441 BALL BGA Search Results

441 BALL BGA Result Highlights (5)

Part	Manufacturer	Description
MPC860PZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860PVR80D4	Rochester Electronics LLC	32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC855TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860ENZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

441 BALL BGA Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
HXC125 Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296 Text: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The	Original	1654563-CC CE-PDF-07-08 HXC125 mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296	PDF
construction of photo diode Abstract: BGA 441 EH11 au 81 441 ball bga flip chip bga 0,8 mm Text: Multi Chip Module MCMC SP Chip size package Advanced semiconductor mounting CSP is realized by Hybrid IC technology Realize high accumulation and a low price by fine printed substrate. CSP Features Single / Multi layer printed substates with minimum line width	Original		PDF
E700G Abstract: No abstract text available Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or	Original	DS577G E700G	PDF
441 ball bga Abstract: eh11 BGA 441 bga 0,8 mm Text: マルチチップモジュール MCM・CSP（チップサイズパッケージ）究極の半導体実装CSPと, MCMをハイブリッドIC 技術で実現し高集積化と低コスト化をファイン印刷基板で実現しました。 ▲ 特長	Original		PDF
BGA-56 DATASHEET Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION Text: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3	Original		PDF
Untitled Abstract: No abstract text available Text: CS2111 MADRID – Dual-Ring RPR MAC IC OVERVIEW MADRID is an integrated dual-ring RPR MAC. It provides an efficient solution for high-density line cards in ADMs, MSPPs, Switches and Routers. FEATURES Functionality Compliant with 802.17 standard	Original	CS2111 10Gb/s F2111010204	PDF
Untitled Abstract: No abstract text available Text: CS2111 MADRID – Dual-Ring RPR MAC IC OVERVIEW MADRID is an integrated dual-ring RPR MAC. It provides an efficient solution for high-density line cards in ADMs, MSPPs, Switches and Routers. FEATURES Functionality Compliant with 802.17 standard	Original	CS2111 10Gb/s F2111010204	PDF
Untitled Abstract: No abstract text available Text: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12	Original		PDF
footprint 8M1-A Abstract: 196-pin bga footprint Text: BGA Footprints Arranged by Pitch and Ball Count See www.bgasockets.com for updates or call for latest Footprints supplement. 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com	Original		PDF
cu pillar Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or	Original		PDF
HL832N Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or	Original		PDF
BGA reflow guide Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile Text: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using	Original	N163MZ163 N130MZ327 N161MZ612 N169MZ365 N169MZ641 N158MZ395 BGA reflow guide "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile	PDF
wristwatch Abstract: 441-pin BGA Text: CSP,MCM Modules CSP,MCM Modules AV, OA Information, Mobile communication, Industry/Field: Industrial equipment Breakthrough in High-Density Mounting High-Density Mounting via 20µm Fine Printed substrate • Development goals: Manufacture of high-density modules for	Original	100nH 10pF/mm2 3000pF/mm2 wristwatch 441-pin BGA	PDF
SG-BGA-6046 Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033 Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.	Original	025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033	PDF

"sd1v4 Abstract: Fusion-MPT Message Passing Interface Specification LSI53C1020A LSI53C1000 Text: TECHNICAL MANUAL LSI53C1020/1020A PCI-X to Ultra320 SCSI Controller February 2004 Version 2.3 DB14-000176-05 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties	Original	LSI53C1020/1020A Ultra320 DB14-000176-05 DB14-000176-05, LSI53C1020 LSI53C1020A "sd1v4 Fusion-MPT Message Passing Interface Specification LSI53C1000	PDF
LSI53C1020A Abstract: LSI53C1020 DB14-000176-06 Fusion-MPT Message Passing Interface Specification LSI53C1000 Text: TECHNICAL MANUAL LSI53C1020/1020A PCI-X to Ultra320 SCSI Controller February 2004 Version 2.4 DB14-000176-06 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties	Original	LSI53C1020/1020A Ultra320 DB14-000176-06 DB14-000176-06, LSI53C1020 LSI53C1020A DB14-000176-06 Fusion-MPT Message Passing Interface Specification LSI53C1000	PDF
XC95216-20PQG160I Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500 Text: XC95216 In-System Programmable CPLD R 5 Note: The 352-pin BGA packages are being discontinued for XC95216 devices. You cannot order these packages after May 14, 2008. Xilinx recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all designs as soon as possible. Recommended replacements are pin compatible, but	Original	XC95216 352-pin XC95288 XCN07010 352-pin XC95216-20PQG160I XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500	PDF
atmel 946 Abstract: atmel 946 8 pin MH1RT QML military mcm 1553 0.6 um cmos process atmel 27 Series Text: 200 ASICs for Aerospace i n t e g r a t i o n s o l u t i o n s System Level Integration for the space market R aerospace S y s t e m Meeting communication satellite challenges tmel Wireless & Microcontollers A the way for System Level Integration. hardened VLSI products for space	Original	perf89 32-bit atmel 946 atmel 946 8 pin MH1RT QML military mcm 1553 0.6 um cmos process atmel 27 Series	PDF
LSI53C1020A Abstract: ARM966E-S CRC-32 LSI53C1000R LSI53C1020 PAR64 KY 719 "sd1v4 SD1V Fusion-MPT Message Passing Interface Specification Text: TECHNICAL MANUAL LSI53C1020 PCI-X to Ultra320 SCSI Controller June 2002 Version 2.0 DB14-000176-02 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties	Original	LSI53C1020 Ultra320 DB14-000176-02 DB14-000176-02, LSI53C1020A ARM966E-S CRC-32 LSI53C1000R PAR64 KY 719 "sd1v4 SD1V Fusion-MPT Message Passing Interface Specification	PDF
of 1000 microfarad electrolytic capacitor Abstract: JTAG series termination resistors Text: R Printed Circuit Board Considerations Layout Considerations The PC board is no longer just a means to hold ICs in place. At today’s high clock rates and fast signal transitions, the PC board performs a vital function in feeding stable supply voltages to the IC and in maintaining signal integrity between devices.	Original	UG002 of 1000 microfarad electrolytic capacitor JTAG series termination resistors	PDF
diagrams hitachi ecu Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog" Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble	Original	D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"	PDF
35 x 35 PBGA, 580 100 balls Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8	Original	C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP	PDF
Untitled Abstract: No abstract text available Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and	OCR Scan	26x26 15X15	PDF
uaa 3100 Abstract: uaa 4003 s0315 v 3700 bga Text: ADVANCED BGA Footprints A rranged by Pitch and Ball Count . INTERCONNECTIONS. See www.bgasockets.com for updates or call for latest Footprints supplement. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com	OCR Scan		PDF

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441 BALL BGA Search Results

441 BALL BGA Result Highlights (5)

441 BALL BGA Datasheets Context Search

HXC125

construction of photo diode

E700G

441 ball bga

BGA-56 DATASHEET

Untitled

Untitled

Untitled

footprint 8M1-A

cu pillar

HL832N

BGA reflow guide

wristwatch

SG-BGA-6046

"sd1v4

LSI53C1020A

XC95216-20PQG160I

atmel 946

LSI53C1020A

of 1000 microfarad electrolytic capacitor

diagrams hitachi ecu

35 x 35 PBGA, 580 100 balls

Untitled

uaa 3100