Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    32-PIN QFN PCB LAYOUT GUIDE Search Results

    32-PIN QFN PCB LAYOUT GUIDE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    32-PIN QFN PCB LAYOUT GUIDE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    jedec footprint MO-220 VHHD-2

    Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    AN4077

    Abstract: No abstract text available
    Text: Freescale Semiconductor Application Note Document Number: AN4077 Rev. 2, 10/2012 MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low-g consumer grade


    Original     		AN4077 MMA845xQ AN4077 PDF

    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    AN4077

    Abstract: Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8
    Text: AN4077 Rev 0, 09/2010 Freescale Semiconductor Application Note MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low g consumer grade


    Original     		AN4077 MMA845xQ AN4077 Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8 PDF

    IPC-D-330

    Abstract: AN3962 QFN PCB Layout guide JESD51-2 32-Pin QFN package power dissipation freescale pcb thermal Design guide pcb trace IEC-664 insulation distances JESD 51-2
    Text: Freescale Semiconductor Application Note AN3962 Rev. 2.0, 8/2010 PCB Layout Design Guide for Analog Applications By: Edward Lee, Rafael Garcia Mora 1 Purpose PCB Layout design is essential to better performance, reliability and manufacturability. Malfunctions from poor heat


    Original     		AN3962 IPC-D-330 AN3962 QFN PCB Layout guide JESD51-2 32-Pin QFN package power dissipation freescale pcb thermal Design guide pcb trace IEC-664 insulation distances JESD 51-2 PDF

    IPC-D-330

    Abstract: JESD51-2
    Text: Freescale Semiconductor Application Note AN3962 Rev. 1.0, 10/2009 PCB Layout Design Guide for Analog Applications By: Edward Lee, Rafael Garcia Mora 1 Purpose PCB Layout design is essential to better performance, reliability and manufacturability. Malfunctions from poor heat


    Original     		AN3962 IPC-D-330 JESD51-2 PDF

    ECS-200-CDX-0914

    Abstract: LQM18FN GRM610C0G010B25K500 AYU1-1P-02676-120 ECS 327-12.5-34b SPI flash PCB LAYOUT GUIDE DUST Networks LQM18FN2R2m00d QH072AF2A wave guide
    Text: Dust Networks Eterna Integration Guide Table of Contents About This Audience .3


    Original     		PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220 PDF

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8 PDF

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220 PDF

    VCO19V

    Abstract: BNX002-01 VCO-19V TCO-986 GMC10CG100J50NT tco986 293D106X9016B2T TRF3750 DB25F-RA 745536-2
    Text: TRF3750 QFN/TSSOP Evaluation Module User’s Guide 2004 Wireless Infrastructure Products SLWU009 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue


    Original     		TRF3750 SLWU009 DB25F-RA 26-Aug-2004 VCO19V BNX002-01 VCO-19V TCO-986 GMC10CG100J50NT tco986 293D106X9016B2T TRF3750 DB25F-RA 745536-2 PDF

    R42 SOT223

    Abstract: 10UF 150UH 2N2222 W682388 ZX5T955G winbond CODEC AN-CS006a
    Text: W682388 Layout Guideline Rev 1.3 - AN-CS006a W682388 Pro-X CODEC Layout Guideline 1. W682388 Layout Considerations The Winbond W682388 Pro-X™ CODEC family is an excellent solution for short loop telephony applications. Place the components carefully to insure best performance. This document outlines critical


    Original     		W682388 AN-CS006a D00336 AN-CS006a R42 SOT223 10UF 150UH 2N2222 ZX5T955G winbond CODEC PDF

    MMA845x

    Abstract: mma8452 MMA8453 MMA8452 calibration mma8452 I2C mma8452q MMA8451 MMA845XQ MC9S08QE8 MMA8453Q
    Text: AN3923 Rev 1, 02/2010 Freescale Semiconductor Application Note MMA8450Q Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA8450Q and/or other family derivatives.


    Original     		AN3923 MMA8450Q MMA845xQ MMA8450Q. MMA845x mma8452 MMA8453 MMA8452 calibration mma8452 I2C mma8452q MMA8451 MC9S08QE8 MMA8453Q PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Application Note Document Number: AN4622 Rev. 4.0, 6/2013 MMPF0100 and MMPF0200 Layout Guidelines 1 Introduction This document describes good practices for the layout of PF0100 and PF0200 devices on printed circuit boards. Though the guidelines are applicable to PF0100 and PF0200,


    Original     		AN4622 MMPF0100 MMPF0200 PF0100 PF0200 PF0200, PF0100Z PDF

    epoxy prepreg panasonic

    Abstract: Capacitor tantalum 0402 10uF/16V IPC-600-A IPC-SM-840 type b class 2 ceramic capacitor 1uf/16v UAR10-4W5100 IPC-6011 ipc sm 840 CMD15-21VRC smd diode s1
    Text: WirelessUSB LS Micro-Bridge Layout Guidelines The PCB Is a Component of Your Wireless Communication Product Design This application note provides guidelines for micro-bridge printed circuit board PCB design using the WirelessUSB™ LS 2.4-GHz DSSS Radio IC and its application as an


