Untitled
Abstract: No abstract text available
Text: MEMORY MODULE SRAM 512Kx40-SOP Static Ram MODULE 3DSR20M40VS6507 20 Mbit SRAM organized as 512Kx40, based on 256Kx16 Pin Assignment Top View SOP 84 (Pitch : 0.508 mm) Features - Fast Access Time : 12ns. - Power Supply 3.3V - Radiation Characteristics: Total Dose: 100Krad(Si)
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512Kx40-SOP
3DSR20M40VS6507
512Kx40,
256Kx16
100Krad
110MeV
100nF
MMXX00000000XXX
3DFP-0507-REV
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Untitled
Abstract: No abstract text available
Text: MEMORY MODULE SRAM 512Kx40-SOP Static Ram MODULE 3DSR20M40VS6507 20 Mbit SRAM organized as 512Kx40, based on 256Kx16 Pin Assignment Top View SOP 84 (Pitch : 0.508 mm) Features - Fast Access Time : 12ns. - Power Supply 3.3V - Radiation Characteristics: Total Dose: 100Krad(Si)
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512Kx40-SOP
3DSR20M40VS6507
512Kx40,
256Kx16
100Krad
110MeV
100nF
MMXX00000000XXX
3DFP-0507-REV
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512Kx48
Abstract: No abstract text available
Text: WS512K48-XG4WX HI-RELIABILITY PRODUCT 512Kx48 SRAM MODULE ADVANCED* FEATURES • 2V Data Retention Devices Available WS512K48L-XXX Low Power Version ■ Access Times 17, 20, 25, 35ns ■ Packaging: • 116 Lead, 40.0mm Hermetic CQFP (Package 504) ■ TTL Compatible Inputs and Outputs
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WS512K48-XG4WX
512Kx48
WS512K48L-XXX
WS512K48-XG4WX
512K48
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w90n740cdg
Abstract: driver circuit for irs 2110 tms 3874 W90N740 w90n740cd 30B4 diode aic 3860 alps 502C MII 75-12 A3 SCC16
Text: W90N740CD/W90N740CDG DATA SHEET WINBOND 32-BIT ARM7TDMI-BASED MICRO-CONTROLLER The information described in this document is the exclusive intellectual property of Winbond Electronics Corporation and shall not be reproduced without permission from Winbond.
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W90N740CD/W90N740CDG
32-BIT
W90N740-based
w90n740cdg
driver circuit for irs 2110
tms 3874
W90N740
w90n740cd
30B4 diode
aic 3860
alps 502C
MII 75-12 A3
SCC16
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uses of water level controller using timer 555 ic
Abstract: ha 13108 pal cvbs frame synchronizer x86 series sparkle 7404n STPCC0166BTC3 stpcc0166 60800 91211
Text: STPC CONSUMER PC Compatible Embeded Microprocessor PRELIMINARY DATA • POWERFUL X86 PROCESSOR ■ 64-BIT BUS ARCHITECTURE ■ 64-BIT DRAM CONTROLLER ■ SVGA GRAPHICS CONTROLLER ■ UMA ARCHITECTURE ■ VIDEO SCALER ■ DIGITAL PAL/NTSC ENCODER ■ VIDEO INPUT PORT
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64-BIT
135MHz
PBGA388
uses of water level controller using timer 555 ic
ha 13108
pal cvbs frame synchronizer
x86 series
sparkle
7404n
STPCC0166BTC3
stpcc0166
60800
91211
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crt 3BP1
Abstract: ali 3328 8mx32 simm 72 pin water level controller using timer 555 131-8D PCIM 176 display si 7200 gc 4Mx4 dram simm bitblt s3 common cathode 14-segment display driver
Text: STPC Client Programming Manual Issue 2.2 August 28, 2000 STMicroelectronics 1/446 Information provided is believed to be accurate and reliable. However, ST Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringements of patents or other
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IS61WV5128EDBLL
Abstract: is61wv5128
Text: IS61WV5128EDBLL IS64WV5128EDBLL 512K x 8 HIGH SPEED ASYNCHRONOUS CMOS STATIC RAM WITH ECC NOVEMBER 2011 DESCRIPTION The ISSI IS61/64WV5128EDBLL is a high-speed, FEATURES • High-speed access time: 8, 10 ns • Low Active Power: 85 mW typical • Low Standby Power: 7 mW (typical)
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IS61WV5128EDBLL
IS64WV5128EDBLL
304-bit
IS61/64WV5128EDBLL
MS-027.
