Untitled
Abstract: No abstract text available
Text: DATE: RELIABILITY REPORT 9/1/04 QUALITY ENG : PART NUMBER : DANA TRINH SY58031UMI 408 474-1078 Die Size PACKAGE TYPE : ASSEMBLY LOC MLF 32L AMKOR 1.33mmx1.36 mm LOT # FAB 2B32003MNE MICREL D/C # ARRAY 0304E GA PROCESS SiGe QUAL PURPOSE: To qualify new Product using GA base array.
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SY58031UMI
33mmx1
2B32003MNE
0304E
1000H
2000H
2B31003MNH
SY58023
3B05001MNCH
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MLF44
Abstract: No abstract text available
Text: SiGe 0.6 micron BiPolar Process OPERATING LIFE @ Tj = + 130-150c at rated Voltage Family Device Lot. Pkg Qty Vcc Hrs Act Rej Hrs Act Rej Hrs Act Rej Hrs Act Rej Dev.Hrs GL GL GL GL SY58016 SY58016 SY58016 SY58016 B479H B791GA B999F 3A44764MED TSSOP-16 MLF-16
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130-150c
SY58016
B479H
B791GA
B999F
3A44764MED
TSSOP-16
MLF44
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B1340
Abstract: sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E
Text: Q1-2004-MICREL- PKG STORAGE LIFE TEST BAKE TA = + 150C Package Family PKG Type Lds Device WM W-SOIC W-SOIC W-SOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC 16 16 16 20 28 28 28 28 28 28 28 MIC2027 MIC2527 MIC2527 MIC2177 MIC1700B SY69952ZC SY69952ZC
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Q1-2004-MICREL-
MIC2027
MIC2527
MIC2177
MIC1700B
SY69952ZC
SY87701V
B1340
sy10s897
TSMC 0.18 um CMOS
2A243
bcd3
cmos tsmc 0.18
TSMC 0.25Um
MIC29203BU
Unisem
B816E
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