Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 48 PIN PLASTIC FPT-48P-M08 Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold 48-pin plastic TSOP I (FPT-48P-M08) 48-pin plastic TSOP (I) (FPT-48P-M08) LEAD No. 48 1 Details of "A" part
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FPT-48P-M08
48-pin
FPT-48P-M08)
F48016S-4C-3
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PA48TS20-OT
Abstract: 48TS20-1
Text: PA48TS20- 1 OT Data Sheet 48 pin TSOP socket/48 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction These adapters connect the pins of a 48 pin TSOP device to a 48 pin DIP equivalent. They accept a TSOP device and plug into a DIP socket. The adapter is made up of 2 sub-assemblies. They assemble via
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PA48TS20-
socket/48
PA48TS20-OT
48TSJ-W20
48TS20
PA48TS20-1OT
48TS20-1
PA48TS20-OT
PA48TS20-1OT
48TS20-1
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48-pin TSOP I flash memory
Abstract: PLUS48
Text: A COST-EFFECTIVE PROGRAMMING SOLUTION FOR PROGRAMMABLE DEVICES UP TO 48 PINS. Plus 48 Universal Programming System ● Compact hardware design complete with integral 48 pin DIP socket ● 48 universal analog/digital pindrivers ● Programs memory, microcontroller and logic devices.
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LI5255
5000US,
2500A4
48-pin TSOP I flash memory
PLUS48
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IC191-0482-004
Abstract: tsop 48 PIN SOCKET CIC-48TS-48D-A6-YAM-S CIC-48TS-48D TSOP 48 socket
Text: CIC-48TS-48D-A6-YAM-S 48-Lead TSOP to a 48-Pin DIP Mar-98 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: One to One Standard Pinout SOCKET: BASE 48-Pin DIP PIN NAMES SOCKET 48-Lead TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
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CIC-48TS-48D-A6-YAM-S
48-Lead
48-Pin
Mar-98
IC191-0482-004
IC191-0482-004
tsop 48 PIN SOCKET
CIC-48TS-48D-A6-YAM-S
CIC-48TS-48D
TSOP 48 socket
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FPT-48P-M20
Abstract: FPT48P
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC FPT-48P-M20 48-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-48P-M20) 48-pin plastic TSOP (I)
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FPT-48P-M20
48-pin
FPT-48P-M20)
F48030S-2C-2
FPT-48P-M20
FPT48P
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FPT-48P-M19
Abstract: 50REF
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC FPT-48P-M19 48-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-48P-M19) 48-pin plastic TSOP (I)
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FPT-48P-M19
48-pin
FPT-48P-M19)
50REF
F48029S-2C-2
FPT-48P-M19
50REF
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package 1218
Abstract: TSOP048-P-1218-1
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 48 PIN PLASTIC FPT-48P-M07 EIAJ code : TSOP048-P-1218-1 Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 48-pin plastic TSOP I (FPT-48P-M07) 48-pin plastic TSOP (I) (FPT-48P-M07)
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FPT-48P-M07
TSOP048-P-1218-1
48-pin
FPT-48P-M07)
F48015S-4C-3
package 1218
TSOP048-P-1218-1
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FPT-48P-M19
Abstract: 50REF
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 48 PIN PLASTIC FPT-48P-M19 48-pin plastic TSOP I Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-48P-M19) 48-pin plastic TSOP (I) (FPT-48P-M19) * : Resin protrusion. (Each side : 0.15 (.006) Max)
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FPT-48P-M19
48-pin
FPT-48P-M19)
50REF
F48029S-2Cion
FPT-48P-M19
50REF
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FPT-48P-M20
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 48 PIN PLASTIC FPT-48P-M20 Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold 48-pin plastic TSOP I (FPT-48P-M20) 48-pin plastic TSOP (I) (FPT-48P-M20) * : Resin protrusion. (Each side : 0.15 (.006) Max)
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FPT-48P-M20
48-pin
FPT-48P-M20)
F48030S-2on
FPT-48P-M20
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48-PIN
Abstract: LRS1338A 1338a2
Text: LRS1338A Data Sheet Stacked Chip 8M Flash Memory and 2M SRAM FEATURES PIN CONFIGURATION • Flash memory and SRAM • Stacked die chip scale package • 48-pin TSOP TSOP48-P-1014 plastic package 48-PIN TSOP TOP VIEW S-A16/F-A15 1 48 S-A17/F-A16 S-A15/F-A14