MO-207
is61wv5128
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images of pin configuration of IC 74138
Abstract: t5 94v-0 tv philips pin out diagram of 74138 ic IC 3-8 decoder 74138 pin diagram 3-8 decoder 74138 pin diagram W99702 irs12 microcontroller ic 74148 SmartCard Writer 74148 IC datasheet
Text: W90P710CD/W90P710CDG 32-BIT ARM7TDMI-BASED MCU W90P710CD/W90P710CDG 16/32-bit ARM microcontroller Product Data Sheet -1- Publication Release Date: September 19, 2006 Revision B2 W90P710CD/W90P710CDG Revision History REVISION DATE COMMENTS A 2005/12/02 Draft
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W90P710CD/W90P710CDG
32-BIT
16/32-bit
S21-62365999
images of pin configuration of IC 74138
t5 94v-0 tv philips
pin out diagram of 74138 ic
IC 3-8 decoder 74138 pin diagram
3-8 decoder 74138 pin diagram
W99702
irs12 microcontroller
ic 74148
SmartCard Writer
74148 IC datasheet
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Untitled
Abstract: No abstract text available
Text: a WHITE /MICROELECTRONICS 512Kx48SRAM MODULE WS512K48-XG4WX ADVANCED* FEATURES • ■ ■ ■ A ccess Tim es 17, 20, 25, 35ns ■ 2V D ata R etention Device Packaging: ■ TTL C om p atible Inputs and O utputs • 116 Lead, 40.0m m H e rm e tic CQFP Package 504
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WS512K48-XG4WX
512Kx48SRAM
S512K
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Untitled
Abstract: No abstract text available
Text: SAMSUNG ELECTRONICS INC L7E D • 7^4142 KMM540512CM DD1 S D 7 0 ‘I b i DRAM MODULES 512Kx40 DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • Performance range: The Samsung KMM540512CM isa512Kbitsx40 Dynamic RAM high density memory module. The Samsung
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KMM540512CM
512Kx40
KMM540512CM
isa512Kbitsx40
256Kx4
20-pin
72-pin
KMM540512CM-6
KMM540512CM-7
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Untitled
Abstract: No abstract text available
Text: a WHITE /MICROELECTRONICS 512Kx48 SRAM MODULE WS512K48-XG4WX ADVANCED* FEATURES • A c c ess T im e s 17, 20, 25, 35ns ■ 2 V D ata R e te n tio n D evice ■ Packaging: ■ T T L C o m p a tib le In p uts and O u tp uts • 116 Lead, 4 0.0m m H e rm e tic CQFP Package 504
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WS512K48-XG4WX
512Kx48
512K48
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Untitled
Abstract: No abstract text available
Text: WS512K48-XG4WX M/HITE /M ICROELECTRONICS 512Kx48 SRAM MODULE ADVANCED* FEATURES • Acce ss Tim e s 17, 20, 25, 35ns ■ 2V Data R eten tio n Device ■ Packaging: ■ TTL C o m p a tib le Inputs and Outp u ts • 116 Lead, 4 0 .0 m m H e rm e tic CQFP Package 504
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WS512K48-XG4WX
512Kx48
512K48
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Untitled
Abstract: No abstract text available
Text: a M/HITE /MICROELECTRONICS 512Kx48 SRAM MODULE WS512K48-XG4WX ADVANCED* FEATURES • A c c e s s T im e s 17, 20, 25, 35ns ■ 2V Data R etention D evice ■ Packaging: ■ T T L Com patible Inputs and Outputs • 116 Lead, 40.0m m H erm etic CQFP Packag e 504
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512Kx48
WS512K48-XG4WX
512K48
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512kx4
Abstract: EDI8M4512C A16-A18
Text: EDI8M4512C m o \ The future. . . 45/55/70 _ Module Ä ¥ Ä lN l I OINUFÚ^MñTDÚlN] 512Kx4 SRAM CMOS, High Speed Module Features The EDI8M4512C is a Two Megabit 512Kx4-bit High Speed Static RAM Module with four bi-directionai input/output lines. The module is constructed
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EDI8M4512C
512Kx4
EDI8M4512C
512Kx4-bit)
64Kx4
100modules
MIL-STD-883
A0-A18
A16-A18
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512kx4
Abstract: No abstract text available
Text: EDI8M4512C m o \ 45/55/70 Module The future. . . 512Kx4 SRAM CMOS, High Speed Module Features The EDI8M4512C is a Two Megabit 512Kx4-bit High Speed Static RAM Module with four bi-directionai input/output lines. The module is constructed of eight 64Kx4 Static RAMs in leadless chip carriers
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512Kx4
EDI8M4512C
512Kx4-bit)
64Kx4
MIL-STD-883
EDI8M4512C
A0-A18
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Untitled
Abstract: No abstract text available
Text: H Y 5 1 V 4 4 0 3 B • • H Y U N D A I S e r ie s IM x 4-bit CMOS DRAM with4CAS PRELIMINARY DESCRIPTION The HY51V4403B is the new generation and fast dynamic RAM organized 1,048,576 x 4-bit. The HY51V4403B has four CASs CAS0-3 which control corresponding data I/O port in conjunction with OE(eg. CASO controls DQO,
