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    56-PIN 7X7 QFN Search Results

    56-PIN 7X7 QFN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    56-PIN 7X7 QFN Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NP364

    Abstract: QFN11T032-003 QFN11T048-008 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003
    Text: QFN Quad Flat Non-leaded Packages TH Sockets - Open Top and Clamshell Types SMT Devices Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp.Range: Contact Force: 10,000MΩ min. at 100V DC 500V AC for 1 minute 30mΩ max. at 10mA/20mV max.


    Original     		PDF 10mA/20mV NP445 NP364 QFN11T040-005 QFN11T040-006 QFN11T048-005 QFN11T048-008 QFN11T048-008 A101121-001 NP364 QFN11T032-003 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003

    QFN 64 8x8 dimension

    Abstract: WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7
    Text: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF WA13062DQAET WA13041DQAET WA13028DQAET WA13082DQAET WA13088DQAET WA13024DQAET WA13063DQAET WA13046DQAET WA13083DQAET WA13084DQAET QFN 64 8x8 dimension WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7

    QFN48 5x5 package

    Abstract: No abstract text available
    Text: MLX81205/07/10/15 123456278 Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:


    Original     		PDF MLX81205/07/10/15 MLX16-FX 20DMIPS ISO/TS16949 ISO14001 11-May-2012 QFN48 5x5 package

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		PDF AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8

    TQFN 48 7X7

    Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
    Text: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2


    Original     		PDF 10x10 25x25 10K/Reel TQFN 48 7X7 QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel

    qfn 8x8 reel

    Abstract: CHL8328 56-pin 7x7 QFN chl8326 IR3536MTR i2c/IR3536
    Text: IR3536/38 CHL8326/28 Digital Multi-Phase Buck Controller FEATURES DESCRIPTION • 6-phase & 8-phase dual output PWM Controller  Phases are flexibly assigned between Loops 1 & 2  Intel VR12, AMD® 3.4MHz SVI/PVI & Memory modes  Overclocking & Gaming Mode with Vmax setting


    Original     		PDF IR3536/38 CHL8326/28 200kHz IR3536/CHL8326 IR3538/CHL8328 qfn 8x8 reel CHL8328 56-pin 7x7 QFN chl8326 IR3536MTR i2c/IR3536

    BGA 11x11 junction to board thermal resistance

    Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
    Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature


    Original     		PDF 320-ball 432-ball 27x27 31x31 35x35 40x40 45x45 BGA 11x11 junction to board thermal resistance 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20

    Untitled

    Abstract: No abstract text available
    Text: IR3536/38 CHL8326/28 Digital Multi-Phase Buck Controller FEATURES DESCRIPTION • 6-phase & 8-phase dual output PWM Controller  Phases are flexibly assigned between Loops 1 & 2  Intel VR12, AMD® 3.4MHz SVI/PVI & Memory modes  Overclocking & Gaming Mode with Vmax setting


    Original     		PDF IR3536/38 CHL8326/28 200kHz IR3538/ CHL8328 IR3538/CHL8328 IR3536/CHL8326 CHL8328

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		PDF AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    EFM32G222FX-QFP48

    Abstract: EFM32GG230FX-QFN64 EFM32ZG222FX-QFP48 EFM32ZG108 EFM32G200FX-QFN32 EFM32TG222FX-QFP48 EFR4D2090 EFM32 EFM32ZG108FX-QFN24 EFM32ZG
    Text: life y ge P ol lon % 3 ro ery r batt og Ene y Friendl y rg v e n Te c h n 32-bit ARM Cortex-M0 and Cortex-M3 microcontrollers for: • Energy, gas, water and smart metering • Alarm and security systems • Health and fitness applications • Industrial and home automation


    Original     		PDF 32-bit EFM32 1L-EFM32 EFM32G222FX-QFP48 EFM32GG230FX-QFN64 EFM32ZG222FX-QFP48 EFM32ZG108 EFM32G200FX-QFN32 EFM32TG222FX-QFP48 EFR4D2090 EFM32ZG108FX-QFN24 EFM32ZG

    Single Chip dvb-s2

    Abstract: DVB-S2 DVB-S2 front end si2167 DVB-S2 Tuner demodulator Si2170 QFN-48 thermal resistance tuner dvb-c hybrid DVB-S FEC demodulator qpsk demodulator 13 MHz
    Text: Si2167 Combo DVB-T/C/S/S2 Digital TV Demodulator Description Features The Si2167 integrates DVB-T, DVB-C, DVB-S, and DVB-S2 digital demodulators into a single CMOS chip for terrestrial, cable, and satellite TV standards. Leveraging Silicon Labs' proven digital demodulation architecture, the


