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    Amphenol Corporation 3456LS2812P

    Circular MIL Spec Connector 5015 RR 26#16 PIN PLUG
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    Amphenol Corporation 3456L2029PW

    Circular MIL Spec Connector PLUG W/THRD COUPLING 17P SIZE 16 PIN
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    Amphenol Corporation 3459L4056PX

    Circular MIL Spec Connector 5015 RR 85#16 PIN PLUG
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    Amphenol Corporation 3459L4056PY

    Circular MIL Spec Connector 5015 RR 85#16 PIN PLUG
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    Amphenol Corporation 3456W281S

    Circular MIL Spec Connector 9P Size 28 Threaded Plug MIL-DTL-5015
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    85X65 Datasheets Context Search

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    "6 pin din" camera connector

    Abstract: auTOMATION DCS Notes DCS Automation Notes 95ACC2230 95ACC2250 CS-A1-06-B-10
    Text: VISION SENSORS VISION SENSORS • Fully embedded vision sensor • 3.5” VSC configurator • 7 different controls • Memorisation of 8 inspections The SVS1 series is the easiest solution for machine vision applications. The setup is very quick and intuitive thanks to the VSC unit, the external configurator with 3.5” colour


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    PDF ISO14000 CS-A1-06-B-03 CS-A1-06-B-05 CS-A1-06-B-10 SVS-CV-VSC-02 SVS-CV-VSC-04 SVS-ST-5068 SVS-ST-5066 SVS-MK-01 "6 pin din" camera connector auTOMATION DCS Notes DCS Automation Notes 95ACC2230 95ACC2250 CS-A1-06-B-10

    CS-A1-06-B-10

    Abstract: 80X55 plastic bottle SVS2-08-DE-OBJ 95A901350
    Text: INSPECTION SENSORS VISION SENSORS SVS2 SERIES The SVS2 vision sensor series presents all the characteristics able to solve artificial machine vision applications in a flexible and intuitive way. SVS2 is a completely embedded device: the optic, the red LED illuminator and


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    PDF 95ACC2250 SVS-ST-5068 95A901320 SVS-ST-5066 95A901330 SVS-CV-RJ45C-03 95A901340 SVS-CV-RJ45D-03 95A901350 SVS-MK-01 CS-A1-06-B-10 80X55 plastic bottle SVS2-08-DE-OBJ 95A901350

    LPS200

    Abstract: MIL-HDBK-263 LPS-200
    Text: LPS200 HIGH PERFORMANCE LOW NOISE PHEMT • FEATURES ♦ 1.0 dB Noise Figure at 18 GHz ♦ 10 dB Associated Gain at 18 GHz ♦ Low DC Power Consumption GATE BOND PAD 2X DRAIN BOND PAD (2X) SOURCE BOND PAD (2x) DIE SIZE: 12.6X10.2mils (320x260 µm) DIE THICKNESS: 3.9 mils (100 µm)


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    PDF LPS200 320x260 85x65 LPS200 MIL-HDBK-263 LPS-200

    bond wire gold

    Abstract: LPD200 MIL-HDBK-263
    Text: LPD200 HIGH PERFORMANCE PHEMT • FEATURES ♦ 21 dBm Output Power at 1-dB Compression at 18 GHz ♦ 12 dB Power Gain at 18 GHz ♦ 1.0 dB Noise Figure at 18 GHz ♦ 55% Power-Added Efficiency DRAIN BOND PAD 2X GATE BOND PAD (2X) SOURCE BOND PAD (2x) DIE SIZE: 12.6X10.2mils (320x260 µm)


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    PDF LPD200 320x260 85x65 LPD200 bond wire gold MIL-HDBK-263