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    286DB Price and Stock

    Wakefield-Vette 286-DBE

    HEATSINK TO-220 VERTICAL
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    DigiKey 286-DBE Bulk
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    Onlinecomponents.com 286-DBE
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    Richardson RFPD 286-DBE 1
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    Sager 286-DBE
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    Wakefield-Vette 286DBE

    Heat Sinks Vertical Mount Heat Sink for TO-220, 25.4x12.7x24.1mm, Aluminum, Black Anodized
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    Mouser Electronics 286DBE
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    Onlinecomponents.com 286DBE
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    Square D by Schneider Electric HC4286DB

    Panelboard Enclosure/Box Type 1 86H 42W |Square D By Schneider Electric HC4286DB
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    Newark HC4286DB Bulk 1
    • 1 $280.43
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    RS HC4286DB Bulk 5 Weeks 1
    • 1 $283.23
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    Wakefield-Vette 286-DB

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    Bristol Electronics 286-DB 796
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    286DB Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    286-DBE Wakefield-Vette Fans, Thermal Management - Thermal - Heat Sinks - HEATSINK TO-220 VERTICAL Original PDF

    286DB Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ebonol

    Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
    Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF WTS001 p1-25 O-220, OT-223, SOL-20 ebonol 637-10ABEP MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions

    Untitled

    Abstract: No abstract text available
    Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF WTS001 p1-25 O-220, OT-223, SOL-20

    N10015

    Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF O-220, OT-223, SOL-20 292-AB 292-AB N10015 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01

    DD3150

    Abstract: 316 bcg 563-HH-3421-BC A42 BF 331 531002b00000g to220 mica 1591-TSBK NG-9512E 131-6 wj 78 1554d
    Text: ENCLOSURES AND THERMAL Plastic Enclosures Altech. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1866, 1867 Bud . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1868, 1869, 1870, 1871, 1872, 1873 Bulgin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1874


    Original     		PDF

    ebonol

    Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb

    Wakefield Thermal Solutions TYPE 120

    Abstract: ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 TO38 Laser TO-44 204sb
    Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION


    Original     		PDF

    ebonol

    Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF O-220, OT-223, SOL-20 ebonol abe sot-223 217-36CTRE6 217-36CT6 MO-169

    ebonol

    Abstract: Wakefield Thermal Solutions Wakefield Thermal Solutions TYPE 120 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 207AB TO38 Laser
    Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION


    Original     		PDF