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Catalog Datasheet	MFG & Type	PDF	Document Tags
K177-353BQ2840 Abstract: K177-NA-353 K1778 TSC209-ZP k177 TSC506-NY K200-AC-403 TSC405-ZP K177-AC-353 K200-AC-353 Text: HEATSINKS & MOUNTINGS MOUNTING HARDWARE THERMAL INTERFACE MATERIALS KOOL-PADS KA150-2AC. Provides an efficient method of mounting heatsinks on to devices such as CPUs, DIL/SMT packages and other similar devices requiring effective transfer of generated heat. Highly conductive aluminium foil with adhesive applied to both sides negates the	Original	PDF	KA150-2AC. 300mm KA150-2AC-30X30 5-100X100 2-100X100 0-100X100 5000Vrms K177-353BQ2840 K177-NA-353 K1778 TSC209-ZP k177 TSC506-NY K200-AC-403 TSC405-ZP K177-AC-353 K200-AC-353

Catalog Datasheet

MFG & Type

PDF

Document Tags

K177-353BQ2840

Abstract: K177-NA-353 K1778 TSC209-ZP k177 TSC506-NY K200-AC-403 TSC405-ZP K177-AC-353 K200-AC-353
Text: HEATSINKS & MOUNTINGS MOUNTING HARDWARE THERMAL INTERFACE MATERIALS KOOL-PADS KA150-2AC. Provides an efficient method of mounting heatsinks on to devices such as CPUs, DIL/SMT packages and other similar devices requiring effective transfer of generated heat. Highly conductive aluminium foil with adhesive applied to both sides negates the

Original

PDF

KA150-2AC. 300mm KA150-2AC-30X30 5-100X100 2-100X100 0-100X100 5000Vrms K177-353BQ2840 K177-NA-353 K1778 TSC209-ZP k177 TSC506-NY K200-AC-403 TSC405-ZP K177-AC-353 K200-AC-353