|
5962-8869002JA
|
|
Renesas Electronics Corporation
|
512x8 CMOS PROM |
|
|
|
68690-110HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in)Pitch. |
|
|
|
68690-130HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch. |
|
|
|
68690-150HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in)Pitch. |
|
|
