5060 PLCC Search Results

5060 PLCC Result Highlights (5)

Part	Manufacturer	Description
TN80C186XL-12	Rochester Electronics LLC	Rochester Manufactured 80C186, Microprocessor, 68 PLCC Package, Industrial Temp spec.
N80C152JC-1-G	Rochester Electronics LLC	Rochester Manufactured 80C152, 8 bit Microcontroller, 68 PLCC Package, Commercial Temp spec.
EN80C186XL-12	Rochester Electronics LLC	Rochester Manufactured 80C186XL, Microprocessor, 68 PLCC Package, Industrial Temp spec.
IN80C188-16-G	Rochester Electronics LLC	Rochester Manufactured 80C188, Microprocessor, 68 PLCC Package, Industrial Temp spec.
EN80C196KC20	Rochester Electronics LLC	Rochester Manufactured 80C196KC, Microprocessor, 68 PLCC Package, Industrial Temp spec.

5060 PLCC Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
CLCC 84 Abstract: plcc20 socket HQFP-208 HW-137-DIP8 plcc 68 prom universal programmer XC9500 HW-130 XC1700 HW-133-PG144 Text:  November 12, 1997 Version 1.2 HW-130 Programmer 9* HW-130 Programmer Device and Package Support Programming Socket Adapters • XC1700 Serial PROMs • XC9500 CPLDs • Supports all Xilinx package types • Programmer Accessories Supports all package styles: PLCC, PQFP, TQFP,	Original	HW-130 XC1700 XC9500 HW-133-PC44 HW-133-PQ44 HW-133-VQ44 HW-133-PC68 HW-133-PC84 HW-133-PQ100 CLCC 84 plcc20 socket HQFP-208 HW-137-DIP8 plcc 68 prom universal programmer HW-133-PG144	PDF
Untitled Abstract: No abstract text available Text: Tactile Switches Product Selection Guide Series KMT2 KMT0 KMR2-4 Size on PCB L x W mm 3 X 2,6 3 X 2,6 4,2 x 2,8 4,2 x 3,55 5,2 x 5,2 B Total Height (mm) 0,65 0,65 1,9 2,5 1,42 0,8 and 1,5 Tactile Switches Surface Mount Travel (mm) 0,15 0,15 0,2 to 0,35 0,25 to 0,3	Original		PDF
CLCC 84 Abstract: CLCC 84 SOCKET CLCC 44 HW-133-PC68 clcc 44 socket XC7200A DIMENSIONS PQFP 132 XC7300 HW-133-PG144 PGA package weight Text:  HW-130 Programmer August 6, 1996 Version 1.1 Programs All Xilinx Nonvolatile Devices Programming Socket Adapters • • • • • XC1700 Serial PROMs XC7000 CPLDs XC9500 CPLDs Supports all Xilinx package types Programmer Accessories • • • •	Original	HW-130 XC1700 XC7000 XC9500 RS-232 XC7200A CLCC 84 CLCC 84 SOCKET CLCC 44 HW-133-PC68 clcc 44 socket XC7200A DIMENSIONS PQFP 132 XC7300 HW-133-PG144 PGA package weight	PDF
SMD 5050 rgb Abstract: smd 5050 RGB datasheet 5050 RGB smd smd 3528 SMD plcc2 3528 SMD plcc2 5050 white SMD 5060 RGB SMD 5060 RGB DATASHEET SMD 5060 Text: 2007 Product Offerings Thank you for your interest in YELLS! Yokohama Electron is proud to present our 2007 Product Offering Announcement. This announcement is intended for your product identification and sourcing purposes as part of Yokohama Electron’s effort to keep you up to date with our	Original		PDF
HW-137-DIP8 Abstract: XC9500XL CSP-48 HQFP-208 PLCC20 PLCC20 package plcc20 socket PLCC44 socket PLCC-84 tqfp 44 socket Text: HW-130 Programmer R November 27, 1998 Version 1.4 8* Device and Package Support Programming Socket Adapters • • • • XC1700 Serial PROMs XC9500 CPLDs Supports all Xilinx package types • Programmer Accessories • • • • • • Universal power supply	Original	HW-130 XC1700 XC9500 HW-137-LCC44/VQ44 HW-130-CAL HW-133-PQ160 HW-137-LCC44/VQ44 XC7200/7300 XC9500/XL HW-137-DIP8 XC9500XL CSP-48 HQFP-208 PLCC20 PLCC20 package plcc20 socket PLCC44 socket PLCC-84 tqfp 44 socket	PDF
TSOP 66 Package Abstract: TSOP 66 Package thermal resistance CERAMIC LEADLESS CHIP CARRIER 28P6 DW67 0636A Text: Packages Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability	Original	32D6/DW6 40D6/DW6 28L/LW 32L/LW 44L/LW 68L/LW 28K/KW 32K/KW 44K/KW TSOP 66 Package TSOP 66 Package thermal resistance CERAMIC LEADLESS CHIP CARRIER 28P6 DW67 0636A	PDF
