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    Untitled

    Abstract: No abstract text available
    Text: DATE: RELIABILITY REPORT 9/1/04 QUALITY ENG : PART NUMBER : DANA TRINH SY58031UMI 408 474-1078 Die Size PACKAGE TYPE : ASSEMBLY LOC MLF 32L AMKOR 1.33mmx1.36 mm LOT # FAB 2B32003MNE MICREL D/C # ARRAY 0304E GA PROCESS SiGe QUAL PURPOSE: To qualify new Product using GA base array.


    Original     		SY58031UMI 33mmx1 2B32003MNE 0304E 1000H 2000H 2B31003MNH SY58023 3B05001MNCH PDF

    B1340

    Abstract: sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E
    Text: Q1-2004-MICREL- PKG STORAGE LIFE TEST BAKE TA = + 150C Package Family PKG Type Lds Device WM W-SOIC W-SOIC W-SOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC 16 16 16 20 28 28 28 28 28 28 28 MIC2027 MIC2527 MIC2527 MIC2177 MIC1700B SY69952ZC SY69952ZC


    Original     		Q1-2004-MICREL- MIC2027 MIC2527 MIC2177 MIC1700B SY69952ZC SY87701V B1340 sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E PDF