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    MBH29002

    Abstract: MBH29002-H12 CMBA022929 29x29mm
    Text: MBH29002 Series=CMBA022929 MBH29002-H12 MBH29002-H25 = 1373258 = 1373259 Model : CMBA022929 Series For 29x29 Chip set BGA Heat Sink CMBA022929 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 29x29mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm


    Original     		PDF MBH29002 CMBA022929 MBH29002-H12 MBH29002-H25 CMBA022929 29x29 29x29mm UL94-V0) 15x15 MBH29002-H12 29x29mm

    NEC VR4300

    Abstract: JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28
    Text: High Performance! Contents 目次 1. BGA とは？ ―――――――――――――― 3 2. NEC の BGA は？ ―――――――――――― 3 3. 特徴 ―――――――――――――――――― 4 4. パッケージ写真 ――――――――――――― 6


    Original     		PDF 208QFP 225BGA 20down 56down 225BGA C13550JJ1V0PF00 NEC VR4300 JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28

    H5RS1H23MFR

    Abstract: APW7141 92HD81B1c5 8205S jmb385 Marvell 88E8057 H5RS1H23MFR-N0C 1001 fba hybrid 92HD81B AT24C02B
    Text: 5 4 3 M09H1 Block Diagram D 1 SYSTEM DC/DC INPUTS DCBATOUT 3D3V_S5 800/1066MHz@1.05V PCI-EG Cantiga AGTL+ CPU I/F DDR2 667/800 Channel A TMDS nVIDIA N10P/10M-GS VRAM 1G Hz 32M*32*433~40 71.CNTIG.00U X4 DMI 400MHz Codec 92HD81 MIC In 1D05V_S0 16A AZALIA 1D8V_S3(16A)


    Original     		PDF M09H1 ICS9LPRS365BKLFT-GP 4DN01 RT8205A RT8209B RTM875T-606-VD-GRT 800/1066MHz N10P/10M-GS APW7141 H5RS1H23MFR APW7141 92HD81B1c5 8205S jmb385 Marvell 88E8057 H5RS1H23MFR-N0C 1001 fba hybrid 92HD81B AT24C02B

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    E4690

    Abstract: GET56NGBB22GVE GDDR5 phy AMD Athlon 64 X2 dual 4800 pin out E6460 E6760 TEN54LSDV23GME 100-CG2293 6970M RADEON e2400
    Text: A M D EM BE DDE D SOLUTIONS: Product Selection Guide AMD Embedded: The Next Generation of Embedded Computing AMD helps deliver the right balance of CPU, GPU and chipset capabilities, to give designers the solutions they need to create the next generation of embedded applications. Along with a broad range


    Original     		PDF 43838Q E4690 GET56NGBB22GVE GDDR5 phy AMD Athlon 64 X2 dual 4800 pin out E6460 E6760 TEN54LSDV23GME 100-CG2293 6970M RADEON e2400

    AMD Thermal Design Guide socket am3

    Abstract: Phenom II X6 TEN54LSDV23GME AMD ATHLON 64 X2 AM2 pin out RADEON e2400 AMD Phenom II AMD turion 64 X2 TEN40LGAV23GME ATI E2400 E2400
    Text: AMD Embedded Solutions AMD Embedded Solutions Product Selection Guide Product Selection Guide AMD EMBEDDED DISCRETE GRAPHICS AMD Geode Solutions Based Reference Design Kits • LX Ultra Value Client AMD Geode™ LX 800@0.9W2 AMD CS5536 5.5x5 CRT • •


    Original     		PDF 43838H AMD Thermal Design Guide socket am3 Phenom II X6 TEN54LSDV23GME AMD ATHLON 64 X2 AM2 pin out RADEON e2400 AMD Phenom II AMD turion 64 X2 TEN40LGAV23GME ATI E2400 E2400