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    A5833 Search Results

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    A5833 Price and Stock

    Microchip Technology Inc ATA5833-WNQW

    IC RF TXRX+MCU ISM<1GHZ 32QFN
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    DigiKey ATA5833-WNQW Cut Tape 1
    • 1 $3.2
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    ATA5833-WNQW Digi-Reel 1
    • 1 $3.2
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    ATA5833-WNQW Reel
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    Microchip Technology Inc ATA5833-WNQW Reel 23 Weeks
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    Avnet Silica ATA5833-WNQW 25 Weeks 6,000
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    Vyrian ATA5833-WNQW 233
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    TE Connectivity DBAC-50-54-12-A5833

    DBAC 50-54-12 A5833
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    DigiKey DBAC-50-54-12-A5833 Bulk 50
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    • 100 $79.0232
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    Avnet Americas DBAC-50-54-12-A5833 Bulk 50
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    Onlinecomponents.com DBAC-50-54-12-A5833
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    Master Electronics DBAC-50-54-12-A5833
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    • 100 $77.06
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    ITT Interconnect Solutions DPX3MA-58-33S-0001

    DPX3MA-58-33S-0001 - Bulk (Alt: DPX3MA-58-33S-0001)
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    Avnet Americas DPX3MA-58-33S-0001 Bulk 1
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    Seiko Epson Corporation SG-8018CA 50.0833M-TJHPA0

    Standard Clock Oscillators SG-8018CA 50.0833M-TJHPA0: MHZ OSC 1.8V~3.3V +/-50PPM -40~105C O/E 1K TR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics SG-8018CA 50.0833M-TJHPA0
    • 1 $1.23
    • 10 $1.1
    • 100 $0.902
    • 1000 $0.712
    • 10000 $0.662
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    Seiko Epson Corporation SG-8018CA 50.0833M-TJHSA0

    Standard Clock Oscillators SG-8018CA 50.0833M-TJHSA0: MHZ OSC 1.8V~3.3V +/-50PPM -40~105C ST 1K TR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics SG-8018CA 50.0833M-TJHSA0
    • 1 $1.23
    • 10 $1.1
    • 100 $0.902
    • 1000 $0.712
    • 10000 $0.672
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    Find more A5833 price and stock on Findchips.com

    A5833 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    A5833 Allegro MicroSystems BiMOS II 32-Bit Serial Input Latched Driver Original PDF

    A5833 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    A5833

    Abstract: A6833 UCN5833EP
    Text: A5833 BiMOS II 32-Bit Serial Input Latched Driver Discontinued Product These parts are no longer in production The device should not be purchased for new design applications. Samples are no longer available. Date of status change: October 31, 2005 Recommended Substitutions:


    Original     		A5833 32-Bit A6833. 28-Line 6A259 6B259 A5833 A6833 UCN5833EP PDF

    UCN5833A

    Abstract: A5833 A6833 UCN5833EP unipolar stepper motor 6812
    Text: A5833 BiMOS II 32-Bit Serial Input Latched Driver Last Time Buy These parts are in production but have been determined to be LAST TIME BUY. This classification indicates that the product is obsolete and notice has been given. Sale of this device is currently


    Original     		A5833 32-Bit A6833. 28-Line 6A259 6B259 UCN5833A A5833 A6833 UCN5833EP unipolar stepper motor 6812 PDF

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF