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    28F032B3 Search Results

    28F032B3 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    28F032B3 Intel SMART 3 ADVANCED BOOT BLOCK, 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY Original PDF

    28F032B3 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    28F400B3

    Abstract: 28F008B3 28F016B3 28F032B3 28F160B3 28F320B3 28F800B3 GT28F032B3BA95 GT28F032B3TA95 intel DOC
    Text: SMART 3 ADVANCED BOOT BLOCK FLASH MEMORY FAMILY SPECIFICATION UPDATE Release Date: August, 1998 Order Number: 297948-003 The 28F008B3, 28F016B3, 28F032B3, 28F400B3, 28F800B3, 28F160B3, 28F320B3 may contain design defects or errors known as errata which may cause the product to


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    PDF 28F008B3, 28F016B3, 28F032B3, 28F400B3, 28F800B3, 28F160B3, 28F320B3 28F400B3 28F008B3 28F016B3 28F032B3 28F160B3 28F320B3 28F800B3 GT28F032B3BA95 GT28F032B3TA95 intel DOC

    28F008B3

    Abstract: 28F016B3 28F032B3 28F160B3 28F320B3 28F400B3 28F800B3 GT28F032B3BA95 GT28F032B3TA95 Intel CSP memory 1998
    Text: SMART 3 ADVANCED BOOT BLOCK FLASH MEMORY FAMILY SPECIFICATION UPDATE Release Date: June, 1998 Order Number: 297948-001 The 28F008B3, 28F016B3, 28F032B3, 28F400B3, 28F800B3, 28F160B3, 28F320B3 may contain design defects or errors known as errata which may cause the product to


    Original
    PDF 28F008B3, 28F016B3, 28F032B3, 28F400B3, 28F800B3, 28F160B3, 28F320B3 28F008B3 28F016B3 28F032B3 28F160B3 28F320B3 28F400B3 28F800B3 GT28F032B3BA95 GT28F032B3TA95 Intel CSP memory 1998

    CBG048-035B

    Abstract: ba date sheet 28f032 free circuit eprom programmer
    Text: HSP ADAPTER SYSTEM GENERAL FLASH EPROM Hi-Speed Programming U B G A4 8 - 4 . H S P S OCK E T B OAR D v Date : 1999/2/6 v Board ID : 20h v Socket : CBG048-035B TI v Devices List : Manufacture Intel Device 28F032B3TA/BA, 28F032C3TA/BA v Programming Time :


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    PDF CBG048-035B 28F032B3TA/BA, 28F032C3TA/BA 28F032B3TA/BA CBG048-035B ba date sheet 28f032 free circuit eprom programmer

    intel 28f160

    Abstract: 28F400B3 28F800B3 28F008B3 28F016B3 28F032B3 28F160B3 28F320B3
    Text: E PRELIMINARY SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY 28F400B3, 28F800B3, 28F160B3, 28F320B3 28F008B3, 28F016B3, 28F032B3 n n n n n n n n Flexible SmartVoltage Technology  2.7 V–3.6 V Read/Program/Erase  12 V VPP Fast Production


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    PDF 32-MBIT 28F400B3, 28F800B3, 28F160B3, 28F320B3 28F008B3, 28F016B3, 28F032B3 64-KB intel 28f160 28F400B3 28F800B3 28F008B3 28F016B3 28F032B3 28F160B3 28F320B3

    INTEL 28F640

    Abstract: Intel 8275 Block diagram 2k36e 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3 28F160B3 28F800B3
    Text: E µBGA* Package Mechanical and Shipping Media Specifications August 1998 Revision 3.11 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in


    Original
    PDF 28F640J5 RD33708SW RD33716SW NP291-04002-G4-BF-P 28F160B3 28F008S3 28F160F3 CBG060-044A INTEL 28F640 Intel 8275 Block diagram 2k36e 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3 28F160B3 28F800B3

    28F640J5a

    Abstract: iMC016FLSG 28F160B3 IMC016FLSC 9021b iMC008FLSC flash memory 5v 16m SmartDie 28F016B3 28F160F3
    Text: Flash Memory Quick Reference Guide ion 4 Vers ’98 June Flash Memory Components for New Designs New designs should be based on Intel’s “components for new designs” shown in bold text in this guide. For information on our full product line, including extended temperature products, contact your Intel Sales representative/distributor or refer to our linecard available on Intel’s Web site.


