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Catalog Datasheet	MFG & Type	PDF	Document Tags
17PM Abstract: No abstract text available Text: PACKAGE INFORMATION BUMP CHIP FEATURES PAD PITCH: UNDER 69jmi • Bump SPEC — Bump Type: Straight Wall Type — Bump Material: Au Gold — Bump Height: 14pm ± 3nm • Bump Hardness: Below 50Hv • Bump Shear Strength: Oyer 20g • Products: (TFT IC) KS0641, KS0652, KS0654, KS0606, KS0658, KS0647, KS0655	OCR Scan	PDF	69jmi KS0641, KS0652, KS0654, KS0606, KS0658, KS0647, KS0655 KS0072, KSQ040, 17PM

Catalog Datasheet

MFG & Type

PDF

Document Tags

17PM

Abstract: No abstract text available
Text: PACKAGE INFORMATION BUMP CHIP FEATURES PAD PITCH: UNDER 69jmi • Bump SPEC — Bump Type: Straight Wall Type — Bump Material: Au Gold — Bump Height: 14pm ± 3nm • Bump Hardness: Below 50Hv • Bump Shear Strength: Oyer 20g • Products: (TFT IC) KS0641, KS0652, KS0654, KS0606, KS0658, KS0647, KS0655

OCR Scan

PDF

69jmi KS0641, KS0652, KS0654, KS0606, KS0658, KS0647, KS0655 KS0072, KSQ040, 17PM