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    8 PIN LEAD SOP Search Results

    8 PIN LEAD SOP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    8 PIN LEAD SOP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    transistor 8P

    Abstract: FPT-8P-M01 M01 8-pin
    Text: SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC FPT-8P-M01 EIAJ code : ∗SOP008-P-0300-1 8-pin plastic SOP Lead pitch 50mil Nominal dimensions 300mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold FPT-8P-M01 8-pin plastic SOP


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    PDF FPT-8P-M01 OP008-P-0300-1 50mil 300mil FPT-8P-M01) F08002S-4C-4 transistor 8P FPT-8P-M01 M01 8-pin

    M01 8-pin

    Abstract: FPT-8P-M01
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M01 8-pin plastic SOP FPT-8P-M01 8-pin plastic SOP (FPT-8P-M01) Lead pitch 1.27 mm Package width x package length 5.3 × 6.35 mm Lead shape Gullwing Sealing method Plastic mold


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    PDF FPT-8P-M01 FPT-8P-M01) F08002S-c-6-7 M01 8-pin FPT-8P-M01

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN CERAMIC To Top / Package Lineup / Package Index FPT-8C-A01 8-pin ceramic SOP Lead pitch 50 mil Lead shape Gullwing Sealing method Metal seal FPT-8C-A01 8-pin ceramic SOP (FPT-8C-A01) 5.45(.215)


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    PDF FPT-8C-A01 FPT-8C-A01) F08003SC-2-2 FUJ-A01)

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN CERAMIC FPT-8C-A01 8-pin ceramic SOP Lead pitch 50 mil Lead shape Gullwing Sealing method Metal seal FPT-8C-A01 8-pin ceramic SOP (FPT-8C-A01) 5.45(.215) TYP 3.81(.150) REF 0.05(.002)


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    PDF FPT-8C-A01 FPT-8C-A01) F08003SC-2-2 orderin-A01)

    FPT-8P-M08

    Abstract: 530010 5 pin lead sop
    Text: SMALL OUTLINE PACKAGE FUJITSU MICROELECTRONICS DATA SHEET 8 PIN PLASTIC FPT-8P-M08 8-pin plastic SOP Lead pitch 1.27 mm Package width x package length 5.30 mm × 5.24 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold Mounting height


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    PDF FPT-8P-M08 FPT-8P-M08) F08016S-c-1-1 FPT-8P-M08 530010 5 pin lead sop

    8 pin lead sop

    Abstract: FPT-8C-A01 272 8pin fpt-8c
    Text: SMALL OUTLINE L-LEADED PACKAGE 8 PIN CERAMIC FPT-8C-A01 8-pin ceramic SOP Lead pitch 50mil Lead shape Gullwing Sealing method Metal seal FPT-8C-A01 8-pin ceramic SOP (FPT-8C-A01) 5.45(.215) TYP 3.81(.150) REF 0.05(.002) TYP 5.40(.213) TYP 3.80(.150) TYP


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    PDF FPT-8C-A01 50mil FPT-8C-A01) F08003SC-2-2 8 pin lead sop FPT-8C-A01 272 8pin fpt-8c

    M01 8-pin

    Abstract: FPT-8P-M01
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M01 EIAJ code :∗SOP008-P-0300-1 8-pin plastic SOP Lead pitch 50 mil Nominal dimensions 300 mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold


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    PDF FPT-8P-M01 OP008-P-0300-1 FPT-8P-M01) F08002S-4C-4 M01 8-pin FPT-8P-M01

    FPT-8P-M02

    Abstract: weight of SOP package
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M02 8-pin plastic SOP Lead pitch 1.27 mm Package width x package length 3.9 × 5.05 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.75 mm MAX Weight


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    PDF FPT-8P-M02 FPT-8P-M02) F08004S-c-4-7 FPT-8P-M02 weight of SOP package

    S14GM-50-225B

    Abstract: No abstract text available
    Text: : Available, : Under development Plastic SOP Nominal Dimensions mil Lead Pitch (mm) Pin Counts 8 14 16 20 24 28 32 40 44 225 300 375 1.27 450 525 600 Plastic SSOP Nominal Dimensions (mil) Lead Pitch (mm) 225 0.65 Pin Counts 8 0.50 300 0.65 0.8 0.65 375 0.8