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LRS1338A
48-pin
TSOP48-P-1014)
S-A16/F-A15
S-A17/F-A16
S-A15/F-A14
I/O15
S-A14/F-A13
S-A13/F-A12
LRS1338A
1338a2
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DIN 13715
Abstract: 12197-507-XTD AMIS41683CANN1G N08L6182AB27I FS7145-02G-XTD valve positioners 11640-843-XTP vending machine fuji SEOUL 5630 LED DATASHEET 19699-002-XTP
Text: Ultra-Low Power SRAMs Density Mb Organization Voltage Range Speed (ns) Features Package N08L6182A Part Number 8 512 Kb x 16 1.65 - 2.2 70 Dual CE 48-BGA N08L63W2A 8 512 Kb x 16 2.3 - 3.6 70 Dual CE 48-BGA N04L63W2A 4 256 Kb x 16 2.3 - 3.6 55 Dual CE 44-TSOP2, 48-BGA
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N08L6182A
48-BGA
N08L63W2A
N04L63W2A
44-TSOP2,
N04L63W1A
DIN 13715
12197-507-XTD
AMIS41683CANN1G
N08L6182AB27I
FS7145-02G-XTD
valve positioners
11640-843-XTP
vending machine fuji
SEOUL 5630 LED DATASHEET
19699-002-XTP
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24cxx eeprom programmer schematic
Abstract: uPD78Fxxx 87C196 users guide S29GL064N11 Macronix Lot Identifier DATAMAN-48PRO2 simple 24cxx eeprom programmer schematic eeprom programmer schematic 27128 24cxx usb eeprom programmer TESLA
Text: User's Manual for DATAMAN-448PRO2 Super fast universal 4x 48-pindrive concurrent multiprogramming system with ISP capability DATAMAN-448PRO+ Universal 4x 48-pindrive concurrent multiprogramming system with ISP capability DATAMAN-48PRO2 Super fast universal 48-pindrive Programmer with USB/LPT interface and ISP capability
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DATAMAN-448PRO2
48-pindrive
DATAMAN-448PRO+
DATAMAN-48PRO2
DATAMAN-48PRO+
DATAMAN-40PRO
40-pindrive
24cxx eeprom programmer schematic
uPD78Fxxx
87C196 users guide
S29GL064N11
Macronix Lot Identifier
DATAMAN-48PRO2
simple 24cxx eeprom programmer schematic
eeprom programmer schematic 27128
24cxx usb eeprom programmer
TESLA
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MBM29LV160TE70
Abstract: No abstract text available
Text: FUJITSU SEMICONDUCTOR DATA SHEET DS05-20883-5E FLASH MEMORY CMOS 16M 2M x 8/1M × 16 BIT MBM29LV160TE/BE70/90 • GENERAL DESCRIPTION The MBM29LV160TE/BE is a 16M-bit, 3.0 V-only Flash memory organized as 2M bytes of 8 bits each or 1M words of 16 bits each. The MBM29LV160TE/BE is offered in a 48-pin TSOP (1), 48-pin CSOP and 48-ball FBGA
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DS05-20883-5E
MBM29LV160TE/BE70/90
MBM29LV160TE/BE
16M-bit,
48-pin
48-ball
F0306
MBM29LV160TE70
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FPT-48P-M19
Abstract: FPT-48P-M20
Text: FUJITSU SEMICONDUCTOR DATA SHEET DS05-20883-2E FLASH MEMORY CMOS 16M 2M x 8/1M × 16 BIT MBM29LV160TE/BE -70/90/12 • GENERAL DESCRIPTION The MBM29LV160TE/BE is a 16M-bit, 3.0 V-only Flash memory organized as 2M bytes of 8 bits each or 1M words of 16 bits each. The MBM29LV160TE/BE is offered in a 48-pin TSOP (I), 48-pin CSOP and 48-ball FBGA
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DS05-20883-2E
MBM29LV160TE/BE
16M-bit,
48-pin
48-ball
FPT-48P-M19
FPT-48P-M20
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MC68HC705K1A
Abstract: ISD2540 ISD2532PY isd2540sy ISD2548PY ISD2500 ISD2532 ISD2548 ISD2564 ISD2548S
Text: ISD2532/40/48/64 SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND DURATION -1- Publication Release Date: April 24, 2006 Revision 1.2 ISD2532/40/48/64 1. GENERAL DESCRIPTION Winbond’s ISD2500 ChipCorder Series provide high-quality, single-chip, Record/Playback solutions
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ISD2532/40/48/64
64-SECOND
ISD2500
MC68HC705K1A
ISD2540
ISD2532PY
isd2540sy
ISD2548PY
ISD2532
ISD2548
ISD2564
ISD2548S
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SDH 209
Abstract: 1xVC4-16c CY7C9538 CYS25G0101DX VC45V
Text: CONFIDENTIAL CY7C9538 OC-48/STM-16 Framer with Reconfigurable VC–POSIC2GVC-R Features • OC-48/STS-48/STM-16, OC-12/STS-12/STM-4, OC-3/STS3/STM-1 rates, concatenated and non-concatenated • Programmable frame tagging engine for packet preclassification enables such features as
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CY7C9538
OC-48/STM-16
OC-48/STS-48/STM-16,
OC-12/STS-12/STM-4,
707/Y
GR253
16xSTS-3c,
4xSTS-12c,
2xSTS-24c,
1xOC-48c
SDH 209
1xVC4-16c
CY7C9538
CYS25G0101DX
VC45V
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Untitled
Abstract: No abstract text available
