SMD W2f
Abstract: w2f smd SMD V3F W2F 07 6z smd AVX smd film capacitors CF v3f smd SM05 6LS AVX CKR08
Text: SnPb & Non-Sn Termination Availability By Product Series MLCC Ceramic Chip Family MIL, QPL MLC Family Surface Mount Series 55681 - S* 55681 - M* 55681 - N* 55681 - U* 55681 - W* MLCC MLC Family Surface Mount LD Description CDR01, CDR02, CDR03, CDR04, CDR05, CDR06,
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CDR01,
CDR02,
CDR03,
CDR04,
CDR05,
CDR06,
CDR31,
CDR32,
CDR33,
CDR34,
SMD W2f
w2f smd
SMD V3F
W2F 07
6z smd
AVX smd film capacitors CF
v3f smd
SM05
6LS AVX
CKR08
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F4005
Abstract: 03028BR F4004 03028-BR
Text: Surface Mount Multilayer Ceramic Chip Capacitors DSCC Approved 03028 BR/BX Dielectrics Overview DSCC drawing no. 03028 was developed in response to the growing need and demand within the defense and aerospace industries for EIA 0603 case size MLCCs not currently offered
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MIL-PRF-55681.
F4005
03028BR
F4004
03028-BR
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Untitled
Abstract: No abstract text available
Text: Surface Mount Multilayer Ceramic Chip Capacitors DSCC Approved 03028 BR/BX Dielectrics Overview outlined by DSCC. KEMET is approved to DSCC (Defense Supply Center, Columbus) drawing no. 03028 for EIA 0603 case size SMD MLCCs in BR and BX dielectrics. DSCC drawing no. 03028 was developed in response to the
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PDF
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MIL-PRF-55681.
MILPRF-55681.
F4004
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EIA J code marking
Abstract: No abstract text available
Text: Surface Mount Multilayer Ceramic Chip Capacitors DSCC Approved 03029 BR/BX Dielectrics Overview outlined by DSCC. KEMET is approved to DSCC (Defense Supply Center, Columbus) drawing no. 03029 for EIA 0402 case size SMD MLCCs in BR and BX dielectrics. DSCC drawing no. 03029 was developed in response to the
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PDF
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MIL-PRF-55681.
MILPRF-55681.
F4003
EIA J code marking
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MIL-PRF-55681 kemet
Abstract: 03029-BR 03029BX222 bx 222
Text: Surface Mount Multilayer Ceramic Chip Capacitors DSCC Approved 03029 BR/BX Dielectrics Overview DSCC drawing no. 03029 was developed in response to the growing need and demand within the defense and aerospace industries for EIA 0402 case size MLCCs not currently offered
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Original
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PDF
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MIL-PRF-55681.
F4003
MIL-PRF-55681 kemet
03029-BR
03029BX222
bx 222
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Untitled
Abstract: No abstract text available
Text: 10 39.37 12.70 60.96 MARK NOTES: 1. MATERIAL: HOUSING : PPS TERMINAL: P H 05P H 0R BRONZE A 2’.FINISH .F 0 - GOLD FLASH IN CONTACT AREA. 1.52um/60uin MIN. TIN IN SOLDER TAIL. BOTH OVER 0.76um / 30uin MIN. NICKEL OVERALL. 1 - 0.25um/10uin MIN. GOLD IN CONTACT AREA,
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52um/60uin
30uin
25um/10uin
52um/60uin
/30uin
38um/15uin
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