44 VQFP package Abstract: HW-137-DIP8 vqfp 44 XC17S00 HW-133-PQ160 PLCC20 package plcc20 socket PLCC44 socket tqfp 64 socket HW-130 Text: R HW-130 Programmer DS019 v1.5 January 13, 2000 8* Product Specification Device and Package Support Programming Socket Adapters • • • • • XC1700 Serial PROMs XC1800 Serial PROMs XC9500/XL CPLDs Supports all Xilinx package types • Electrical Requirements and Physical	Original	HW-130 DS019 XC1700 XC1800 XC9500/XL XC9500 HW-137-LCC44/VQ44 XC7200/7300 44 VQFP package HW-137-DIP8 vqfp 44 XC17S00 HW-133-PQ160 PLCC20 package plcc20 socket PLCC44 socket tqfp 64 socket	PDF
TSOP 66 Package thermal resistance Abstract: 7244k 20P3 28P6 TSOP 66 thermal resistance Text: Packages Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability	Original	28K/KW 32K/KW 44K/KW 68K/KW 24C/CW TSOP 66 Package thermal resistance 7244k 20P3 28P6 TSOP 66 thermal resistance	PDF
HW-137-DIP8 Abstract: XC1800 HW-130-J plcc20 socket PLCC44 socket Programmer HW-130 XC18V00 HW-130 XC1700 HW-130 Programmer Text: ds019_1_6.fm Page 1 Tuesday, April 8, 2003 4:07 PM R HW-130 Programmer DS019 v1.6 April 8, 2003 Product Specification Device and Package Support Programmer Functional Specifications • • • • • • • • • • • • XC1700 Serial PROMs XC18V00 ISP PROMs	Original	HW-130 DS019 XC1700 XC18V00 XC9500/XL XC7200/7300 XC1800 HW-137-DIP8 HW-130-J plcc20 socket PLCC44 socket Programmer HW-130 HW-130 Programmer	PDF
XCR3000XL Abstract: vqfp 44 HW-137-DIP8 HQFP HW-133-BG256 HW-136-VQ100 vqfp44 HW-137-PC44/VQ44 HW-136-CS144 xc17v00 Text: HW-130 Programmer R DS019 v1.8 May 25, 2007 Product Specification Device and Package Support Programmer Functional Specifications • XC1700/XC17S00/XL Serial PROMs • Device programming, erasing, and verification • XC17V00/XC17S00A Serial PROMs • CPLD security control	Original	HW-130 DS019 XC1700/XC17S00/XL XC17V00/XC17S00A XC18V00 XC9500/XL/XV XCR3000XL XC7200/7300 XC9500/XL XC1800 vqfp 44 HW-137-DIP8 HQFP HW-133-BG256 HW-136-VQ100 vqfp44 HW-137-PC44/VQ44 HW-136-CS144 xc17v00	PDF
PICDEM-3 Abstract: DM163003 200B PIC16C923 PIC16C924 PIC16C9XX PIC16CXX Text: PICDEM-3 Low-Cost PIC16C9XX Demonstration Board PRODUCT INFORMATION The PICDEM-3 is a simple board which demonstrates the capabilities of Microchip’s microcontroller LCD family. All necessary hardware is included to run basic demo programs, which are supplied on a 3.5" disk. A	Original	PIC16C9XX 40-pin D-81739 DS51078A-page PICDEM-3 DM163003 200B PIC16C923 PIC16C924 PIC16CXX	PDF
20P3 Abstract: 28P6 ATMEL 40T Text: Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability	Original	0636B 10/98/xM 20P3 28P6 ATMEL 40T	PDF
HW-137-DIP8 Abstract: soic-20 XCN07022 XCR3000XL HW-133-PC44 HW-130-J HW-137-PC44/VQ44 XC18V00 XC7200 HW-130 Text: R HW-130 Programmer DS019 v1.9 February 8, 2008 Product Specification This product is undergoing discontinuance. Please refer to XCN07022, Product Discontinuation Notice, for more information on last-time purchases and replacement products. Device and Package Support	Original	HW-130 DS019 XCN07022, XC1700/XC17S00/XL XC17V00/XC17S00A XC18V00 XC9500/XL/XV XCR3000XL HW-137-DIP8 soic-20 XCN07022 HW-133-PC44 HW-130-J HW-137-PC44/VQ44 XC7200	PDF
Untitled Abstract: No abstract text available Text: 28C04A 4K 512 x 8 CMOS EEPROM PACKAGE TYPES 32 Vcc 31 WE Vcc A8 NC WE OE NC CE I/O7 I/O6 I/O5 I/O4 I/O3 5 29 A8 6 28 NC 7 27 NC 28C04A 8 9 10 11 26 NC 25 OE 24 NC 23 CE 20 19 18 21 I/O6 17 22 I/O7 13 15 12 14 A6 A5 A4 A3 A2 A1 A0 NC I/O0 2 NC 1 NU PLCC 24	Original	28C04A Time--150 Time--200 DS11126F-page	PDF

