Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    619919886Q Search Results

    619919886Q Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    8361H

    Abstract: EME-7351 Ablestik JESD22 hitachi mold cel copper bond wire tsop package 99344
    Text: Cypress Semiconductor Reflow Qualification Report QTP# 99344 VERSION 2.0 November, 2000 235°°C Solder Reflow Profile TSOP Package Family All assembly sites for these packages CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director


    Original     		ZS444N 44-lead 619919886Q CY7C199-ZC 30C/60 CY7C1021-ZSC CY62128-ZC 8361H EME-7351 Ablestik JESD22 hitachi mold cel copper bond wire tsop package 99344 PDF