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    1.2v to 24v

    Abstract: No abstract text available
    Text: TYPE: 79L09nd CHIP APPEARANCE CHIP SIZE CHIP THICKNESS 3 INPUT 1 2 3 BONDING PAD DIMENSION 0,85 x 0,85 mm 460 ± 20 m or 280 ± 20μm 92 × 92 μm 92 × 92 μm 92 × 92 μm 80 μm Al – (or Ti-Ni-Ag) 100 mm OUTPUT GROUND SCRIBE LINE WIDTH TOP METAL BACK METAL


    Original     		PDF 79L09nd 1.2v to 24v

    1.2v to 24v

    Abstract: 12v to 24v
    Text: TYPE: 79L09nd CHIP APPEARANCE CHIP SIZE CHIP THICKNESS 3 INPUT 1 2 3 BONDING PAD DIMENSION 0,85 x 0,85 mm 460 ± 20 m or 280 ± 20μm 92 × 92 μm 92 × 92 μm 92 × 92 μm 80 μm Al – (or Ti-Ni-Ag) 100 mm OUTPUT GROUND SCRIBE LINE WIDTH TOP METAL BACK METAL


    Original     		PDF 79L09nd 1.2v to 24v 12v to 24v