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HY51V4403B
050f1
1AC1S-00-MAY94
HY51V4403BJ
HY51V4403BU
HYS1V4403BSU
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Untitled
Abstract: No abstract text available
Text: •HYUNDAI SEMICONDUCTOR H Y 5 1 4 4 1 0 A S e r ie s 1M x 4-bit CMOS DRAM with Write-Per-Bit DESCRIPTION The HY514410A is the new generation and fast dynamic RAM organized 1,048,576 x 4-bit with function of Write-Per-Bit. The HY514410A utilizes Hyundai's CMOS silicon gate process technology as well as advanced
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HY514410A
8-10-A
4b750fl
000147b
HY514410AJ
HY514410AU
HY514410AT
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Untitled
Abstract: No abstract text available
Text: » « H Y U N D A I e r ie s 1M x 4H_bŸjt 5C1M40 S4 0D R3 ABM Sw ,th 4C A S PRELIMINARY DESCRIPTION The HY514403B is the new generation and fast dynamic RAM organized 1,048,576 x 4-bit. The HY514403B has four CASs CAS0-3 which control corresponding data I/O port in conjunction with OE(eg. CSSO controls DQO,
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5C1M40
HY514403B
1AC15-00-MAY94
4b750fi6
HY514403BJ
HY514403BU
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Untitled
Abstract: No abstract text available
Text: HY51V4403B Series “H Y U N D A I 1M x 4-bit CMOS DRAM with 4CÄS DESCRIPTION The HY51V4403B is the new generation and fast dynamic RAM organized 1,048,576x4-bit. The HY51V4403B has four ¿ASs CAS0-3 w hich control corresponding data I/O port in conjunction with OE(eg.CASO controls DQO,
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HY51V4403B
576x4-bit.
HY51V4403B
1AC16-10-MAY95
HY51V4403BJ
HY51V4403BLJ
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Untitled
Abstract: No abstract text available
Text: HY51V17400A Series •HYUNDAI 4M X 4-bit CMOS DRAM DESCRIPTION The HY51V17400A is the new generation and fast dynamic RAM organized 4,194,304 x 4-bit. The HY51V17400A utilizes Hyundai's CMOS silicon gate process technology as well as advanced circuit techniques to provide wide
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HY51V17400A
HY51V17400A
1AD35-00-MAY95
HY51V17400AJ
HY51V17400ASLJ
HY51V17400AT
HY51V17400ASLT
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Untitled
Abstract: No abstract text available
Text: 1,048,576 W O R D X 4 BIT D YN A M IC RAM * This is advanced information and specifica tions are subject to change without notice. DESCRIPTION The TC514410AP/AJ/ASJ/AZ is the new generation dynamic RAM organized 1,048,576 words by 4 bits. The TC514410AP/AJ/ASJ/AZ utilizes TOSHIBA’S CMOS Silicon gate process technology as well as
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TC514410AP/AJ/ASJ/AZ
350mil)
TC51441OAP/AJ/ASJ/AZ-60
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TC51440ASJ
Abstract: No abstract text available
Text: TOSHIBA TC514410ASJ-60/70/80 1,048,576 WORD X 4 BIT DYNAMIC RAM DESCRIPTION The TC514410ASJ is the new generation dynamic RAM organized 1,048,576 word by 4 bit. The TC514410ASJ utilizes Toshiba’s CMOS silicon gate process technology as well as advanced circuit techniques
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TC514410ASJ-60/70/80
TC514410ASJ
300mil)
TC5144100/
512KX4
TC51440ASJ
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Untitled
Abstract: No abstract text available
Text: TOSHIBA TC51V4400ASJL/AFTL80 1,048,576 WORD X 4 BIT DYNAMIC RAM DESCRIPTION The TC51V 4400ASJL/AFTL is the new generation dynam ic RAM organized 1,048,576 w ord by 4 bit. The TC51V 4400A SJL/AFTL utilizes T oshiba's CM OS silicon gate process technology as w ell as advanced
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TC51V4400ASJL/AFTL80
TC51V
4400ASJL/AFTL
TC51V4400ASJL/AFTL
TC51V4400/
512KX4
QQE542fl
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Untitled
Abstract: No abstract text available
Text: KH ED/8L322S6V 25SKx32 SRAM ELECTRONIC DESIGNS NC. 256KX32,13V, StaticRAM Features The EDI8L32256V is a high speed, 3.3 volt, 8 megabit SRAM. The device is available with access times of 12,15, 256Kx32 bit C M O S Static 17 and 20ns, allowing the creation of a no wait state DSP
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ED/8L322S6V
25SKx32
256KX32
21060L
21062L
TMS320LC31
MO-47AE
EDI8L32256V
EDI8L32256V20AC
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