Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC FPT-16C-C02 16-pin ceramic SOP Lead pitch 50 mil Row spacing 209 mil Lead shape Gullwing Sealing method Cerdip FPT-16C-C02 16-pin ceramic SOP (FPT-16C-C02) 0.43±0.05 (.0170±.002) 2.41(.095)
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Original
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FPT-16C-C02
16-pin
FPT-16C-C02)
F16016SC-1-2
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PDF
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index FPT-16C-C02 16-pin ceramic SOP Lead pitch 50 mil Row spacing 209 mil Lead shape Gullwing Sealing method Cerdip FPT-16C-C02 16-pin ceramic SOP (FPT-16C-C02)
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Original
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FPT-16C-C02
16-pin
FPT-16C-C02)
F16016SC-1-2
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PDF
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 26 PIN CERAMIC LCC-26C-A01 26-pin ceramic SOJ Lead pitch 50 mil Package width 316 mil Sealing method Metal seal Lead shape J bend LCC-26C-A01 26-pin ceramic SOJ (LCC-26C-A01) 3.55 (.140) MAX
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Original
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LCC-26C-A01
26-pin
LCC-26C-A01)
C26004SC-3-2
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PDF
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QFJ-44C-C01
Abstract: No abstract text available
Text: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50 mil Package width x package length 650 × 650 mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01)
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Original
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QFJ-44C-C01
44-pin
QFJ-44C-C01)
J44001SC-4-2
QFJ-44C-C01
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PDF
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QFJ-32C-C01
Abstract: No abstract text available
Text: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC QFJ-32C-C01 32-pin ceramic QFJ Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape J bend Sealing method Cerdip QFJ-32C-C01 32-pin ceramic QFJ (QFJ-32C-C01)
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Original
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QFJ-32C-C01
32-pin
QFJ-32C-C01)
J32001SC-3-2
QFJ-32C-C01
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PDF
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26-pin
Abstract: SOJ 24
Text: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 26 PIN CERAMIC To Top / Package Lineup / Package Index LCC-26C-A01 26-pin ceramic SOJ Lead pitch 50 mil Package width 316 mil Sealing method Metal seal Lead shape J bend LCC-26C-A01 26-pin ceramic SOJ
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Original
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LCC-26C-A01
26-pin
LCC-26C-A01)
C26004SC-3-2
SOJ 24
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PDF
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LCC28
Abstract: No abstract text available
Text: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index LCC-28C-A04 28-pin ceramic SOJ Lead pitch 50 mil Package width 432 mil Sealing method Metal seal Lead shape J bend LCC-28C-A04 28-pin ceramic SOJ
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Original
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LCC-28C-A04
28-pin
LCC-28C-A04)
C28011SC-2-2
LCC28
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PDF
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC LCC-28C-A04 28-pin ceramic SOJ Lead pitch 50 mil Package width 432 mil Sealing method Metal seal Lead shape J bend LCC-28C-A04 28-pin ceramic SOJ (LCC-28C-A04) 18.42±0.25 (.725±.010)
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Original
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LCC-28C-A04
28-pin
LCC-28C-A04)
C28011SC-2-2
Customer18
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PDF
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36 pin CERAMIC LEADLESS CHIP CARRIER LCC
Abstract: transistor 36c WQFN036-G-S550-1 LCC-36C-F01 12 CERAMIC LEADLESS CHIP CARRIER LCC c3600
Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50 mil Package width x package length 550 × 550 mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01)
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Original
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LCC-36C-F01
WQFN036-G-S550-1
36-pad
LCC-36C-F01)
C36001SC-1-2
36 pin CERAMIC LEADLESS CHIP CARRIER LCC
transistor 36c
WQFN036-G-S550-1
LCC-36C-F01
12 CERAMIC LEADLESS CHIP CARRIER LCC
c3600
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PDF
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WQFN032-C-R450-1
Abstract: C038
Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal LCC-32C-A01 32-pad ceramic LCC (LCC-32C-A01)
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Original
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LCC-32C-A01
WQFN032-C-R450-1
32-pad
LCC-32C-A01)
C32009SC-2-2
WQFN032-C-R450-1
C038
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PDF
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WQFN032-G-R450-1
Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32
Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal LCC-32C-F01 32-pad ceramic LCC (LCC-32C-F01)
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Original
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LCC-32C-F01
WQFN032-G-R450-1
32-pad
LCC-32C-F01)
C32017SC-2-2
15TYP
WQFN032-G-R450-1
CERAMIC LEADLESS CHIP CARRIER LCC 32
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PDF
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QFN016-G-S250-1
Abstract: LCC-16C-F01 R030
Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 16 PAD CERAMIC LCC-16C-F01 EIAJ code :∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50 mil Package width x package length 250 × 250 mil Sealing method Frit seal LCC-16C-F01 16-pad ceramic LCC (LCC-16C-F01)
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Original
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LCC-16C-F01
QFN016-G-S250-1
16-pad
LCC-16C-F01)
C16003S4
C16003SC-2-2
QFN016-G-S250-1
LCC-16C-F01
R030
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PDF
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CERAMIC LEADLESS CHIP CARRIER LCC 44
