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    7458 IC Search Results

    7458 IC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL1G07FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    7458 IC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/3/06 A2 7458 JM 4/11/06 A3 7581 TRM 1 -30-07 A4 7915 TRM APP'D. BY B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V-0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF PR022-01. CT730056

    Untitled

    Abstract: No abstract text available
    Text: REV ECN 2/2/06 DATE A1 7458 JM 11 -6 -0 6 A2 7816 TRM APP'D. BY B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-01. CT720217

    Untitled

    Abstract: No abstract text available
    Text: DATE .025 [0.63]— L. REV ECN 2/3 /06 A1 7458 JM 4/11/06 A2 7581 TRM APP’D. BY 11— J NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-01. T730102

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/3/06 A2 7458 JM 4/11/06 A3 7581 TRM APP’D. BY B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-01. CT730031

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/3 /06 B2 7458 JM 6 -2 7 -0 6 B3 7581 TRM APP'D. BY BOTTOM SURFACE OF JACK PCB SURFACE — 1.103 [28.02] MAX.- B 020 [0.51] — .050 [1.27] (2) NOTES: .243 [6.17] 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY


    OCR Scan     		PDF PR022-01.

    Untitled

    Abstract: No abstract text available
    Text: REV ECN 2/2/06 A1 7458 JM 4/11/06 A2 7580 TRM DATE APP’D. BY B B L. J NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01.


    OCR Scan     		PDF PR022-01. SS-738822-NF CT730019

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/3/06 A2 7458 JM 4/11/06 A3 7581 TRM APP’D. BY B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-01. CT730056

    Untitled

    Abstract: No abstract text available
    Text: DATE BOTTOM SURFACE O F JACK PCB SURFACE REV ECN 2 / 2 /06 A1 7458 JM 4/11/06 A2 7581 TRM 1.103 [28.02] MAX.- APP’D. BY ( .148 [3.75] ) TO HIGHEST POINT OF BEAM B B ( .083 [2.12] ) TO HIGHEST POINT OF BEAM -.425 [10.80] MAX. BOTTOM PANEL GROUND EXISTS


    OCR Scan     		PDF CT730027

    SS-73100-073

    Abstract: No abstract text available
    Text: REV ECN 2/ 3 /06 B1 7458 JM 6 -2 7 -0 6 B2 7581 TRM 1 -8 -0 7 B3 7892 TRM DATE • BOTTOM SURFACE OF JACK PCB SURFACE APP'D. BY B B ( .083 [2.12] ) .040 [1.02] T Y P - TO HIGHEST - . 0 5 0 [1.27] (2) POINT OF BEAM -.020 [0.51] NOTES: 1. CONNECTOR MATERIALS:


    OCR Scan     		PDF PR022-01. CT730079 SS-73100-073

    PTI 30 040 pa

    Abstract: Autocad
    Text: DATE APP'D. BY REV ECN 2/2/06 A1 7458 JM 12-5-06 A2 7859 TRM B B rt\ i rt\ NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V-0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF CT720025 PTI 30 040 pa Autocad

    Untitled

    Abstract: No abstract text available
    Text: DATE BOTTOM SURFACE OF JACK PCB SURFACE REV ECN 2/2 /06 A1 7458 JM 4/11/06 A2 7581 TRM APP'D. BY .679 [17.25] MAX. — -PIN NO. 1 1» B PIN NO. 1 .425 [10.80] MAX. NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY


    OCR Scan     		PDF

    SS-73100-042

    Abstract: tolerances
    Text: DATE •BOTTOM SURFACE OF JACK PCB SURFACE REV ECN 2/3/06 B2 7458 JM 6 -2 7 -0 6 B3 7581 TRM APP'D. BY B B ( .083 [2.12] ) TO HIGHEST POINT OF BEAM .040 [1.02] TY P— .050 [1.27] (2) -.020 [0.51] NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0


    OCR Scan     		PDF PR022-01. CT730066 SS-73100-042 tolerances

    Untitled

    Abstract: No abstract text available
    Text: DATE •BOTTOM SURFACE OF JACK PCB SURFACE REV ECN 2/3/06 B1 7458 JM 6 -2 7 -0 6 B2 7581 TRM APP'D. BY B B ( .083 [2.12] ) TO HIGHEST POINT OF BEAM .040 [1.02] TY PNOTES: — .050 [1.27] (2) 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY


    OCR Scan     		PDF PR022-01. CT730060

    SS-7388H22-NF-50

    Abstract: a17458
    Text: DATE REV ECN APP’D. BY 2/3/06 A1 7458 JM 4/11/06 A2 7580 TRM B B L. J NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V-0 CONTACTS: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01.