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    PDF S8GM-50-225B-4 S14GM-50-225B, 65-225B-2 P16GM-65-225B-2 P20GR-65-225C-2 P20GM-65-300B-3 P24GS-65-300B-1 P30GS-65-300B-2 P36GM-80-300B-3 P38GS-65-300B-2 S14GM-50-225B

    TSSOP 8PIN MARK 21

    Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
    Text: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP


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    PDF SC-82AB SC-88A OT-23-3 OT-23-5 OT-23-6 OT-89-3 OT-89-5 14-Pin 10-Pin 16-Pin TSSOP 8PIN MARK 21 land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P

    M01 8-pin

    Abstract: FPT-8P-M01
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC To Top / Package Lineup / Package Index FPT-8P-M01 EIAJ code :∗SOP008-P-0300-1 8-pin plastic SOP Lead pitch 50 mil Nominal dimensions 300 mil Standard Conforms with EIAJ:TYPE II


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    PDF FPT-8P-M01 OP008-P-0300-1 FPT-8P-M01) F08002S-4C-4 M01 8-pin FPT-8P-M01

    PA-SOD-1603-D250-08/2

    Abstract: PA-SOD-1603-D250-14/2 PA-SOD-1603-D250-16/2 SOD1603-2
    Text: PA-SOD-1603-D250-xx/2 Data Sheet 8, 14 & 16 pin SO socket/8, 14 & 16 pin SO-Plugs Supported Device/Footprints Adapter Construction Using these adapters, 8, 14 and 16 pin SO packages with a body width of 3.9mm - 4.0mm and lead pitch 1.27mm can be socketed over their PCB footprints.


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    PDF PA-SOD-1603-D250-xx/2 SD-03 16SD-03 OD1603-2 PA-SOD-1603-D250-08/2 PA-SOD-1603-D250-14/2 PA-SOD-1603-D250-16/2 SOD1603-2

    Enplas OTS

    Abstract: Enplas ots-16 Enplas ots-16-1.27-03 ots1612703 236 SOD enplas ots-16 Sd pcb 16SD-03 16/Enplas ots-16-1.27-03
    Text: PA-SOD-1603-D250-xx Data Sheet 8, 14 & 16 pin SO socket/8, 14 & 16 pin SO-Plugs Supported Device/Footprints Adapter Construction Using these adapters, 8, 14 and 16 pin SO packages with a body width of 3.9mm - 4.0mm and lead pitch 1.27mm can be socketed over their PCB footprints.


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    PDF PA-SOD-1603-D250-xx SD-03 16SD-03 OD1603-2 Enplas OTS Enplas ots-16 Enplas ots-16-1.27-03 ots1612703 236 SOD enplas ots-16 Sd pcb 16/Enplas ots-16-1.27-03

    PA-SOD-2006-D310-08/2

    Abstract: PA-SOD-2006-D310-14/2 PA-SOD-2006-D310-16/2 PA-SOD-2006-D310-18/2 PA-SOD-2006-D310-20/2 SOD2006-2
    Text: PA-SOD-2006-D310-xx/2 Data Sheet 8-20 pin SO socket/8-20 pin SO-Plugs Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 4.9mm - 5.4mm and lead pitch of 1.27mm can be socketed over their PCB footprints.


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    PDF PA-SOD-2006-D310-xx/2 socket/8-20 OD2006-2 PA-SOD-2006-D310-08/2 PA-SOD-2006-D310-14/2 PA-SOD-2006-D310-16/2 PA-SOD-2006-D310-18/2 PA-SOD-2006-D310-20/2 SOD2006-2

    PA-SOD-2806-D470-14/2

    Abstract: PA-SOD-2806-D470-16/2 PA-SOD-2806-D470-18/2 PA-SOD-2806-D470-20/2 PA-SOD-2806-D470-24/2 PA-SOD-2806-D470-28/2 SOD2806-2
    Text: PA-SOD-2806-D470-xx/2 Data Sheet 8-28 pin SO socket/8-28 pin SO-Plugs Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 8.0mm - 8.5mm and lead pitch of 1.27mm can be socketed over their PCB footprints.


