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    313 PIN PBGA Search Results

    313 PIN PBGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    313 PIN PBGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    A-18

    Abstract: MPC555 QADC64 272-Pin
    Text: LIST OF TABLES Table 2-1 2-2 2-3 2-4 2-5 2-6 Title Page MPC555 Pin Functions for 272-Pin PBGA . 2-3 Pin Functionality Table . 2-6


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    PDF MPC555 272-Pin MPC555 A-18 QADC64

    TUNDRA CA91C142D-33CE

    Abstract: CA91C142D-33CEV DBGA CA91C142D CA91C142D-33CE Tundra Semiconductor ca91c142d CA91C142D-33IE 33-/tundra universe tools
    Text: Investor Relations Home  • Products  · Bridges | Careers | News | Partners | Contact Us | Extranet · Universe II Search · Technical Specifications other Bridges Technical Specifications  ? ? ? ? ? ? ? ? ? ? ? ? ? ? Industry - proven, high performance 64


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    PDF 33MHz 25MHz Tsi578 Tsi381 TUNDRA CA91C142D-33CE CA91C142D-33CEV DBGA CA91C142D CA91C142D-33CE Tundra Semiconductor ca91c142d CA91C142D-33IE 33-/tundra universe tools

    A20 1453

    Abstract: A-20 MPC555 QADC64
    Text: Paragraph Number 2-1 2-2 2-3 2-4 2-5 2-6 LIST OF TABLES Page Number MPC555 Pin Functions for 272-Pin PBGA . 2-4 Pin Functionality Table . 2-7


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    PDF MPC555 272-Pin MPC555 A20 1453 A-20 QADC64

    atmel 216

    Abstract: TQFP 132 PACKAGE TQFP216 BGA-121
    Text: Packaging Introduction Atmel pairs its high-performance silicon with packages, custom designed for the company’s gate arrays. Atmel offers our gate arrays in ceramic and plastic packages. Atmel’s plastic through hole and surface mount packages come in a


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    PDF MIL-STD-883D atmel 216 TQFP 132 PACKAGE TQFP216 BGA-121

    vhdl code for pci 9056

    Abstract: 9056 9656 PCI AA66BI MPC850 MPC860 IOP480 plx vhdl code j mode marconi company PCI 9056 Detailed Technical Specifications
    Text: IMPORTANT: See the document titled, PCI 9056 Blue Book Revision 0.91 Correction, before designing to this Blue Book. That correction document includes details on features omitted from this Blue Book and it corrects incorrect information in this Blue Book. Please download


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    PDF com/products/9056/ vhdl code for pci 9056 9056 9656 PCI AA66BI MPC850 MPC860 IOP480 plx vhdl code j mode marconi company PCI 9056 Detailed Technical Specifications

    PCI9056

    Abstract: pci 9056 vhdl vhdl code for pci 9056 9656A 9056 pci bridge
    Text: PLX Technology, Inc. 390 Potrero Avenue, Sunnyvale, CA USA 94085 Tel: 408 774-9060 Fax: 408 774-2169 C ONFIDENTIAL & P ROPRIETARY P RELIMINARY I NFORMATION PCI 9056 Data Book The enclosed specification is the confidential, proprietary, and copyrighted intellectual property of PLX Technology, Inc. This item may not be


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    PDF Index-24 PCI9056 pci 9056 vhdl vhdl code for pci 9056 9656A 9056 pci bridge

    nitto GE-100L

    Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
    Text: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA


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    nitto GE

    Abstract: GE-100L nitto GE-100L Nitto GE 100 313 pin PBGA te2 219 Ablestik 2300 NITTO GE- 100L CO-029
    Text: LAMINATE data sheet PBGA Features: Plastic Ball Grid Array PBGA : Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application


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    D1065

    Abstract: CX486slc D20850-40 Cyrix CX486slc 486DX2 DIMENSIONS pqfp 100 D10650 D10650-40 heat sink D1085
    Text: Integrated Circuit Heat Sinks DELTEM COMPOSITE HEAT SINKS FOR PQFPs, CQFPs, AND BGAs Deltem™ D10650-40 Pin Fin Heat Sink for 100-Lead PQFPs, 169 BGA Standard P/N D10650-40 ̆ 84, 100 PQFP, 169 BGA Base Dimensions in. mm Height in. (mm) Weight lbs. (grams)


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    PDF D10650-40 100-Lead D10650-40 D10850-40 i960KATM, Cx486SLC, D10850-40 486DX2 D20850-40 D1065 CX486slc D20850-40 Cyrix CX486slc 486DX2 DIMENSIONS pqfp 100 D10650 heat sink D1085

    AB244A

    Abstract: R488A AD9361 AK2177 CMOS-9HD UPD65891 N526A PD65891 tqfp 64 thermal resistance nec PD65881
    Text: Design Manual CMOS Gate Array, Embedded Array Package Ver. 4.0 Target Series CMOS-N5 Series CMOS-9HD Series CMOS-10HD Series EA-9HD Series Document No. A16400EJ4V0DM00 4th edition Date Published December 2004 NS CP(N) NEC Electronics Corporation 2002


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    PDF CMOS-10HD A16400EJ4V0DM00 A16400EJ4V0DM IR50-203-3-37 IR50-207-3-37 AB244A R488A AD9361 AK2177 CMOS-9HD UPD65891 N526A PD65891 tqfp 64 thermal resistance nec PD65881

    61a3 mosfet

    Abstract: m21 sot23 transistor fairchild aa11 L0DA A10 sot23-5 transistor m21 sot23 h1 sot23-5 honda 20 pin connector pinout ADSP-TS101S f21 diode sot23
    Text: ADSP-TS101S EZ-KIT Lite Evaluation System Manual Revision 1.1, March 2004 Part Number 82-000635-01 Analog Devices, Inc. One Technology Way Norwood, Mass. 02062-9106 a Copyright Information 2004 Analog Devices, Inc., ALL RIGHTS RESERVED. This document may not be reproduced in any form without prior, express written


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    PDF ADSP-TS101S 61a3 mosfet m21 sot23 transistor fairchild aa11 L0DA A10 sot23-5 transistor m21 sot23 h1 sot23-5 honda 20 pin connector pinout f21 diode sot23

    CA91C078A-33IQ

    Abstract: CA91C142D-33IE CA91C142D-33CE CA91C142B-33CE CA91C142B-33IE CA91C078A-33CQ QLD 9712 CA91C142B-33IB TUNDRA CA91C142D-33CE CA91L8260B-100CL
    Text: Tundra System Interconnect www.tundra.com Tundra designs and delivers high-impact semiconductor products that enable innovative architectures in communications infrastructure and storage systems. The ever-growing demand for bandwidth from Internet and network users means communications


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    PDF SCV64, CA91C078A-33IQ CA91C142D-33IE CA91C142D-33CE CA91C142B-33CE CA91C142B-33IE CA91C078A-33CQ QLD 9712 CA91C142B-33IB TUNDRA CA91C142D-33CE CA91L8260B-100CL

    atmel 0945

    Abstract: atmel 428
    Text: pkg-3.5-04/98 Packaging Introduction . 4-3 Package Options: Table . 4-3


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    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


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    PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    transistor nec 8772

    Abstract: NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912
    Text: Freescale Semiconductor, Inc. MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005


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    PDF AN1231/D AN1231 transistor nec 8772 NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912

    transistor nec 8772

    Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


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    PDF AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry

    Untitled

    Abstract: No abstract text available
    Text: PCI 6350 Data Book PCI 6350 Data Book Version 0.73 June 2004 Website: Technical Support: Phone: FAX: http://www.plxtech.com http://www.plxtech.com/support/ 408 774-9060 800 759-3735 408 774-2169 2004 PLX Technology, Inc. All rights reserved. PLX Technology, Inc., retains the right to make changes to this product at any time, without notice. Products may


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    BR1570

    Abstract: MC92600 MC92600CJUB MC92600JUB MC92600ZTB MC92610
    Text: MC92600 Quad 1.25 Gbaud SerDes Reference Manual MC92600RM Rev. 3, 06/2005 Contents Paragraph Number Title Page Number About This Book Audience . xi


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    PDF MC92600 MC92600RM BR1570 MC92600 MC92600CJUB MC92600JUB MC92600ZTB MC92610

    Untitled

    Abstract: No abstract text available
    Text: MC92600UM/D 05/2002 REV 1.0 MC92600 WarpLink Quad 1.0 User’s Manual Devices Supported: MC92600CJUB MC92600JUB MC92600ZTB HOW TO REACH US: USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution P.O. Box 5405, Denver, Colorado 80217 1-303-675-2140 or 1-800-441-2447


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    PDF MC92600UM/D MC92600 MC92600CJUB MC92600JUB MC92600ZTB 8B/10B

    HG73M

    Abstract: IBM "embedded dram" HG71C HG73C Hitachi Semiconductor Hitachi DSA00186
    Text: HG72C Series µCBIC - embedded SH-1 RISC ASIC Product Brief Description The HG72C Series is a family of cell-based integrated circuits CBICs implemented in advanced 0.6µm CMOS process technology featuring 5.0 V and 3.3 V low-voltage core operation. Process-optimized


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    PDF HG72C HG73M IBM "embedded dram" HG71C HG73C Hitachi Semiconductor Hitachi DSA00186

    Untitled

    Abstract: No abstract text available
    Text: MC92600UM/D 07/2002 REV 1.0 MC92600 WarpLink Quad 1.0 User’s Manual Devices Supported: MC92600CJUB MC92600JUB MC92600ZTB HOW TO REACH US: USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution P.O. Box 5405, Denver, Colorado 80217 1-303-675-2140 or 1-800-441-2447


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    PDF MC92600UM/D MC92600 MC92600CJUB MC92600JUB MC92600ZTB 8B/10B

    Untitled

    Abstract: No abstract text available
    Text: MC92600UM/D 05/2002 REV 1.0 MC92600 WarpLink Quad 1.0 User’s Manual Devices Supported: MC92600CJUB MC92600JUB MC92600ZTB HOW TO REACH US: USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution P.O. Box 5405, Denver, Colorado 80217 1-303-675-2140 or 1-800-441-2447


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    PDF MC92600UM/D MC92600 MC92600CJUB MC92600JUB MC92600ZTB 8B/10B

    313 pin PBGA

    Abstract: ami 2470
    Text: AMI A M ! S E M IC O N D U C T O R % s PBGA Packaging Capabilities . . Description Surface Mount The Plastic Ball Grid Array PBGA is a high density surface mount package for low stress operating environments. The package includes BT Laminate base, plastic overmolded body and tin-lead solder balls. With the thermal


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    vhdl code Wallace tree multiplier

    Abstract: am 2901 verilog vhdl code for Wallace tree multiplier LCB405K verilog code for 8*8 wallace tree multiplier LSI Logic EPBGA
    Text: LSI LOGIC 5-Volt, Submicron 405K ASIC Products Preliminary Datasheet Cost Effective 5-Volt ASICs 405K ASIC products provide optimal solutions to meet the cost and performance requirements of today’s 5-volt mainstream applications, such as PC system logic, add-in cards,


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    PDF 65-micron vhdl code Wallace tree multiplier am 2901 verilog vhdl code for Wallace tree multiplier LCB405K verilog code for 8*8 wallace tree multiplier LSI Logic EPBGA