching 2 Uniform Cooling 2 Arrays Powered
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high frequency welder circuit diagram
Abstract: do-41 footprint pcb diagram of mini ups system battery charger for mobile 3.7 VDC welder circuit diagram ThermMate vicor 18373 Vicor 18372 st c 1117 ld 25 regulator Powerbank
Text: Vicor Corporation Power Solutions Vicor's product line of modular power components and complete power systems includes thousands of combinations of input voltage, output voltage, and power levels, complete with accessory components that integrate other power system
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ran-4106
high frequency welder circuit diagram
do-41 footprint
pcb diagram of mini ups system
battery charger for mobile 3.7 VDC
welder circuit diagram
ThermMate
vicor 18373
Vicor 18372
st c 1117 ld 25 regulator
Powerbank
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Powerbank
Abstract: 30268 VICOR 32497 30076 M-FIAM military passive component MIL-STD-810F shock pj 899 diode USER-CONFIGURE PB1004PFC inmate socket 18378
Text: VICOR CORPORATION Power Solutions Vicor's product line of modular power components and complete power systems includes thousands of combinations of input voltage, output voltage, and power levels, complete with accessory components that integrate other power system
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BCM 74
Abstract: No abstract text available
Text: 应用笔记 AN:016 ! 应用 BCMTM 母线转换器组成大功率阵列! Paul Yeaman - V•I 晶片应用工程部经理 引言!! 本应用笔记会介绍并联多个BCM组成大功率阵列的设计方法及指引。 内容! 页!! 引言 1 理论! 理论
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22BCM
BCMB384F120T30-PB
384Vdc
12Vdc,
B383F120T30-PB
BCM 74
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high voltage regulator schematic
Abstract: adjustable regulator high voltage high voltage ceramic cap high voltage diodes high voltage transformer TP05 TP04 B384F120T30 PS01 VICOR REGULATOR SCHEMATIC
Text: User Guide UG:004 High Voltage BCM Parallel Array System User’s Guide Contents Page 1.0 Introduction 1 1 1.1 Note on System Components 1.2 Features 1 2.0 Evaluation System Description 2 2.1 High Voltage BCM Parallel Array 2.1.1 Power Rating of BCM Parallel Array
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