    Original     		PDF

    GS12141

    Abstract: No abstract text available
    Text: UHD-SDI FEATURING New UHD-SDI Solutions Broadcast Video Selector Guide • • • • Equalizers Cable Drivers Reclockers Configurable Input/Output Devices • • • • Transmitters Receivers Crosspoint Switches Timing Spring 2015 Complete Portfolio of Broadcast UHD-SDI solutions


    Original     		Broadcast-SG15 GS12141 PDF

    EBK-GS3490-00

    Abstract: No abstract text available
    Text: video Featuring New UHD-SDI Solutions Broadcast Video Selector Guide • Equalizers • Cable Drivers • Reclockers • Configurable SDI I/O • SDI Transmitters • SDI Receivers • Crosspoint Switches • Timing Gen-Clocks Spring 2014 End-To-End Portfolio of Broadcast Video Solutions


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: video Featuring New UHD-SDI Solutions Broadcast Video Selector Guide • Equalizers • Cable Drivers • Reclockers • Configurable SDI I/O • SDI Transmitters • SDI Receivers • Crosspoint Switches • Timing Gen-Clocks Spring 2014 End-To-End Portfolio of Broadcast Video Solutions


    Original     		Broadcast-SG14 PDF

    CH7317A

    Abstract: crt monitor spc 17" schematic CH7317A-BF FS8660 25CJ Chrontel CH7317A application notes 965GM EC2SMC-27MHz CH7317 22PF 74ACT08
    Text: AN-99 Chrontel CHRONTEL CHRONTEL CHRONTEL Application Notes PCB Layout and Design Considerations for the CH7317A SDVO* / RGB DAC 1. Introduction This application note focuses on the basic PCB layout and design guidelines for the CH7317A VGA RGB Bypass Output


    Original     		AN-99 CH7317A crt monitor spc 17" schematic CH7317A-BF FS8660 25CJ Chrontel CH7317A application notes 965GM EC2SMC-27MHz CH7317 22PF 74ACT08 PDF

    schematic diagram scart to vga

    Abstract: schematic diagram vga to scart 7 pin mini din schematic diagram vga to rca c5027-0 CH7022 S-video 4 pin to 7pin 965GM CH7021 schematic diagram vga to svideo
    Text: AN-84 Chrontel CHRONTEL CHRONTEL CHRONTEL Application Notes PCB Layout and Design Considerations for the CH7021/CH7022 Encoder 1. Introduction This application note focuses on the basic PCB layout and design guidelines for the CH7021/CH7022 SDTV/HDTV Output


    Original     		AN-84 CH7021/CH7022 schematic diagram scart to vga schematic diagram vga to scart 7 pin mini din schematic diagram vga to rca c5027-0 CH7022 S-video 4 pin to 7pin 965GM CH7021 schematic diagram vga to svideo PDF

    pcb design of zigbee

    Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
    Text: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor


    Original     		CH370 pcb design of zigbee FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32 PDF

    p950003

    Abstract: aasupreme ESMIT 4180 aasupreme P950003 73M1906 73M1966B tg-utb01543s 4181 sumida 73M1916-20 UTB01543S
    Text: A Maxim Integrated Products Brand 73M1866B/73M1966B MicroDAA with PCM Highway APPLICATION NOTE AN_1x66B_003 October 2009 73M1866B/73M1966B Schematic and Layout Guidelines Introduction This application note provides layout recommendations that must be followed when integrating the 73M1866B


    Original     		73M1866B/73M1966B 73M1866B/73M1966B 73M1866B 73M1966B 73M1x66B 73M1866B 73M1966B. p950003 aasupreme ESMIT 4180 aasupreme P950003 73M1906 tg-utb01543s 4181 sumida 73M1916-20 UTB01543S PDF

    FS8660

    Abstract: CH7317B-BF CH7317B 965GM FS8660 25CJ CH7317 fs8660-25cj 100MHZ 22PF 74ACT08
    Text: AN-113 Chrontel CHRONTEL CHRONTEL CHRONTEL Application Notes PCB Layout and Design Considerations for CH7317B SDVO* / RGB DAC 1. Introduction This application note focuses on the basic PCB layout and design guidelines for the CH7317B VGA RGB Bypass Output


    Original     		AN-113 CH7317B FS8660 CH7317B-BF 965GM FS8660 25CJ CH7317 fs8660-25cj 100MHZ 22PF 74ACT08 PDF

    power amplifier circuit diagram with pcb layout b

    Abstract: R1375 AN1193 EL4342 ISL59445 power amplifier circuit diagram with pcb layout 1 MBR0550T
    Text: ISL59445/EL4342E1 Evaluation Board User’s Guide Application Note April 21, 2005 AN1193.0 Introduction High Frequency Layout Considerations The ISL59445/EL4342E1 evaluation board contains all the circuitry needed to characterize critical performance parameters of the ISL59445 and EL4342 triple 4:1 MUXamplifiers, over a variety of applications.


    Original     		ISL59445/EL4342E1 AN1193 ISL59445 EL4342 500MHz ISL59445 EL4342 500MHz) 1/16W, power amplifier circuit diagram with pcb layout b R1375 power amplifier circuit diagram with pcb layout 1 MBR0550T PDF