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    5 PIN LEAD SOP Search Results

    5 PIN LEAD SOP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    5 PIN LEAD SOP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TSSOP 8PIN MARK 21

    Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
    Text: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP


    Original     		PDF SC-82AB SC-88A OT-23-3 OT-23-5 OT-23-6 OT-89-3 OT-89-5 14-Pin 10-Pin 16-Pin TSSOP 8PIN MARK 21 land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    Untitled

    Abstract: No abstract text available
    Text: SOP24-P-430-1.27-K Mirror finish Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 0.58 TYP. 5/Oct.13,1998


    Original     		PDF OP24-P-430-1

    Untitled

    Abstract: No abstract text available
    Text: SOP32-P-525-1.27-K Mirror finish Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 1.32 TYP. 5/Feb.10,1997


    Original     		PDF OP32-P-525-1

    Untitled

    Abstract: No abstract text available
    Text: SOP8-P-250-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.10 TYP. 4/Dec. 5, 1996


    Original     		PDF OP8-P-250-1

    Untitled

    Abstract: No abstract text available
    Text: SOP24-P-430-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.58 TYP. 5/Oct. 13, 1998


    Original     		PDF OP24-P-430-1

    Untitled

    Abstract: No abstract text available
    Text: SOP16-P-300-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 0.21 TYP. 3/Dec. 5, 1996


    Original     		PDF OP16-P-300-1

    Untitled

    Abstract: No abstract text available
    Text: SOP44-P-600-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 2.10 TYP. 4/Dec. 5, 1996


    Original     		PDF OP44-P-600-1

    Untitled

    Abstract: No abstract text available
    Text: SOP28-P-430-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.75 TYP. 4/Dec. 5, 1996


    Original     		PDF OP28-P-430-1

    Untitled

    Abstract: No abstract text available
    Text: SOP32-P-525-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.32 TYP. 5/Fev. 10, 1997


    Original     		PDF OP32-P-525-1

    Untitled

    Abstract: No abstract text available
    Text: SOP40-P-525-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.27 TYP. 3/Oct. 21, 1996


    Original     		PDF OP40-P-525-1

    Untitled

    Abstract: No abstract text available
    Text: 28 PIN PLASTIC SOP 450 mil 28 15 1 5°±5° detail of lead end 14 A G H I E K F J C D L B N M M P28GM-50-450A1-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS


    Original     		PDF P28GM-50-450A1-2

    MM225-1A

    Abstract: SC-527-8AA sc5278
    Text: Mounting Pad Packing Magazine Name MM225-1A 8 pin SOP 225 mil 8 5 P detail of lead end 4 1 A H J E K F G I B L N C D M M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS


    Original     		PDF MM225-1A S8GM-50-225B-4 SC-527-8AA* MM225-1A SC-527-8AA sc5278

    Untitled

    Abstract: No abstract text available
    Text: 8 PIN PLASTIC SOP 300 mil 8 5 detail of lead end P 1 4 A H F I G J S C D M N L B S K M E NOTE 1. Controlling dimention millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM


    Original     		PDF P8GM-50-300B-4

    VAA33

    Abstract: Murata EMI Filter ADV7120
    Text: BACK a FEATURES 80 MHz Pipelined Operation Triple 8-Bit D/A Converters RS-343A/RS-170 Compatible Outputs TTL Compatible Inputs +5 V CMOS Monolithic Construction 40-Pin DIP or 44-Pin PLCC and 48-Lead TQFP APPLICATIONS High Resolution Color Graphics CAE/CAD/CAM Applications


    Original     		PDF RS-343A/RS-170 40-Pin 44-Pin 48-Lead ADV7120 ST-48) VAA33 Murata EMI Filter ADV7120

    adv7120

    Abstract: R3G310 ADV7120KN30 ADV7120KN50 ADV7120KN80 ADV7120KP50 ADV7120KP80 RS-170 RS-343A Composite Sync
    Text: a FEATURES 80 MHz Pipelined Operation Triple 8-Bit D/A Converters RS-343A/RS-170 Compatible Outputs TTL Compatible Inputs +5 V CMOS Monolithic Construction 40-Pin DIP or 44-Pin PLCC and 48-Lead TQFP APPLICATIONS High Resolution Color Graphics CAE/CAD/CAM Applications


    Original     		PDF RS-343A/RS-170 40-Pin 44-Pin 48-Lead ADV7120 ST-48) adv7120 R3G310 ADV7120KN30 ADV7120KN50 ADV7120KN80 ADV7120KP50 ADV7120KP80 RS-170 RS-343A Composite Sync

    Untitled

    Abstract: No abstract text available
    Text: 8-PIN PLASTIC SOP 7.62 mm (300 8 5 detail of lead end P 1 4 A H F I G J S L B C D M N S K M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 6.44 +0.21 −0.1 B 1.42 MAX.


    Original     		PDF P8GM-50-300B-6

    S8GM-50-225B-6

    Abstract: No abstract text available
    Text: 8-PIN PLASTIC SOP 5.72 mm (225 8 5 detail of lead end P 4 1 A H F I G J S B C D M L N K S M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX.


    Original     		PDF S8GM-50-225B-6 S8GM-50-225B-6

    transistor 331

    Abstract: transistor h 331 datasheet SC-533-28CA C 331 Transistor transistor h 331 LB-001
    Text: Mounting Pad Packing Name Magazine LB-001 28 pin SOP 450 mil 28 15 1 5°±5° detail of lead end 14 A G H I E K F J C D L B N M M P28GM-50-450A1-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


    Original     		PDF LB-001 P28GM-50-450A1-2 RefereP28GM-50-450A1-2 SC-533-28CA* transistor 331 transistor h 331 datasheet SC-533-28CA C 331 Transistor transistor h 331 LB-001

    Untitled

    Abstract: No abstract text available
    Text: 32 PIN PLASTIC SOP 525 mil 32 17 1 5°±5° detail of lead end 16 A J E K F G H I C D L B N M M S32GM-50-525A-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES


    Original     		PDF S32GM-50-525A-2

    Untitled

    Abstract: No abstract text available
    Text: 40 PIN PLASTIC SOP 525 mil 40 21 5°±5° detail of lead end 1 20 H A J E K F G I N C D L B M M P40GW-50-525A NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maxi– mum material condition. ITEM MILLIMETERS


    Original     		PDF P40GW-50-525A

    Untitled

    Abstract: No abstract text available
    Text: 16 PIN PLASTIC SOP 375 mil 16 9 5°±5° detail of lead end 1 8 A G H I E K F J D L B C N M M P16GM-50-375A-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES


    Original     		PDF P16GM-50-375A-2

    Untitled

    Abstract: No abstract text available
    Text: 24 PIN PLASTIC SOP 450 mil 24 13 1 5°±5° detail of lead end 12 A H J E K F G I D L B C N M M P24GM-50-450A-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES


    Original     		PDF P24GM-50-450A-2

    Untitled

    Abstract: No abstract text available
    Text: 14 PIN PLASTIC SHRINK SOP 225 mil 14 8 5˚±5˚ detail of lead end 1 7 A H I E K F G J B C D L N M M P14GM-65-225B-2 NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS


    Original     		PDF P14GM-65-225B-2 071MAX.