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Catalog Datasheet	MFG & Type	PDF	Document Tags
MP8000C Abstract: SN20 MIC2563A-0YSM MIC2563A-1YSM PCB BOARD DIMENSION Text: RELIABILITY REPORT DATE: 1/16/04 QUALITY ENG : PURPOSE: Dinh Pham Lead Free Package Qualification. PART # : PACKAGE TYPE : ASSEMBLY LOC M.COMPD LOT # FAB D/C # PROCESS MIC2563A-1YSM 28L SSOP UNISEM MP8000C 2A28088M01 SJ 0309 BCD3 MIC2563A-0YSM 28L SSOP UNISEM	Original	PDF	MIC2563A-1YSM MP8000C 2A28088M01 MIC2563A-0YSM 2A33343M04 3A32765M42 MIL-STD-883 MP8000C SN20 MIC2563A-0YSM MIC2563A-1YSM PCB BOARD DIMENSION
MIC29151WU Abstract: MIC2171WU MIC29151BU MIC2177YWM 20L SOT-23 UNISEM Preconditioning 3a204 Text: RELIABILITY REPORT DATE: 4/28/2004 QUALITY ENG : Herb Grimm PURPOSE: Matte Tin Reliability Test Summary. HTOL - High Temperature Operating Life Test TA= + 125°C PACKAGE TYPE : PART NO. LOT ID. 168 HR 500 HR 1000HR SSOP 28L MIC2563AYSM 2A28088M01 0/116 0/116	Original	PDF	1000HR MIC2563AYSM 2A28088M01 MIC2177YWM 3A02058MEA OT-23 MIC5248YM 2A09099MEA O-263 MIC29151WU MIC29151WU MIC2171WU MIC29151BU MIC2177YWM 20L SOT-23 UNISEM Preconditioning 3a204
Untitled Abstract: No abstract text available Text: BCD3 - 3 micron BiPolar Process OPERATING LIFE @ TA = +125C AT RATED VOLTAGE Sample Act Size Hrs Fails +12V 116 168 MSOP +12V 110 168 500 SOICW SOIC SOIC SOIC SOIC SOIC MLF MLF SOT-23 SOT-23 SOIC SOIC SOIC +18.0V +32.0V +32.0V +14V +14V +14V +32.0V +32.0V	Original	PDF	OT-23
B1340 Abstract: sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E Text: Q1-2004-MICREL- PKG STORAGE LIFE TEST BAKE TA = + 150C Package Family PKG Type Lds Device WM W-SOIC W-SOIC W-SOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC 16 16 16 20 28 28 28 28 28 28 28 MIC2027 MIC2527 MIC2527 MIC2177 MIC1700B SY69952ZC SY69952ZC	Original	PDF	Q1-2004-MICREL- MIC2027 MIC2527 MIC2177 MIC1700B SY69952ZC SY87701V B1340 sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E