    Original     		PDF Si2167 Si2167 Si2170/73 Si2161/65 QFN-48 Si2167-A10-FM QFN-48. Single Chip dvb-s2 DVB-S2 DVB-S2 front end DVB-S2 Tuner demodulator Si2170 QFN-48 thermal resistance tuner dvb-c hybrid DVB-S FEC demodulator qpsk demodulator 13 MHz

    CHiL Semiconductor

    Abstract: No abstract text available
    Text: CHL8326/8 DIGITAL MULTI-PHASE GPU BUCK CONTROLLER PRODUCT BRIEF PRELIMINARY 46 45 44 43 42 41 40 39 38 37 36 RCSP_L2 RCSM 2 35 RCSM_L2 VCC 3 34 VCC CFP1 / VFIXEN_PSI2 4 33 VSEN_L2 CHiL Adaptive Transient Algorithm ATA on both loops minimizes output bulk capacitors and system cost


    Original     		PDF CHL8326/8 CHL832 CHL8326 CHL8328 CHL8326-00CRT CHL8326-xxCRT CHL8328-00CRT CHL8328-xxCRT PB0011 CHiL Semiconductor

    LFXP2-8E

    Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
    Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.


    Original     		PDF 64-ball 144-ball LFXP2-8E LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132

    DUAL ROW QFN leadframe

    Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
    Text: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the


    Original     		PDF

    DVB-S2

    Abstract: SI2169-A20
    Text: Si2169-A20 Combo DVB-T2/T/C/S/S2 Digital TV Demodulator Features The Si2169 integrates DVB-T2, DVB-T, DVB-C, DVB-S, and DVB-S2 digital demodulators into a single advanced CMOS technology mixed-signal die for next generation terrestrial, cable, and satellite TV standards. Leveraging Silicon Labs'


    Original     		PDF Si2169-A20 Si2169 Si2169 Si2176/56/46 Si2169-A20-GM/R QFN-48 DVB-S2

    XP1080-QU-0NP0

    Abstract: No abstract text available
    Text: 37.0-40.0 GHz GaAs Power Amplifier QFN, 7x7mm P1080-QU December 2009 - Rev 10-Dec-09 Features Linear Power Amplifier On-Chip Power Detector Output Power Adjust 25.0 dB Small Signal Gain +27.0 dBm P1dB Compression Point +38.0 dBm OIP3 General Description Absolute Maximum Ratings1,2


    Original     		PDF 10-Dec-09 P1080-QU XP1080-QU XP1080-QU-0NP0

    P1080-QU

    Abstract: XB1014-QT PDC 14
    Text: 37.0-40.0 GHz GaAs Power Amplifier QFN, 7x7mm P1080-QU January 2010 - Rev 22-Jan-10 Features Linear Power Amplifier On-Chip Power Detector Output Power Adjust 25.0 dB Small Signal Gain +27.0 dBm P1dB Compression Point +38.0 dBm OIP3 General Description Absolute Maximum Ratings1,2


    Original     		PDF P1080-QU 22-Jan-10 XP1080-QU P1080-QU XB1014-QT PDC 14

    P1080-QU

    Abstract: xp1080 329mm
    Text: 37.0-40.0 GHz GaAs Power Amplifier QFN, 7x7mm P1080-QU January 2011 - Rev 10-Jan-11 Features Linear Power Amplifier On-Chip Power Detector Output Power Adjust 25.0 dB Small Signal Gain +27.0 dBm P1dB Compression Point +38.0 dBm OIP3 General Description Absolute Maximum Ratings1,2


    Original     		PDF 10-Jan-11 P1080-QU XP1080-QU P1080-QU xp1080 329mm

    si2168

    Abstract: si217x si2166 si2169 Si2167-B Single Chip dvb-s2 Si2166B DVB-S SI21-6 Si2166-B
    Text: Si2167-B20 Combo DVB-T/C/S/S2 Digital TV Demodulator Description Features The Si2167-B20 integrates DVB-T, DVB-C, DVB-S, DVB-S2 AMC-compliant , and DSS digital demodulators into a single CMOS chip for terrestrial, cable, and satellite TV standards. Leveraging Silicon Labs' proven digital


    Original     		PDF Si2167-B20 Si217x, Si2167-A10 Si2169/68 Si2167B QFN-48 Si2167-B20-GM si2168 si217x si2166 si2169 Si2167-B Single Chip dvb-s2 Si2166B DVB-S SI21-6 Si2166-B

    nec 44 pin LQFP

    Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
    Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 nec 44 pin LQFP BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		PDF Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"

    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF