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    32-LEAD, THIN 1.0 MM PLASTIC QUAD FLAT PACKAGE Search Results

    32-LEAD, THIN 1.0 MM PLASTIC QUAD FLAT PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    32-LEAD, THIN 1.0 MM PLASTIC QUAD FLAT PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    A48A

    Abstract: A101 120-PIN 7x7x1.4 160-PIN plastic quad flat pack 10X10X1.4 tqfp 44
    Text: Package Diagrams Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.4 mm A32.14 51-85088-*B 1 Package Diagrams 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 44-Lead Thin Plastic Quad Flat Pack 10 x 10 x 1.0 mm A44SB


    Original     		PDF 32-Lead 51-85063-B 44-Lead 51-85064-B A44SB 48-Lead 52-Lead A48A A101 120-PIN 7x7x1.4 160-PIN plastic quad flat pack 10X10X1.4 tqfp 44

    mitsubishi 32 pin SOP

    Abstract: hssop
    Text: Single Inline Package Heat sink Single Inline Package Zig-zag Inline Package Dual Inline Package Shrink Dual Inline Package SIP HSIP ZIP DIP SDIP PACKAGE – 2.54 1.778 2.54 1.27 750 600 500 400 300 600 400 300 400 325 – – 2.54 1.778 WIDTH mil LEAD PITCH


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    nec 44 pin LQFP

    Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
    Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 nec 44 pin LQFP BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


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    tsop 48 PIN type2

    Abstract: 50 mil pitch ceramic package BGA and QFP Package mounting 64 pin IC FOUR SIDE 48 pin ic qfj 84-Pin QFN
    Text: Packages for IC Through-hole mount type DIP Surface mount type1 SIP Dual In-line Package (Single In-line Package) Terminals are on one side of the package and are arranged in a row. Terminals are on two opposite sides of the package and are arranged two rows.


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    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B

    atmel 0328

    Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
    Text: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 120C1 32-lead, 44-lead, 48-lead, 0555H 08/00/xM atmel 0328 jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB

    SAA7136E

    Abstract: saa7136 SAA7135 TO-220F JEDEC SAA7134 hso16 philips SAA7134 SAA7131E Philips SAA7130 SAA7133
    Text: PCI Digital A/V Decoders PCI DIGITAL AUDIO/VIDEO DECODERS Typenumber SAA7130H SAA7134H SAA7133H SAA7135H SAA7131E SAA7136E SAA7136HS PCI PCI PCI PCI PCI PCI PCI Description Digital Audio/Video Decoders Digital Audio/Video Decoders Digital Audio/Video Decoders


    Original     		PDF SAA7130H SAA7134H SAA7133H SAA7135H SAA7131E SAA7136E SAA7136HS OT425 LQFP128) SAA7136E saa7136 SAA7135 TO-220F JEDEC SAA7134 hso16 philips SAA7134 SAA7131E Philips SAA7130 SAA7133

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545

    20P3

    Abstract: MS-001 MS-011 MS-016 MS-018
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP).7-4


    Original     		PDF 28-Lead, 20-Lead, 20P3 MS-001 MS-011 MS-016 MS-018

    fcBGA PACKAGE thermal resistance

    Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
    Text: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America


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    manchester verilog decoder

    Abstract: Philips Semiconductors Selection Guide pzlcp AN057
    Text: Philips Semiconductors CONTENTS IC27: Complex Programmable Logic Devices CPLDs Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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    SOT23W-3

    Abstract: MS-018-AC tssop 38 footprint PLCC 44 pin through hole MO-220WGGC SOT23 MARK EW PUB26013 transistor crossreference DUAL ROW QFN leadframe MS-018AC
    Text: Product Information Allegro Package Designations This document provides reference information as an aid to differentiating the device package types used by Allegro MicroSystems. It provides cross references to the package designation, an Allegro code that is integrated into the device part number:


    Original     		PDF PUB26013 SOT23W-3 MS-018-AC tssop 38 footprint PLCC 44 pin through hole MO-220WGGC SOT23 MARK EW transistor crossreference DUAL ROW QFN leadframe MS-018AC

    ATmega1284

    Abstract: ATMEGA164A ATMEGA644PA-AU ATMEGA324PA-AUR ATMEGA324A ATMEGA644PA ATMEL 1284p ATMEGA644PA-PU ATmega1284P-PU 324A
    Text: Features • High-performance, Low-power AVR 8-bit Microcontroller • Advanced RISC Architecture • • • • • – 131 Powerful Instructions – Most Single-clock Cycle Execution – 32 x 8 General Purpose Working Registers – Fully Static Operation


