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    64 LEAD DIP OUTLINE Search Results

    64 LEAD DIP OUTLINE Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    DF2B5M4ASL Toshiba Electronic Devices & Storage Corporation TVS Diode (ESD Protection Diode), Bidirectional, +/-3.6 V, SOD-962 (SL2) Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TCR2EF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation

    64 LEAD DIP OUTLINE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B

    Untitled

    Abstract: No abstract text available
    Text: Thin Shrink Small Outline Package TSSOP DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF AK64D600-TSSOP AK80D900-TSSOP TSSOP08) AK80D900-QVSOP TSSOP09)

    oki naming format

    Abstract: DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj
    Text: 1. PACKAGE CLASSIFICATIONS 1-5. 1 1 Package Symbols and Codes Package code The package codes given on the outline view are those specified in ED-7401-2 General Rules for Preparation of Outline Drawings if Integrated Circuits Package Name and Code) established by


    Original     		PDF ED-7401-2 oki naming format DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj

    SIP 400B

    Abstract: 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1
    Text: CHAPTER 2 THROUGH HOLE PACKAGES 2.1 LINEUP OF THROUGH HOLE PACKAGES 2.2 LIST OF THROUGH HOLE PACKAGES 1 Plastic DIP (Dual In-line Package) (2) Ceramic DIP (Dual In-line Package) (3) Plastic SIP (Single In-line Package) (4) Plastic V-DIP (Vertical Dual In-line Package)


    Original     		PDF follow100A7-1 X280RF-100A-2 X280RF-100A1-1 X280RF-100A2-1 X280RF-100A3-1 X280RF-100A4 X280RF-100A5 X364RF-100A-1 X179RP-100A X447RP-50A SIP 400B 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1

    "leadframe material" DIP

    Abstract: "leadframe material" DIP 20 K 1357 C1995 leadframe materials an-469 national
    Text: National Semiconductor Application Note 469 R James Walker October 1986 ABSTRACT New space efficient packages for integrated circuits have been developed These include the Plastic Chip Carrier P C C and Small Outline (S O ) packages Design considerations and reliability tests for the S O package were compared to the standard plastic Dual-in-Line Package (DIP)


    Original     		PDF

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


    Original     		PDF

    ZD 607

    Abstract: sot101b sot158a 0020A2
    Text: INTEGRATED CIRCUITS DATA SHEET PACKAGE INFORMATION Page Index - DIP LQFP SIL SO SSOP SQFP TAB VSO - Soldering - Package outlines Package information 1995 Sep 06 File under Integrated Circuits, IC12 Philips Semiconductors Package information


    Original     		PDF DIP16 DIP20 DIP24 DIP28 DIP40 OT97-1; OT38-1; OT146X OT314-2 ZD 607 sot101b sot158a 0020A2

    14.5M 1982

    Abstract: No abstract text available
    Text: IRG4RC10U  ‚ 9 0% 10 % ƒ VC 9 0% Fig. 14b - Switching Loss t d off 10 % IC 5% Waveforms tf tr t d( on ) t=5µ s E on E o ff E ts = ( Eon +E off ) Package Outline D-PAK Outline Dimensions are shown in millimeters (inches) 2.38 (.094) 2.19 (.086) 6.73 (.265)


    Original     		PDF IRG4RC10U 14.5M 1982

    led diode 5mm

    Abstract: No abstract text available
    Text: Package Line-up Lead pitch and Number of pins of each package are shown in the following chart. < Lead Insertion Type > Package Lead Outline pitch TO-92 1.27mm TO-220F 2.54mm SIP 2.54mm ZIP 1.50mm DIP 2.54mm SDIP 1.778mm 3 4 5 x × × × 8 9 × × × Number of Pins


    Original     		PDF O-220F 778mm OT-89 O-252 led diode 5mm

    68HC705

    Abstract: 68HC705K1CP MC68HC05SC21 68HC705J1ACP 68HC705C8ACFN Motorola 68hc705j1acp MC68HC05SC27 XC68HC705V8 68HC705P6A MC68HC05SR3D
    Text: SG165/D REV. 21 QUARTER 3,1996 68HC05 MICROCONTROLLERS All 68HC05 products have a standard operating voltage range from 3 V to 5.5 V unless noted in Comments. All 68HC05 products have a standard operating temperature range from 0 to 70C. Contact a Motorola Sales Office for availability of extended temperature versions.


