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    BU-6474XB

    Abstract: BU-64840R3 BU-64860B3
    Text: Micro-ACE, Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		PDF 6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 BU-6474XB BU-64840R3 BU-64860B3

    STANAG 3838

    Abstract: BU-BU-64863B BU-64840R3 BU-61860B3-601
    Text: Micro-ACE, Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		PDF 6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 STANAG 3838 BU-BU-64863B BU-64840R3 BU-61860B3-601

    BU-64843B8

    Abstract: BU-64863B8-E02 BU-64860B3-E02 BU-65863B8-E02 BU-64840B3-E02 BU-64840B3 BU-64843B8-E02 BU-65864B3-E02 BU-6XXXXB3-E02 BU-65863B8-E
    Text: Micro-ACE TE and PCI Micro-ACE TE MODEL: BU-6484XB / 6486XB / 6584XB / 6586XB www.ddc-web.com This Preliminary Product Brief provides detailed functional capabilities for product currently in prototype production. These specifications are being provided to allow for electrical design,


    Original     		PDF BU-6484XB 6486XB 6584XB 6586XB 553A/B A5976 1-800-DDC-5757 BU-64843B8 BU-64863B8-E02 BU-64860B3-E02 BU-65863B8-E02 BU-64840B3-E02 BU-64840B3 BU-64843B8-E02 BU-65864B3-E02 BU-6XXXXB3-E02 BU-65863B8-E

    bu61740b

    Abstract: BU-61860B BU-BU-64863B DDC total ace 1553 chip pcb footprint BU-61740B 64K RAM BU-64863B 3E02 61840B 324 bga thermal
    Text: Micro-ACE , Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		PDF 6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 bu61740b BU-61860B BU-BU-64863B DDC total ace 1553 chip pcb footprint BU-61740B 64K RAM BU-64863B 3E02 61840B 324 bga thermal