    Original     		PDF 16/32/64/128K 512B/1K/2K/4K 1/2/4/16K 8272AS ATmega1284 ATMEGA164A ATMEGA644PA-AU ATMEGA324PA-AUR ATMEGA324A ATMEGA644PA ATMEL 1284p ATMEGA644PA-PU ATmega1284P-PU 324A

    SOT23W-3

    Abstract: transistor crossreference footprint soic 16 soic pcb footprint DFN 10 socket EK QFN MS-018AC qfn 44 PACKAGE footprint qsop 16 pcb footprint SOT23 MARK EW
    Text: Product Information Allegro Package Designations This document provides reference information as an aid to differentiating the device package types used by Allegro MicroSystems. It provides cross references to the package designation, an Allegro code that is integrated into the device part number:


    Original     		PDF PUB26013 SOT23W-3 transistor crossreference footprint soic 16 soic pcb footprint DFN 10 socket EK QFN MS-018AC qfn 44 PACKAGE footprint qsop 16 pcb footprint SOT23 MARK EW

    Untitled

    Abstract: No abstract text available
    Text: LSI CSP • CSP Chip Size Package •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and


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    sqfp 14x20

    Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
    Text: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has


    Original     		PDF 30MHz 80C51 sqfp 14x20 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes

    ATMEGA328P-AU

    Abstract: ATMEGA328P-PU atmel 328 ATMEL ATmega328P-MU ATMEGA88A-AU ATMEGA328P-MU
    Text: Atmel 8-bit Microcontroller with 4/8/16/32KBytes InSystem Programmable Flash ATmega48A; ATmega48PA; ATmega88A; ATmega88PA; ATmega168A; ATmega168PA; ATmega328; ATmega328P SUMMARY Features • • • • • • • • • • • High Performance, Low Power Atmel AVR® 8-Bit Microcontroller Family


    Original     		PDF 4/8/16/32KBytes ATmega48A; ATmega48PA; ATmega88A; ATmega88PA; ATmega168A; ATmega168PA; ATmega328; ATmega328P 20MHz ATMEGA328P-AU ATMEGA328P-PU atmel 328 ATMEL ATmega328P-MU ATMEGA88A-AU ATMEGA328P-MU

    JEDEC Matrix Tray outlines

    Abstract: IspLSI PCMCIA copper bond wire micro semi BGD35
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


    Original     		PDF JESD51, JEDEC Matrix Tray outlines IspLSI PCMCIA copper bond wire micro semi BGD35

    Datasheet of IC 7432

    Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
    Text: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type


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    Untitled

    Abstract: No abstract text available
    Text: Atmel ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P 8-bit Atmel Microcontroller with 16/32/64KB In-System Programmable Flash SUMMARY Features • • • • • • • • • • • High performance, low power Atmel AVR® 8-Bit Microcontroller Advanced RISC architecture


    Original     		PDF ga165A/PA/325A/PA/3250A/PA/645A/P/6450A/P 16/32/64KB 16MIPS 16MHz ATmega165PA/645P) 20MIPS 20MHz /325A/325PA/645A/3250A/3250PA/6450A/6450P 16KBINESS

    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES

    Abstract: AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


    Original     		PDF JESD51, EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP

    ATMEGA328P-PU

    Abstract: ATmega328 datasheet ATMEGA328 ATMEGA168PA-AU atmega328p-pu datasheet ATMEGA328-MU ATMEGA168A-AU ATMEGA48PA-AU atmega328 adc ATMEGA328-AU
    Text: Features • High Performance, Low Power AVR 8-Bit Microcontroller • Advanced RISC Architecture • • • • • • • • – 131 Powerful Instructions – Most Single Clock Cycle Execution – 32 x 8 General Purpose Working Registers – Fully Static Operation


    Original     		PDF 4/8/16/32K 256/512/512/1K 512/1K/1K/2K Flash/100 C/100 8271BS ATMEGA328P-PU ATmega328 datasheet ATMEGA328 ATMEGA168PA-AU atmega328p-pu datasheet ATMEGA328-MU ATMEGA168A-AU ATMEGA48PA-AU atmega328 adc ATMEGA328-AU

    Untitled

    Abstract: No abstract text available
    Text: XC9572XV High-performance CPLD R DS052 v2.3 May 31, 2002 5 Features • • • • • • • • 72 macrocells with 1,600 usable gates Available in small footprint packages - 44-pin PLCC (34 user I/O pins) - 44-pin VQFP (34 user I/O pins) - 48-pin CSP (38 user I/O pins)


    Original     		PDF XC9572XV DS052 XC9500XV