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    PDF PA-SOD-2806-D470-xx/2 socket/8-28 OD2806-2 PA-SOD-2806-D470-14/2 PA-SOD-2806-D470-16/2 PA-SOD-2806-D470-18/2 PA-SOD-2806-D470-20/2 PA-SOD-2806-D470-24/2 PA-SOD-2806-D470-28/2 SOD2806-2

    MM225-1A

    Abstract: SC-527-8AA sc5278
    Text: Mounting Pad Packing Magazine Name MM225-1A 8 pin SOP 225 mil 8 5 P detail of lead end 4 1 A H J E K F G I B L N C D M M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS


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    PDF MM225-1A S8GM-50-225B-4 SC-527-8AA* MM225-1A SC-527-8AA sc5278

    Untitled

    Abstract: No abstract text available
    Text: 8 PIN PLASTIC SOP 300 mil 8 5 detail of lead end P 1 4 A H F I G J S C D M N L B S K M E NOTE 1. Controlling dimention millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM


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    PDF P8GM-50-300B-4

    Untitled

    Abstract: No abstract text available
    Text: 8-PIN PLASTIC SOP 7.62 mm (300 8 5 detail of lead end P 1 4 A H F I G J S L B C D M N S K M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 6.44 +0.21 −0.1 B 1.42 MAX.


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    PDF P8GM-50-300B-6

    S8GM-50-225B-6

    Abstract: No abstract text available
    Text: 8-PIN PLASTIC SOP 5.72 mm (225 8 5 detail of lead end P 4 1 A H F I G J S B C D M L N K S M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX.


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    PDF S8GM-50-225B-6 S8GM-50-225B-6

    Untitled

    Abstract: No abstract text available
    Text: 8 PIN PLASTIC SOP 225 mil 8 5 detail of lead end P 4 1 A H F I G J S B C E D M L N K M NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX. C 1.27 (T.P.)


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    PDF S8GM-50-225B-5

    P8GM-50-300B-4

    Abstract: No abstract text available
    Text: Mounting Pad Packing Name Magazine PB-98 MM300-04A 8 pin SOP 300 mil 8 5 detail of lead end P 1 4 A H F I G J S C D M N L B S K M E NOTE 1. Controlling dimention millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


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    PDF PB-98 MM300-04A P8GM-50-300B-4 P8GM-50-300B-4

    fp-20-1.27-06

    Abstract: 20 pin zif socket 20 pin zif connector PA-SOD-2006-16 enplas Sd pcb so package 2006-XX 20sd06 sd06
    Text: PA-SOD-2006-xx Data Sheet 8-20 pin SO socket/20 pin SO receptacle SO-Plugs NOT included Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 4.9mm - 5.4mm and lead pitch of 1.27mm can be


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    PDF PA-SOD-2006-xx socket/20 PA-SOF-D250-xx PA-SOF-D310-xx OD2006 fp-20-1.27-06 20 pin zif socket 20 pin zif connector PA-SOD-2006-16 enplas Sd pcb so package 2006-XX 20sd06 sd06

    28 pin zif socket 1.27mm pitch

    Abstract: 2808 transistor transistor 2808 SOd28 D420 enplas Sd pcb FP-28-1 PA-SOD-2808-18 Enplas to
    Text: PA-SOD-2808-xx Data Sheet 8-28 pin SO socket/28 pin SO receptacle SO-Plugs NOT included Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 7.4mm - 7.9mm and lead pitch of 1.27mm can be


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    PDF PA-SOD-2808-xx socket/28 PA-SOF-D420-xx PA-SOF-D470-xx OD2808 28 pin zif socket 1.27mm pitch 2808 transistor transistor 2808 SOd28 D420 enplas Sd pcb FP-28-1 PA-SOD-2808-18 Enplas to

    PIC1670

    Abstract: vending machine pic microcontroller PIN CONFIGURATION OF PIC1670 PIC1665
    Text: MICROCHIP TECHNOLOGY INC 22E D t.lG3501 OOQMTlfl 5 • -0 & M ic r o c h ip 8 Bit Microcontroller FEATURES PIN CONFIGURATION 40 Lead Dual In Line 1024 x 13-bit Program ROM 64 x 8-bit RAM 16 special purpose registers Arithmetic Logic Unit Sophisticated interrupt structure


    OCR Scan
    PDF lG3501 PIC1670 13-bit DS30003B-11 PIC1670 DS30003B-12 vending machine pic microcontroller PIN CONFIGURATION OF PIC1670 PIC1665