    OCR Scan     		PDF CT730103 SS-7388H22-NF-50 a17458

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/3/06 A2 7458 JM 6 -2 7 -0 6 A3 7581 TRM 7 -1 3 -0 7 A4 814 5 TRM APP'D. BY B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-01. CT730086

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/3 /06 A2 7458 JM 4/11/06 A3 7580 TRM APP'D. BY B B -I .450 [11.43] J L NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR 022-01.


    OCR Scan     		PDF CT730121

    sn 7458

    Abstract: No abstract text available
    Text: 1 2 DATE REV ECN APP'D. BY 2/3/D6 Ell 7458 JM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94- V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE COLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR 02 2-0 1.


    OCR Scan     		PDF CT730084 sn 7458

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/3 /06 A2 7458 JM 4/11/06 A3 7580 TRM 6 -3 0 -0 9 A4 8772 TRM - 2.303 [58.50] MAX. — I f -550 [13-97] |— APP’D. BY F 4 F [ J lili III m l I L 1•i IF HyinMU [II ih i ^ I'I I’l a U4 n I i’i


    OCR Scan     		PDF CT730071

    Untitled

    Abstract: No abstract text available
    Text: DATE • BOTTOM SURFACE OF JACK PCB SURFACE -( REV ECN 2/3 /06 B1 7458 JM 6 -2 7 -0 6 B2 7581 TRM 1 -8 -0 7 B3 7892 TRM 2.406 [61.11] ) - APP'D. BY 2.329 [59.16] MAX. ( .550 [13.97] ) TYP. J ~ l J~ V - J ~ "V NlflplU pJIpIlH ÍÍIIh Hllim S B ■ Ü i - n


    OCR Scan     		PDF PR022-01. T730079

    ul41

    Abstract: a006 SS-73100-070
    Text: -3.404 [86.46] MAX. — I I .550 [13.97] TYP. DATE REV ECN 2/3/06 A2 7458 JM 4/11/06 A3 7580 TRM APP’D. BY I— I B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V-0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF CT730073 ul41 a006 SS-73100-070

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 11/3/00 BO 3903 TRM 6/27/01 B1 5104 TRM 2/3 /06 B2 7458 JM 6 -2 7 -0 6 B3 7581 TRM APP'D. BY B -.050 [1.27] 2 NOTES: -.243 [6.17] 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF PR022-01. CT730100

    Untitled

    Abstract: No abstract text available
    Text: BOTTOM SURFACE OF JACK PCB SURFACE DATE REV ECN 2/3 /06 A4 7458 JM 4/11/06 A5 7581 TRM APP'D. BY -1.229 [31.22] MAX.PIN NO. 1 ìiflÉilì 3E 3 p — A B p — I STEWART I— M -PIN NO. 1 .025 [0.63]— -1.000 [25.40]- L J 11— .425 [10.80] MAX. NOTES: 1. CONNECTOR MATERIALS:


    OCR Scan     		PDF

    SS-7368H22-NF

    Abstract: TRM PORT
    Text: DATE REV ECN 2/3/06 B2 7458 JM 4/11/06 B3 7580 TRM -1.203 [30.56] MAX.- APP’D. BY PIN NO. 1 •Al a t a A à \ \ h 4 k i flm! 1 ~ r-T STDKART B ui 10 1 B À NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF PR022-01. CT730125 SS-7368H22-NF TRM PORT

    Untitled

    Abstract: No abstract text available
    Text: DATE • BOTTOM SURFACE 0 F JACK PCB SURFACE ■1.203 [30.56] MAX.- - 1 . 0 7 4 [27.28] M A X . - REV ECN APP’D. BY 2/3 /06 A1 7458 JM 4/11/06 A2 7580 TRM PIN NO. 1 1 flmP 1 * n i iP - - L |l 7 i . 1 m 0 . 0 O o CM T=o o LO LO CM + r ° 05 ' STE\ LO


    OCR Scan     		PDF CT730103