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    56 QFN 7X7 Search Results

    56 QFN 7X7 Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    EL9112ILZ Renesas Electronics Corporation Triple Differential Receiver/Equalizer, QFN, /Tube Visit Renesas Electronics Corporation
    ISL59445IRZ Renesas Electronics Corporation 1GHz Triple Multiplexing Amplifiers, QFN, /Tube Visit Renesas Electronics Corporation

    56 QFN 7X7 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    QFN 7X7

    Abstract: qfn 8x8 56 qfn 7x7 QFN 7X7 package QFN-4x4 QFN 56 7x7
    Text: Package Diagram QFN 20-Lead QFN 4x4 mm LF20 51-85163-* 48-Lead QFN (7x7 mm) LF48 51-85152-* 1 Package Diagram 56-Lead QFN (8x8 mm) 51-85144-*A 2


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    PDF 20-Lead 48-Lead 56-Lead QFN 7X7 qfn 8x8 56 qfn 7x7 QFN 7X7 package QFN-4x4 QFN 56 7x7

    Untitled

    Abstract: No abstract text available
    Text: 19-0526; Rev 0; 5/06 KIT ATION EVALU E L B AVAILA 10-Bit, 7.5Msps, Full-Duplex Analog Front-End MAX19710ETN+ 56 Thin QFN-EP* T5677-1 *All devices are specified over the -40°C to +85°C operating range. *EP = Exposed paddle. +Denotes lead-free package. DA4


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    PDF 10-Bit, 620kHz 400mV 10-bit MAX19710

    USB3250-ABZJ

    Abstract: 875u abzj
    Text: GT3200 64-PIN TQFP PACKAGES USB3250 (56-PIN QFN PACKAGE) USB2.0 PHY IC PRODUCT FEATURES • ■ ■ ■ ■ ■ ■ ■ Datasheet USB-IF "Hi-Speed" certified to USB2.0 electrical specification Interface compliant with the UTMI specification (60MHz 8-bit unidirectional interface or 30MHz 16-bit


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    PDF GT3200 64-PIN USB3250 56-PIN 60MHz 30MHz 16-bit 480Mbps 12Mbps 12MHz USB3250-ABZJ 875u abzj

    ic 812

    Abstract: USB3250-ABZJ 56-PIN CRC-16 GT3200 GT3200-JD GT3200-JN USB3250
    Text: GT3200 64-PIN TQFP PACKAGES USB3250 (56-PIN QFN PACKAGE) USB2.0 PHY IC PRODUCT FEATURES • ■ ■ ■ ■ ■ ■ ■ Datasheet USB-IF "Hi-Speed" certified to USB2.0 electrical specification Interface compliant with the UTMI specification (60MHz 8-bit unidirectional interface or 30MHz 16-bit


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    PDF GT3200 64-PIN USB3250 56-PIN 60MHz 30MHz 16-bit 480Mbps 12Mbps 12MHz ic 812 USB3250-ABZJ CRC-16 GT3200 GT3200-JD GT3200-JN USB3250

    USB3250-ABZJ

    Abstract: USB3250 GT3200-JV MO-220 8x8 68 56-PIN CRC-16 GT3200 GT3200-JD GT3200-JN debounce IC
    Text: GT3200 64-PIN TQFP PACKAGES USB3250 (56-PIN QFN PACKAGE) USB2.0 PHY IC PRODUCT FEATURES „ „ „ „ „ „ „ „ Datasheet USB-IF "Hi-Speed" certified to USB2.0 electrical specification Interface compliant with the UTMI specification (60MHz 8-bit unidirectional interface or 30MHz 16-bit


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    PDF GT3200 64-PIN USB3250 56-PIN 60MHz 30MHz 16-bit 480Mbps 12Mbps 12MHz USB3250-ABZJ USB3250 GT3200-JV MO-220 8x8 68 CRC-16 GT3200 GT3200-JD GT3200-JN debounce IC

    Untitled

    Abstract: No abstract text available
    Text: C O N F I D E N T I A L LX24232 TM 32 CHANNEL LED BACKLIGHT CONTROLLER D ATASHEET DESCRIPTION KEY FEATURES Plastic MLPQ 8 x 8mm QFN 56 pin RoHS Compliant/Pb free MSL1 LX24232ILQ -40° to +85°C Note: Available in Tape & Reel. Append the letters ”TR” to part number. LX24232ILQ-TR