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    PDF 28F320C3a 28F032C3a 28F320LSA USA/698/10K/MS 28F640J5a iMC016FLSG 28F160B3 IMC016FLSC 9021b iMC008FLSC flash memory 5v 16m SmartDie 28F016B3 28F160F3

    PLCC 44 intel package dimensions

    Abstract: SmartDie 28F008B3 28F008C3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3
    Text: Flash Memory Quick Reference Guide ion 6 Vers ’99 Jan. Intel package lineup Intel Package Lineup • Software Builder–Application software for Intel Flash memory products. • Online Utilities–Understand how Intel® Flash memory products will perform in your application in regards to cycling time/duration and power


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    PDF USA/0199/10K/MS PLCC 44 intel package dimensions SmartDie 28F008B3 28F008C3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3

    INTEL 28F640

    Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
    Text: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


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    PDF 12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3

    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


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    PDF

    SmartDie

    Abstract: 28F008B3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3 28F400B3 28F800B3
    Text: Flash Memory Quick Reference Guide ion 5 Vers ’98 Aug. Intel package lineup Intel Package Lineup Refer to Intel’s World Wide Web Site for Additional Flash Information Development Tools/Electronic Tools Catalog http://developer.intel.com/design/flash/swtools/


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    PDF USA/0898/15K/MS SmartDie 28F008B3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3 28F400B3 28F800B3

    BGA-3000

    Abstract: Intel reflow soldering profile BGA BGA-3102 BGA-3101 convection oven temperature sensor intel 3102 DIAPHRAGM PUMP rtd 2025 vacuum pump 28F008B3
    Text: CSP-UG Chip-Scale Upgrade Kit for BGA-3000 Series Rework System 1 The rapidly emerging Chip-Scale Package has been associated with many challenges in both the rework and prototyping environment. This particular package demands a specifically tailored rework solution while maintaining user-friendliness.


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    PDF BGA-3000 241mm) Intel reflow soldering profile BGA BGA-3102 BGA-3101 convection oven temperature sensor intel 3102 DIAPHRAGM PUMP rtd 2025 vacuum pump 28F008B3

    INTEL 28F640

    Abstract: 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F800B3 intel DOC 28F800F3 intel i5 block diagram
    Text: E µBGA* Package Mechanical and Shipping Media Specifications November 1998 Revision 3.12 11/12/98 2:37 PM REV3_12.doc INTEL CONFIDENTIAL until publication date Information in this document is provided in connection with Intel products. No license, express or implied, by


    Original
    PDF RD33708SW 28F640J5 28F160F3 RD33716SW INTEL 28F640 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F800B3 intel DOC 28F800F3 intel i5 block diagram

    8275 intel

    Abstract: intel d 8275 Intel 8275 28F160B3 28F800B3 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3
    Text: E µBGA* Package Mechanical and Shipping Media Specifications June 1998 Revision 3.9 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in


    Original
    PDF 28F008S3 RD33704SW RD33708SW 28F800B3 RD33716SW 28F160B3 28F640J5 8275 intel intel d 8275 Intel 8275 28F160B3 28F800B3 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3

    INTEL 28F640

    Abstract: transistor b 1238 socket s1 pinouts Advanced Micro Devices 165 ball top mark e5 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3
    Text: E µBGA* Package Mechanical and Shipping Media Specifications March 1999 Revision 3.15 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in


    Original
    PDF RD33704SW RD33708SW 28F800B3 28F160B3 CBG060-044A 28F160B3 28F016B3 28F160C3 CBG048-035C INTEL 28F640 transistor b 1238 socket s1 pinouts Advanced Micro Devices 165 ball top mark e5 28F008B3 28F008S3 28F016S3

    F160B3TA

    Abstract: No abstract text available
    Text: PRELIMINARY SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY 28F400B3, 28F800B3, 28F160B3, 28F320B3 28F008B3, 28F016B3, 28F032B3 n Flexible SmartVoltage Technology — 2.7 V-3.6 V Read/Program/Erase — 12 V V p p Fast Production Programming


    OCR Scan
    PDF 32-MBIT 28F400B3, 28F800B3, 28F160B3, 28F320B3 28F008B3, 28F016B3, 28F032B3 64-KB F160B3TA

    TE28F320

    Abstract: 29058
    Text: SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY 28F400B3, 28F800B3, 28F160B3, 28F320B3 28F008B3, 28F016B3, 28F032B3 • Flexible SmartVoltage Technology — 2.7 V-3.6 V Read/Program/Erase — 12 V Vpp Fast Production Programming ■ 2.7 V or 1.65 V I/O Option


    OCR Scan
    PDF 32-MBIT 28F400B3, 28F800B3, 28F160B3, 28F320B3 28F008B3, 28F016B3, 28F032B3 64-KB TE28F320 29058