    Original     		PDF SG165/D 68HC05 MC68HC05B4 MC68HC05B6 MC68HC05B8 MC68HC05B16 16-bit: 68HC705 68HC705K1CP MC68HC05SC21 68HC705J1ACP 68HC705C8ACFN Motorola 68hc705j1acp MC68HC05SC27 XC68HC705V8 68HC705P6A MC68HC05SR3D

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE LINE-UP Lead pitch and Number of pins of each package are shown in the following chart. < Lead Insertion Type > Package Outline TO-92 TO-220F SIP ZIP DIP SDIP Lead Pitch 1.27mm 1.7mm 2.54mm 2.54mm 1.50mm 2.54mm 1.778mm Number of Pins 3 x 4 x x 5 8


    Original     		PDF O-220F 778mm OT-89 O-252

    SC-88 package

    Abstract: SOT-89
    Text: Package Systems There package are classified as insertion type, surface mount type and TCP. < Number of Pins > < PKG OUTLINE > TO-92 < LEAD > SINGLE Lead Insertion Type TO-220F 3 3, 4, 5 SIP 8 ZIP 16 DIP 8, 14, 16, 18, 20, 22, 40 Dual SDIP Package 22, 24, 28, 30, 42, 56


    Original     		PDF O-220F O-252 OT-89 SC-88 35-mm 70-mm SC-88 package SOT-89

    SC-88 package

    Abstract: J-Lead, plcc
    Text: PACKAGE SYSTEMS There package are classified as insertion type, surface mount type and TCP. < LEAD > < PKG OUTLINE > TO-92 Single Type Lead Insertion Type Dual Type TO-220F Package 3, 4, 5 8 ZIP 16 DIP 8, 14, 16, 18, 20, 22, 40 22, 24, 28, 30, 42, 56 Single Type Flatlead


    Original     		PDF O-220F O-252 SC-88 OT-89 SC-88 package J-Lead, plcc

    48P4B

    Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
    Text: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P


    Original     		PDF 240K6X-A 30S1B 42S1B-A 52S1B-B 64S1B-E 124S8 135S8-F 145S8 149S8 177S8 48P4B P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A

    Untitled

    Abstract: No abstract text available
    Text: DIN Styles D & E Standard 41612 OUTLINE Style E 3 Rows of 16: 48 Positions .114 Max.— 2.90 -M Max. -c n \= L „ Dip Solder = 2 ,3 or 5 Mini Wire Wrap = 6 ,7 or 8 Contact Terminations .110 . 0 2IÜ .457 11.60 90.00 ±0.10 Max. Catalog Number 48S600319312 Shown


    OCR Scan     		PDF 48S600319312 32S-6003-1522-3 DN/41

    96P603307310

    Abstract: D 500 4456 2 96P-6033-0731-0 64S-6033
    Text: DIN Styles B & C Standard 41612 6033 Series Pin Connector OUTLINE Style B 2 Rows of 32 = 64 Positions 3.354 85.2 ' .100 2.54 1.00 •339- Max. , L 8.6 r U j .098 2.5 .039 a 1 2.54 31 X .100 2.54 .244 6.2 3.100 78.74 3.700 M a x.-94 Style Half B 2 Rows of 16 = 32 Positions


    OCR Scan     		PDF 64P603307310 48P603307310 32P603307310 30P603307310 96S603307312 64S603307312 48S603307312 32S603307312 30S603307312 DN/42 96P603307310 D 500 4456 2 96P-6033-0731-0 64S-6033

    NJU9702

    Abstract: T0-220F 5 pin lead sop
    Text: PACKAGE OUTLINE TABLE • PACKAGE OUTLINE TABLE Suffix 3 Pin TO-92 L *1 O T0-220F F O TO-252 DL O SOT-89 U MTP-5 F O — — — 5 Pin — 8 Pin — 9 Pin 14 Pin 16 Pin 18 Pin 20 Pin 22 Pin — — — — — — — — — — — -t — — — — —+


    OCR Scan     		PDF T0-220F O-252 S0T-89 100Pin NJM78L NJM79LSer NJU9702. SDMP-30) TQ-220F NJU9702 5 pin lead sop

    NJU9702

    Abstract: T0-252 T022OF dmp 30 package T0252
    Text: PACKAGE OUTLINE A TABLE PACKAGE OUTLINE TABLE Suffix 3 Pin 5 Pin — TO-92 L *1 O T0-22ÖF F O — 8 Pin — — 9 Pin - 14 Pin — 16 Pin — 18 Pin 20 Pin — 22 Pin — — — — — TO-252 DL O — — — — — — SOT-89 U O — — — — — —


