Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    56GQL Search Results

    56GQL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    UA42

    Abstract: VFBGA-48 bga rework aa56 yamaichi socket
    Text: Design Summary for 56GQL 48- and 56-pin functions MicroStar Junior TM BGA PCB Design Guidelines Package Via to Board Land Area Configuration Trace Width/Spacing Dimensions (mm [in.]) Non-Solder Mask Defined Pad MicroStar Junior Package Package ball via 0.2±0.05mm


    Original     		PDF 56GQL 56-pin 65-mm SCET004 UA42 VFBGA-48 bga rework aa56 yamaichi socket

    jesd 51-7

    Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
    Text: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs


    Original     		PDF SZZA040 54BGA 54-ball MO-205, 16-bit jesd 51-7 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000