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    PDF LX24232 LX24232ILQ LX24232ILQ-TR) LX24232

    qfn 8x8 reel

    Abstract: CHL8328 56-pin 7x7 QFN chl8326 IR3536MTR i2c/IR3536
    Text: IR3536/38 CHL8326/28 Digital Multi-Phase Buck Controller FEATURES DESCRIPTION • 6-phase & 8-phase dual output PWM Controller  Phases are flexibly assigned between Loops 1 & 2  Intel VR12, AMD® 3.4MHz SVI/PVI & Memory modes  Overclocking & Gaming Mode with Vmax setting


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    PDF IR3536/38 CHL8326/28 200kHz IR3536/CHL8326 IR3538/CHL8328 qfn 8x8 reel CHL8328 56-pin 7x7 QFN chl8326 IR3536MTR i2c/IR3536

    Untitled

    Abstract: No abstract text available
    Text: IR3536/38 CHL8326/28 Digital Multi-Phase Buck Controller FEATURES DESCRIPTION • 6-phase & 8-phase dual output PWM Controller  Phases are flexibly assigned between Loops 1 & 2  Intel VR12, AMD® 3.4MHz SVI/PVI & Memory modes  Overclocking & Gaming Mode with Vmax setting


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    PDF IR3536/38 CHL8326/28 200kHz IR3538/ CHL8328 IR3538/CHL8328 IR3536/CHL8326 CHL8328

    XP1080-QU-0NP0

    Abstract: No abstract text available
    Text: 37.0-40.0 GHz GaAs Power Amplifier QFN, 7x7mm P1080-QU December 2009 - Rev 10-Dec-09 Features Linear Power Amplifier On-Chip Power Detector Output Power Adjust 25.0 dB Small Signal Gain +27.0 dBm P1dB Compression Point +38.0 dBm OIP3 General Description Absolute Maximum Ratings1,2


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    PDF 10-Dec-09 P1080-QU XP1080-QU XP1080-QU-0NP0

    P1080-QU

    Abstract: XB1014-QT PDC 14
    Text: 37.0-40.0 GHz GaAs Power Amplifier QFN, 7x7mm P1080-QU January 2010 - Rev 22-Jan-10 Features Linear Power Amplifier On-Chip Power Detector Output Power Adjust 25.0 dB Small Signal Gain +27.0 dBm P1dB Compression Point +38.0 dBm OIP3 General Description Absolute Maximum Ratings1,2


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    PDF P1080-QU 22-Jan-10 XP1080-QU P1080-QU XB1014-QT PDC 14

    P1080-QU

    Abstract: xp1080 329mm
    Text: 37.0-40.0 GHz GaAs Power Amplifier QFN, 7x7mm P1080-QU January 2011 - Rev 10-Jan-11 Features Linear Power Amplifier On-Chip Power Detector Output Power Adjust 25.0 dB Small Signal Gain +27.0 dBm P1dB Compression Point +38.0 dBm OIP3 General Description Absolute Maximum Ratings1,2


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    PDF 10-Jan-11 P1080-QU XP1080-QU P1080-QU xp1080 329mm

    QFN 56 7x7 footprint

    Abstract: QFN 56 7x7 0.5 TEXTOOL 56 qfn 7x7
    Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA


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    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


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    PDF AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220

    DUAL ROW QFN leadframe

    Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
    Text: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the


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    PDF

    CHiL Semiconductor

    Abstract: No abstract text available
    Text: CHL8326/8 DIGITAL MULTI-PHASE GPU BUCK CONTROLLER PRODUCT BRIEF PRELIMINARY 46 45 44 43 42 41 40 39 38 37 36 RCSP_L2 RCSM 2 35 RCSM_L2 VCC 3 34 VCC CFP1 / VFIXEN_PSI2 4 33 VSEN_L2 CHiL Adaptive Transient Algorithm ATA on both loops minimizes output bulk capacitors and system cost


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    PDF CHL8326/8 CHL832 CHL8326 CHL8328 CHL8326-00CRT CHL8326-xxCRT CHL8328-00CRT CHL8328-xxCRT PB0011 CHiL Semiconductor