28C64A Abstract: 28C64A-15 Text: 28C64A 64K 8K x 8 CMOS EEPROM 30 NC 32 Vcc 31 WE 2 RDY/BSY 1 NU 29 A8 28 A9 27 A11 26 NC 25 OE 24 A10 23 CE 22 I/O7 20 19 18 17 16 15 21 I/O6 14 Vcc WE NC A8 A6 5 A9 A5 6 A11 A4 7 A3 8 OE A10 A2 9 A1 10 CE A0 11 I/O7 NC 12 I/O6 I/O0 13 I/O5 I/O4 I/O3 PLCC	Original	28C64A DS11109H-page 28C64A 28C64A-15	PDF
200B Abstract: 27C512-12 27C512-15 27C512A Text: 27C512A 512K 64K x 8 CMOS EPROM PACKAGE TYPES TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for	Original	27C512A DS11173E-page 200B 27C512-12 27C512-15 27C512A	PDF
AX251 Abstract: Intel 82930 USB test board DIL40 MQFP44 OMF251 PLCC44 TSC80251 temic can bus gateway Text: AX251 In-Circuit Emulator The AX Class For The MCS 251 With Bondout Technology ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○	Original	AX251 AX251 AX251, TSC80251 Bo-AX251 Intel 82930 USB test board DIL40 MQFP44 OMF251 PLCC44 temic can bus gateway	PDF
outline pro 408 Abstract: TEXTOOL 40 pin socket PIC16C54A PIC16C55 PIC16C56 AC144001 AC144002 AC164001 PLCC SOCKET 3M AC164015 Text: PRO MATE/PRO MATE II DEVICE SUPPORT Socket Modules INTRODUCTION This document lists the part numbers for the socket modules that support each device and discusses the life expectancy and cleaning procedures for the different socket types. These sockets work on both PRO MATE	Original	DS30243C-page outline pro 408 TEXTOOL 40 pin socket PIC16C54A PIC16C55 PIC16C56 AC144001 AC144002 AC164001 PLCC SOCKET 3M AC164015	PDF
XC1700 Abstract: 200B 37LV128 37LV36 37LV65 Text: 37LV36/65/128 36K, 64K, and 128K Serial EPROM Family FEATURES DATA 1 8 VCC CLK 2 7 VPP RESET/OE 3 6 CEO CE 4 5 VSS DATA 1 8 VCC CLK 2 7 VPP RESET/OE 3 6 CEO CE 4 5 VSS SOIC 37LV36 37LV65 37LV128 PLCC Bits Programming Word 37LV36 36,288 1134 x 32 37LV65 65,536	Original	37LV36/65/128 37LV36 37LV65 37LV128 XC1700 200B 37LV128 37LV36 37LV65	PDF
EC1204 Abstract: WHA300 smd led 5060 CQFP24 SMD 5060 LED WRS3000 PLCC18 KDS824A WRS7000 C881 Text: Weller Cooper Tools Rework Systems WHA300 Self-Contained Hot Air Station c c c c c c c c c Compact Size with Power A Low Cost Self-Contained Hot Air Station Temperature Control: 125¡F-1022¡F Dimensions: 8.5" ´ 5.13" Dia. Current 120 VAC, 50-60 Hz Air Flow: Adjustable from 10 Liters/Min. to 50 Liters/Min.	Original	WHA300 WRS5000 c0-100 KDS808. EC1204 984Q1404. WRS4000. smd led 5060 CQFP24 SMD 5060 LED WRS3000 PLCC18 KDS824A WRS7000 C881	PDF