Abstract: LCC 44 WQFN044-G-S650-1 LCC44 44-pad
Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01)
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Original
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LCC-44C-F01
WQFN044-G-S650-1
44-pad
LCC-44C-F01)
C44001SC-2-2
CERAMIC LEADLESS CHIP CARRIER LCC 44
LCC 44
WQFN044-G-S650-1
LCC44
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PDF
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC To Top / Package Lineup / Package Index FPT-32C-C02 32-pin ceramic QFP Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape Gullwing Sealing method Cerdip Length of flat
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Original
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FPT-32C-C02
32-pin
FPT-32C-C02)
F32012SC-3-2
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PDF
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PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
Abstract: LCC 16 Pin Package CERAMIC LEADLESS CHIP CARRIER
Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 16 PAD CERAMIC To Top / Package Lineup / Package Index LCC-16C-F01 EIAJ code :∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50 mil Package width x package length 250 × 250 mil Sealing method Frit seal
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Original
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LCC-16C-F01
QFN016-G-S250-1
16-pad
LCC-16C-F01)
C16003SC-2-2
PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
LCC 16 Pin Package
CERAMIC LEADLESS CHIP CARRIER
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PDF
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PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68 WQFN032-G-R450-1 LCC-32C-F01
Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal
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Original
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LCC-32C-F01
WQFN032-G-R450-1
32-pad
LCC-32C-F01)
C32017SC-2-2
15T010
15TYP
PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
64 CERAMIC LEADLESS CHIP CARRIER LCC
CERAMIC LEADLESS CHIP CARRIER
CERAMIC LEADLESS CHIP CARRIER LCC 68
WQFN032-G-R450-1
LCC-32C-F01
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PDF
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64 CERAMIC LEADLESS CHIP CARRIER LCC
Abstract: LCC-32C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32
Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal
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Original
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LCC-32C-A01
WQFN032-C-R450-1
32-pad
LCC-32C-A01)
C32009SC-2-2
64 CERAMIC LEADLESS CHIP CARRIER LCC
LCC-32C-A01
CERAMIC LEADLESS CHIP CARRIER
PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
WQFN032-C-R450-1
CERAMIC LEADLESS CHIP CARRIER LCC 32
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PDF
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64 CERAMIC LEADLESS CHIP CARRIER LCC
Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 CERAMIC LEADLESS CHIP CARRIER LCC 44
Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC To Top / Package Lineup / Package Index LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal
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Original
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LCC-44C-F01
WQFN044-G-S650-1
44-pad
LCC-44C-F01)
C44001SC-2-2
64 CERAMIC LEADLESS CHIP CARRIER LCC
CERAMIC LEADLESS CHIP CARRIER
PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
WQFN044-G-S650-1
CERAMIC LEADLESS CHIP CARRIER LCC 44
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PDF
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC To Top / Package Lineup / Package Index QFJ-32C-C01 32-pin ceramic QFJ Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape J bend Sealing method Cerdip QFJ-32C-C01
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Original
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QFJ-32C-C01
32-pin
QFJ-32C-C01)
J32001
J32001SC-3-2
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PDF
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN CERAMIC To Top / Package Lineup / Package Index QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50 mil Package width x package length 650 × 650 mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01
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Original
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QFJ-44C-C01
44-pin
QFJ-44C-C01)
J44001SC-4-2
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PDF
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC FPT-32C-C02 32-pin ceramic QFP Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80 mm FPT-32C-C02
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Original
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FPT-32C-C02
32-pin
FPT-32C-C02)
F32012SC-3-2
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PDF
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FPT-16C-C01
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC FPT-16C-C01 16-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Cerdip FPT-16C-C01 16-pin ceramic SOP (FPT-16C-C01) +0.51 9.53 –0.13 0.125±0.025 (.005±.005) +.020
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Original
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FPT-16C-C01
16-pin
FPT-16C-C01)
F16006SC-4-2
FPT-16C-C01
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PDF
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index FPT-28C-F01 28-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Frit seal FPT-28C-F01 28-pin ceramic SOP (FPT-28C-F01) +0.05
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Original
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FPT-28C-F01
28-pin
FPT-28C-F01)
F28009SC-2-2
aC-F01)
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PDF
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index FPT-24C-F01 24-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Frit seal FPT-24C-F01 24-pin ceramic SOP (FPT-24C-F01) INDEX
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Original
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FPT-24C-F01
24-pin
FPT-24C-F01)
F24002SC-2-2
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PDF
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