Text: FUJITSU SEMICONDUCTOR DATA SHEET DS05-20883-2E FLASH MEMORY CMOS 16M 2M x 8/1M × 16 BIT MBM29LV160TE/BE -70/90/12 • GENERAL DESCRIPTION The MBM29LV160TE/BE is a 16M-bit, 3.0 V-only Flash memory organized as 2M bytes of 8 bits each or 1M words of 16 bits each. The MBM29LV160TE/BE is offered in a 48-pin TSOP (I), 48-pin CSOP and 48-ball FBGA
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DS05-20883-2E
MBM29LV160TE/BE
16M-bit,
48-pin
48-ball
D-63303
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FPT-48P-M19
Abstract: FPT-48P-M20
Text: FUJITSU SEMICONDUCTOR DATA SHEET DS05-20883-4E FLASH MEMORY CMOS 16M 2M x 8/1M × 16 BIT MBM29LV160TE/BE70/90 • GENERAL DESCRIPTION The MBM29LV160TE/BE is a 16M-bit, 3.0 V-only Flash memory organized as 2M bytes of 8 bits each or 1M words of 16 bits each. The MBM29LV160TE/BE is offered in a 48-pin TSOP (I), 48-pin CSOP and 48-ball FBGA
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DS05-20883-4E
MBM29LV160TE/BE70/90
MBM29LV160TE/BE
16M-bit,
48-pin
48-ball
F0201
FPT-48P-M19
FPT-48P-M20
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Untitled
Abstract: No abstract text available
Text: FUJITSU SEMICONDUCTOR DATA SHEET DS05-20883-4E FLASH MEMORY CMOS 16M 2M x 8/1M × 16 BIT MBM29LV160TE/BE70/90 • GENERAL DESCRIPTION The MBM29LV160TE/BE is a 16M-bit, 3.0 V-only Flash memory organized as 2M bytes of 8 bits each or 1M words of 16 bits each. The MBM29LV160TE/BE is offered in a 48-pin TSOP (I), 48-pin CSOP and 48-ball FBGA
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DS05-20883-4E
MBM29LV160TE/BE70/90
MBM29LV160TE/BE
16M-bit,
48-pin
48-ball
F0201
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CY7C9538
Abstract: CYS25G0101DX cypress 1994 sram zero concatenated and OC-3 and STM-1 3C6V 1xVC4-16c T1X15
Text: CONFIDENTIAL CY7C9538 OC-48/STM-16 Framer with Reconfigurable VC–POSIC2GVC-R Features • OC-48/STS-48/STM-16, OC-12/STS-12/STM-4, OC-3/STS3/STM-1 rates, concatenated and non-concatenated • Programmable frame tagging engine for packet preclassification enables such features as
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CY7C9538
OC-48/STM-16
OC-48/STS-48/STM-16,
OC-12/STS-12/STM-4,
707/Y
GR253
16xSTS-3c,
4xSTS-12c,
2xSTS-24c,
1xOC-48c
CY7C9538
CYS25G0101DX
cypress 1994 sram zero
concatenated and OC-3 and STM-1
3C6V
1xVC4-16c
T1X15
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apin11
Abstract: ISD ChipCorder Application Information ChipCorder ISD2540P
Text: ISD2532/40/48/64 SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND DURATION -1- Publication Release Date: April 21, 2005 Revision 1.1 ISD2532/40/48/64 1. GENERAL DESCRIPTION Winbond’s ISD2500 ChipCorder Series provide high-quality, single-chip, Record/Playback solutions
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ISD2532/40/48/64
64-SECOND
ISD2500
apin11
ISD ChipCorder Application Information
ChipCorder
ISD2540P
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Untitled
Abstract: No abstract text available
Text: EtherPHAST -48 Plus Device OC-48/STM-16 SONET/SDH Ethernet Mapper TXC-06742 DATA SHEET PRODUCT PREVIEW TXC-06742-MB, Ed. 4 December 2005 FEATURES APPLICATIONS • 1x STS-48/STM-16 or 4x STS-12/STM-4 framer with TOH processing, 4x 622 LVDS line side interface
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OC-48/STM-16
TXC-06742
TXC-06742-MB,
STS-48/STM-16
STS-12/STM-4
AU-4-16c/AU-4-4c/AU-4/AU-3/TU-3
OC-12/4x
EtherPHAST-48
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FPT-48P-M20
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M20 48-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold
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FPT-48P-M20
48-pin
FPT-48P-M20)
F48030S-2C-2
FPT-48P-M20
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FPT-48P-M19
Abstract: FPT-48P-M20
Text: FUJITSU SEMICONDUCTOR DATA SHEET DS05-20871-5E FLASH MEMORY CMOS 8 M 1 M x 8/512 K × 16 BIT MBM29SL800TD/BD-10/12 • DESCRIPTION The MBM29SL800TD/BD are a 8 M-bit, 1.8 V-only Flash memory organized as 1 Mbytes of 8 bits each or 512 Kwords of 16 bits each. The MBM29SL800TD/BD are offered in a 48-pin TSOP (I) , 48-ball FBGA and 48-ball
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DS05-20871-5E
MBM29SL800TD/BD-10/12
MBM29SL800TD/BD
48-pin
48-ball
48-ball
MBM29SL800TD/MBM29SL800BD
F0210
FPT-48P-M19
FPT-48P-M20
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