34992 Abstract: SSC5100 F232-10 pinpad 78568 Text: S-n 0 S SYSTEMS INC 5bE D • 7 cï 3 S tl D c1 G ODI Sb b SSC5000 'Ib? M S MO Series 0.8u HIGH SPEED CMOS STANDARD CELL SERIES° 7 ■ DESCRIPTION The S-MOS SSC5000 standard cell series is a 0.8 micron drawn family of standard cell circuits. It is manufactured on S-MOS’ state-of-the-art 0.8 micron double-metal N-well CMOS process. It Is comprised of 20	OCR Scan	SSC5000 SSC5000 SSC50LQ C-115 34992 SSC5100 F232-10 pinpad 78568	PDF
Untitled Abstract: No abstract text available Text: O K I Semiconductor MSC23S136B/BL-XXBS12/DS12 1,048,576-Word by 36-Bit DRAM Module: Fast Page Mode DESCRIPTION The OKI M SC 23S136B /B L -xxB S12/D S12 is a fully decoded 1,048,576-word x 36-bit CM OS dynamic Ran dom Access M em ory module com posed of eight 4-M b DRAM s in SOJ M SM 514400B/BL packages and	OCR Scan	MSC23S136B/BL-XXBS12/DS12 576-Word 36-Bit 23S136B S12/D 514400B/BL) 511000B/BL) 72-pin	PDF
oa-1160 Abstract: MSC23136 2k240 Text: O K I Semiconductor M SC 23136B/BL-XXBS 12/DS 12 1,048,576-Word by 36-Bit DRAM Module: Fast Page Mode D ESC R IPTIO N The OKI M SC 23136B/BL -xxBS12/D S12 is a fully decoded 1,048,576-word x 36-bit CM OS Dynamic Ran dom Access Memory M odule composed of eight 4-Mb DRAMs in SOJ M SM 514400B/BL packages and	OCR Scan	MSC23136B/BL-xxBS12/DS12 576-Word 36-Bit MSC23136B/BL-xxBS12/DS12 MSM514400B/BL) MSM511000B/BL) 72-pin oa-1160 MSC23136 2k240	PDF
TT 104 N 14 KOF Abstract: SC2313 Text: O K I Semiconductor MSC23136B/BL-xxBS12/DS12 1,048,576-Word by 36-Bit DRAM Module: Fast Page Mode DESCRIPTION The OKI MSC23136B/BL-xxBS12/DS12 is a fully decoded 1,048,576-word x 36-bit CMOS Dynamic Ran dom Access Memory M odule composed of eight 4-Mb DRAMs in SOJ MSM514400B/BL packages and	OCR Scan	MSC23136B/BL-xxBS12/DS12 576-Word 36-Bit MSC23136B/BL-xxBS12/DS12 MSM514400B/BL) MSM511000B/BL) 72-pin TT 104 N 14 KOF SC2313	PDF

Privacy Settings

5060 PLCC Search Results

5060 PLCC Result Highlights (5)

5060 PLCC Datasheets Context Search

CLCC 84

Untitled

CLCC 84

SMD 5050 rgb

HW-137-DIP8

TSOP 66 Package

44 VQFP package

TSOP 66 Package thermal resistance

HW-137-DIP8

XCR3000XL

PICDEM-3

20P3

HW-137-DIP8

Untitled

28C64A

200B

AX251

outline pro 408

XC1700

EC1204

34992

Untitled

oa-1160

TT 104 N 14 KOF