Untitled
Abstract: No abstract text available
Text: 80P6C-A Plastic 80pin 12✕12mm body TQFP EIAJ Package Code TQFP80-P-1212-0.50 Weight g Lead Material Alloy 42 MD e JEDEC Code – HD D ME 61 b2 80 60 1 I2 20 HE E Recommended Mount Pad Symbol 41 21 40 A L1 F A1 c A2 e b L y Detail F A A1 A2 b c D E e HD
|
Original
|
PDF
|
80P6C-A
80pin
TQFP80-P-1212-0
|
Untitled
Abstract: No abstract text available
Text: P4C164L LOW POWER 8K x 8 STATIC CMOS RAM FEATURES Common Data I/O Three-State Outputs Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Automatic Power Down Packages —28-Pin 300 and 600 mil DIP —28-Pin 450 mil SOP VCC Current Commercial/Industrial
|
Original
|
PDF
|
P4C164L
--28-Pin
a164L
P4C164L
|
432W6
Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P
|
Original
|
PDF
|
240K6X-A
240P6Y-A
240P6Z-A
255F7F
256F7B
256F7X-A/B
256P6J-E
256P6K-E
272F7X-A/B
281S8-C
432W6
48P4B
hssop
44P3W-R
28P0
5P5T
tsop 2-54
42P9R
70P3S-M
479F7G
|
48P4B
Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Text: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P
|
Original
|
PDF
|
240K6X-A
30S1B
42S1B-A
52S1B-B
64S1B-E
124S8
135S8-F
145S8
149S8
177S8
48P4B
P/N146071
hssop
432W6
70P3S-M
10C2-C
136P6S-C
20P5A
|
P4C164L
Abstract: No abstract text available
Text: P4C164L LOW POWER 8K x 8 STATIC CMOS RAM FEATURES Common Data I/O Three-State Outputs Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Automatic Power Down Packages —28-Pin 300 and 600 mil DIP —28-Pin 330 mil SOP VCC Current Commercial/Industrial
|
Original
|
PDF
|
P4C164L
--28-Pin
SRAM116
SRAM116
P4C164L
Oct-05
|
Untitled
Abstract: No abstract text available
Text: P4C164L LOW POWER 8K x 8 STATIC CMOS RAM FEATURES Common Data I/O Three-State Outputs Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Automatic Power Down Packages —28-Pin 300 and 600 mil DIP —28-Pin 450 mil SOP VCC Current Commercial/Industrial
|
Original
|
PDF
|
P4C164L
--28-Pin
SRAM116
P4C164L
Oct-05
SRAM116
|
Untitled
Abstract: No abstract text available
Text: P4C164L LOW POWER 8K x 8 STATIC CMOS RAM FEATURES Common Data I/O Three-State Outputs Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Automatic Power Down Packages —28-Pin 300 and 600 mil DIP —28-Pin 450 mil SOP VCC Current Commercial/Industrial
|
Original
|
PDF
|
P4C164L
--28-Pin
SRAM116
P4C164L
Oct-05
Aug-06
|
10C2
Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension
|
Original
|
PDF
|
12P9B
14P5A
16P5A
20P5A
24P5A
18P4G
20P4G
22P4H
24P4D
24P4Y
10C2
144PFB-A
48P4B
16P2S-A
240mil
hssop
Package tray dimension
12P9
16P2Z-A
18P4G
|
324pc
Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension
|
Original
|
PDF
|
240mil
SP050PC
340mil
SP070PC
440mil
12P9B
14P5A
16P5A
20P5A
24P5A
324pc
L198
L-088
930PC
12P9B
300mil trays
4028PC
L199
SP080
pt881
|
Untitled
Abstract: No abstract text available
Text: MITSUBISHI MICROCOMPUTERS 3886 Group 4\P so'"®9 S IN G L E -C H IP 8 -B IT C M O S M IC R O C O M P U T E R F LA S H M E M O R Y V E R S IO N DESCRIPTION • Power dissipation The 3886 group is the 8-bit m icrocom puter based on the 740 fa m In high-speed m ode . 40 mW
|
OCR Scan
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Q F P Alloy 42 Lead Frame 0.50mm * ★ : eecier Oe« BODY SIZE O.fjbmri 28; 160 V :; 0 bornir. 203 0.40mm 256 20BP6Y 32 rch PIN CO 266P6J* 240 H Q F P (Copper Alloy Lead Frame + Copper Heat Spreader) H Q F P (Alloy 42 Lead Frame + Copper Heat Spreader)
|
OCR Scan
|
PDF
|
20BP6Y
266P6J*
PtNd52P6T)
208P6tt)
100P6Q
176P6Q
208P6Q
80P6C
100P6V
28P0K
|