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


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    PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    ir3567

    Abstract: IR3567A IR3567AM IR3567AMTRPBF programmable digital pwm I2C multiphase AMD Voltage regulation design PWM 3V 5V NOTEBOOK smale
    Text: IR3567A Dual Output Digital Multi-Phase Controller FEATURES DESCRIPTION • Dual output 6+2 phase PWM Controller  Easiest layout and fewest pins in the industry  Fully supports AMD SVI1 & SVI2 with dual OCP and Intel® VR12 & VR12.5  Overclocking & Gaming Mode


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    PDF IR3567A 200kHz CHL8515 IR3567A CHL8505 ir3567 IR3567AM IR3567AMTRPBF programmable digital pwm I2C multiphase AMD Voltage regulation design PWM 3V 5V NOTEBOOK smale

    Untitled

    Abstract: No abstract text available
    Text: IR3567A Dual Output Digital Multi-Phase Controller FEATURES DESCRIPTION • Dual output 6+2 phase PWM Controller  Easiest layout and fewest pins in the industry  Fully supports AMD SVI1 & SVI2 with dual OCP and Intel® VR12 & VR12.5  Overclocking & Gaming Mode


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    PDF IR3567A 200kHz CHL8515 IR3567A CHL8505

    TQFN 48 7X7

    Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
    Text: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2


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    PDF 10x10 25x25 10K/Reel TQFN 48 7X7 QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel

    IR3567B

    Abstract: No abstract text available
    Text: Dual Output Digital Multi-Phase Controller FEATURES IR3567B DESCRIPTION • Dual output 6+2 phase PWM Controller The IR3567B is a dual-loop digital multi-phase buck controller designed for CPU voltage regulation and is fully compliant with AMD SVI1 & SVI2 and Intel


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    PDF IR3567B IR3567B 200kHz

    wl1273

    Abstract: nl5500 GPS5300 WL1273 datasheet TWL4030 bl6450 TI bl6450 ti nl5500 AIC3106 BQ27540
    Text: Analog products for handsets Audio power amps Class-D TPA2010D1 TPA2012D2 TPA2013D1 TPA2016D2 TPA2035D1 TPA2050D4 TPA2100P1 TPS61050 TPS61052 TPS61054 2.5W, mono, 9 WCSP 2.1W, stereo, 16 WCSP 2.7W, mono, boost converter,16 WCSP 1.7W, stereo, AGC, 16 WCSP


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    PDF TPA2010D1 TPA2012D2 TPA2013D1 TPA2016D2 TPA2035D1 TPA2050D4 TPA2100P1 TPS61050 TPS61052 TPS61054 wl1273 nl5500 GPS5300 WL1273 datasheet TWL4030 bl6450 TI bl6450 ti nl5500 AIC3106 BQ27540

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses


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    IR3567B

    Abstract: IR3567 intel VR12 IR3567BM AMD Voltage regulation design CHL8515 AMD SVI2 qfn 3 x 3 TRAY intel VR12.5 VR12.5
    Text: FINAL Dual Output Digital Multi-Phase Controller FEATURES IR3567B DESCRIPTION • Dual output 6+2 phase PWM Controller The IR3567B is a dual-loop digital multi-phase buck controller designed for CPU voltage regulation and is fully compliant with AMD SVI1 & SVI2 and Intel


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    PDF IR3567B 200kHz CHL8515 IR3567B IR3567 intel VR12 IR3567BM AMD Voltage regulation design AMD SVI2 qfn 3 x 3 TRAY intel VR12.5 VR12.5

    FTDI Devices T&R Dimensions

    Abstract: FT232R LQFP Package tray SSOP-28 FTDI FT232RL
    Text: Future Technology Devices International Ltd. Application Note AN_116 FTDI Devices T&R Dimensions Document Reference No.: FT_000154 Version 1.5 Issue Date: 2012-12-10 This document provides information on the tape and reel dimensions for FT232BL, FT245BL, FT232BQ,


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    PDF FT232BL, FT245BL, FT232BQ, FT245BQ, FT232RL, FT245RL, FT232RQ, FT245RQ, FT2232D, FT2232HL, FTDI Devices T&R Dimensions FT232R LQFP Package tray SSOP-28 FTDI FT232RL