    OCR Scan     		PDF T0-22Ã T0-252 S0T-89 100Pin NJH78L NJM79LSer NJU9702. SDMP-30) O-220 NJU9702 T022OF dmp 30 package T0252

    Untitled

    Abstract: No abstract text available
    Text: m -JÈr A PACKAGE OUTLINE TABLE PACKAGE OUTLINE TABLE Suffix 3 Pin 5 Pin 8 Pin 9 Pin 14 Pin 16 Pin 18 Pin 20 Pin 22 Pin TO-92 L *1 O - T0-220F F O - TO-252 DL O - - - - — - — — SOT-89 U O O — - - - - — — MTP-5 F — O — - - - — — — —


    OCR Scan     		PDF T0-220F O-252 OT-89 100Pin NJM78L NJM79LSer NJU9702. SDHP-30)

    923884-20-I

    Abstract: EDGE22 922490-16-R solder strip 922594-16-R 922490-24-I 927739-20 923881-40-R EXTRACTOR TOOLS 33970
    Text: 3M Breadboards & Test Clips • A large choice of test clips including product for DIP ICs, Shrink DIPs, SOICs, PLCCs, and LCCs • Specialized clips for testing corroded or conformai coated devices • Cable assemblies for connecting to test instrumentation


    OCR Scan     		PDF 923832-BK-B 923832-BU-B 923832-GN-B 923832-RD-B 923832-WT-B 923832-YL-B 923837-BK-B 923837-GN-B 923837-RD-B 923837-WT-B 923884-20-I EDGE22 922490-16-R solder strip 922594-16-R 922490-24-I 927739-20 923881-40-R EXTRACTOR TOOLS 33970

    MD96DX

    Abstract: YM7109 YTM401
    Text: YAMAHA'i . S í YTM4Ü1 MD96DX 9600 bps FAX MODEM LSI with HDLC OUTLINE M D96DX is a one-chip M ODEM LSI of 9600 bps, which is upper compatible with our FAX M ODEM -LSI M D96FX (YM7109) in pin assignment and software. It is also provided with H D LC function, power saving functions, simple U A RT and external clock synchro­


    OCR Scan     		PDF MD96DX D96DX D96FX YM7109) MD96DX YM7109 YTM401

    Untitled

    Abstract: No abstract text available
    Text: Y A M A H A 'L S I Y T M 411B MD9624LV FAX/DATA/VOICE MODEM LSI • OUTLINE The YTM411B is a one-chip MODEM LSI applicable to both the FAX MODEM and Data MODEM and requires low power as it can be operated with a power supply in the range: 3.3 ~ 5V. The YTM411B is an upper-level chip of VAMAHA’s FAX/DATA MODEM LSI YTM403C and has


    OCR Scan     		PDF MD9624LV YTM411B YTM403C 9600/7200/4800/2400/300bps 27ter, 2400/1200/600/300bps 22bis,

    NJU9702

    Abstract: No abstract text available
    Text: PACKAGE OUTLINE TABLE P A C K A G E OUTLINE TA BLE Suffix 3Pin 5Pin 8Pin 9Pin 14Pin - - - - - - - - o - - - o o - - - - TO -220F F SOT-89 U o o o M TP-5 F - o D /N - - SD1P L - - DM P M - - SOP G - - TO -92 D IP L*1 l6P in - - o o o o o o o o o - SIP S /L


    OCR Scan     		PDF 14Pin 16Pin 18Pin 20Pin 22Pin O-220F OT-89 28Pin 30Pin 40Pin NJU9702

    AMP D-3100

    Abstract: 96S-6033-0731-2 AMP D-3100 10 pin 30P60 30P603307310 96P603307310
    Text: DIN Styles B & C Standard 41612 6033 Series Socket Connector OUTLINE S tyle B 2 Rows of 32 = 64 Positions 3.736 949 3.346 85 .453 ^ 11.5 i LU I LU LU LU LU / i .b d . . h I h Style Half B 2 R ow s of 16 = 32 Positions Third B 2 Rows of 10 = 20 Positions


    OCR Scan     		PDF 96S-6033-0731-2 64P603307310 48P603307310 32P603307310 30P603307310 96S603307312 64S603307312 48S603307312 32S603307312 30S603307312 AMP D-3100 96S-6033-0731-2 AMP D-3100 10 pin 30P60 30P603307310 96P603307310