6CN3 Search Results

6CN3 Result Highlights (1)

Part	ECAD Model	Manufacturer	Description	Download	Buy
DF61656CN35FTV		Renesas Electronics Corporation	Microcontrollers with 32-bit CISC CPU for System Control Applications (Non Promotion), TFQFP, /

6CN3 Price and Stock

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XtalTQ Technology BT0503CH3I106CN30.72 TCXO 5032-6PADS 30.72MHZ CMOS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	BT0503CH3I106CN30.72		59		1	1 $8.08 10 $8.08 100 $6.0314 1000 $5.2196 10000 $5.2196	Buy Now
XtalTQ Technology BT0507BH3I106CN30.72 TCXO 7050-10PADS 30.72MHZ CMOS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	BT0507BH3I106CN30.72		50		1	1 $8.7 10 $7.513 100 $6.4942 1000 $5.62049 10000 $5.62049	Buy Now
KEMET Corporation HT06CN332KN CAP CER 3300PF 100V C0G/NP0 RAD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	HT06CN332KN	Bulk				1 - 10 - 100 - 1000 - 10000 -	Buy Now
KEMET Corporation HT06CN333FN CAP CER 0.033UF 100V C0G/NP0 RAD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	HT06CN333FN	Bulk				1 - 10 - 100 - 1000 - 10000 -	Buy Now
Avnet Americas	HT06CN333FN	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
KEMET Corporation HT06CN333JN CAP CER 0.033UF 100V C0G/NP0 RAD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	HT06CN333JN	Bulk				1 - 10 - 100 - 1000 - 10000 -	Buy Now

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6CN3 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: 8 Megabit High Speed CM OS SRAM D E N S E - P A C DPS512X 6Cn3/DPS512X 16Bn3 M IC RO SYSTEM S DESCRIPTION: The 6Cn3/DPS512X16Bn3 High Speed SRAM ''STACK7' modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC .	OCR Scan	DPS512X 16Cn3/DPS512X 16Bn3 DPS512X16Cn3/DPS512X16Bn3 50-pin 128Kx 30A097-38	PDF
Untitled Abstract: No abstract text available Text: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X 6Cn3/DPS512X 16Bn3 DESCRIPTION: The 6Cn3/DPS512X16Bn3 High Speed SRAM “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .	OCR Scan	DPS512X 16Cn3/DPS512X 16Bn3 DPS512X16Cn3/DPS512X16Bn3 50-pin -t-85 3QA097-38	PDF
Untitled Abstract: No abstract text available Text: 4 Megabit High Speed CM OS SRAM D E N S E - P A C 6Cn3/DPS256X16Bn3 MICROSYSTEMS DESCRIPTION: The 6Cn3/DPS256X16Bn3 High Speed SRAM ''STACK7' modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC .	OCR Scan	DPS256X16Cn3/DPS256X16Bn3 DPS256X16Cn3/DPS256X16Bn3 50-pin 128Kx 30A097-34	PDF
Untitled Abstract: No abstract text available Text: DENSE-PAC MICROSYSTEMS 2 Megabit High Speed CM OS SRAM 6Cn3/DPS128X16Bn3 DESCRIPTION: The D PS1 6Cn3/DPS128X16Bn3 High Speed SRAM “ ST A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers	OCR Scan	DPS128X16Cn3/DPS128X16Bn3 28X16Cn3/DPS128X16Bn3 50-pin 16Cn3/DPS128X16Bn3 30A097-32	PDF
Untitled Abstract: No abstract text available Text: DENSE-PAC MICROSYSTEMS 8 Megabit High Speed CMOS SRAM D PS512X 16C n 3/D P S512X 16B n 3 DESCRIPTIO N : The D P S 5 12 X 6Cn3/DPS512 X 16Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac M icrosystems' ceram ic Stackable Leadless Chip Carriers SLCC .	OCR Scan	DPS512X16Cn3/DPS512X16Bn3 DPS512X16Cn3/DPS512X16Bn3 50-pin DPS512X1 6Cn3/DPS512X16Bn3 275T41S	PDF
ERL+35 BN3 Abstract: No abstract text available Text: DENSE-PAC 2 Megabit High Speed CMOS SRAM 6Cn3/DPS128X16Bn3 MICROSYSTEMS DESCRIPTION: The 6Cn3/DPS128X16Bn3 High Speed SRAM "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .	OCR Scan	DPS128X16Cn3/DPS128X16Bn3 DPS128X16Cn3/DPS128X16Bn3 50-pin 6Cn3/DPS128X1 ERL+35 BN3	PDF