Untitled
Abstract: No abstract text available
Text: Extract from the online catalog UEG-FE BK VPE100 Order No.: 2757584 Product notes WEEE/RoHS-compliant since: 01/01/2003 Commercial data GTIN (EAN) 4017918244750 Note Made-to-order
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VPE100)
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Untitled
Abstract: No abstract text available
Text: Extract from the online catalog UEGM/H-FE BK Order No.: 2757571 Product notes WEEE/RoHS-compliant since: 01/01/2003 Commercial data GTIN EAN 4017918272869 Note Made-to-order
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Untitled
Abstract: No abstract text available
Text: Extract from the online catalog UEGH-BE-MT KPL Order No.: 2757500 Product notes WEEE/RoHS-compliant since: 01/01/2003 Commercial data GTIN EAN 4017918365264 sales group F013
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Untitled
Abstract: No abstract text available
Text: Extract from the online catalog UEGM-SE 5 BK Order No.: 2757568 Side element for electronic housing UEGM . Product notes WEEE/RoHS-compliant since: 01/01/2003 Commercial data
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ebonol
Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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WTS001
p1-25
O-220,
OT-223,
SOL-20
ebonol
637-10ABEP
MO-169
217-36CT6
634-20ABEP
637-15ABEP
236-150ABE-01
abe sot-223
sot-223 package dimensions
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Untitled
Abstract: No abstract text available
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Self-Locking Wavesolderable Heat Sinks 233 AND 236 SERIES Standard P/N PATENT PENDING Height Above PC Board in. mm Footprint Dimensions in. (mm) TO-220 Mounting Solderable Configuration Tab Options
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O-220
233-60AB
233-60AB-01
233-60AB-05
233-60AB-10
236-150AB
236-150AB-01
236-150AB-05
236-150AB-10
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Untitled
Abstract: No abstract text available
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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WTS001
p1-25
O-220,
OT-223,
SOL-20
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cyclohexene
Abstract: 82306 1010218 urea formaldehyde resin adhesive tetrabutyl tin zinc naphthenate hydroquinone manufacturing process calcium chloride p-chlorophenol pentaerythritol
Text: Matsushita Electric Group Chemical Substance Management Rank Guidelines Version 2 July 6, 2000 Matsushita Electric Industrial Co., Ltd. Contents 1. Purpose ････････････････････････････････････････････････････････1
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231-75PAB-14V
Abstract: 251-62AB 216-40CTT wakefield engineering 67 c 945 p 239 c MO-184 REF-10 Wakefield Engineering EIA-481-3 MS-013
Text: BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS D 2PAK, TO-220, SOL-20 Surface Mount Heat Sinks 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Height Above PC Board .390 in. 9.9 .390 in. (9.9) .390 in. (9.9) Package Format Bulk Tube
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O-220,
SOL-20
216-40CT
216-40CTT
216-40CTR
LP-225
231-75PAB-14V
251-62AB
216-40CTT
wakefield engineering 67
c 945 p 239 c
MO-184
REF-10
Wakefield Engineering
EIA-481-3
MS-013
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N10015
Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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O-220,
OT-223,
SOL-20
292-AB
292-AB
N10015
218-40cte3
ebonol
outline of the heat sink for JEDEC
217-36CT6
MO-169
218-40CTE5
217-36CTTE6
unc screw
230-75ABE-01
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217-36CTT6
Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
217-36CTT6
ebonol
217-36CT6
230-75AB-10
MO-169
204-CB
260-6SH5B
215AP
627 Series
260-4T5
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ebonol
Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
260-4TH5B
ebonol c black
205cb
AB-275
204-CB
TUBE 1625
5 lead dd pak weight
260-6SH5B
205-CB
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TUBE 1625
Abstract: MO-169 217-36CT6 230-75AB-10 230-75AB-01 217-36CTT6 234-75AB-05
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOL-20 MECHANICAL DIMENSIONS BOARD LAYOUT RECOMMENDATIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESDMaterial with Nail Stops
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O-220,
SOL-20
217-36CTT6
O-263
MO-169
217-36CT6
TUBE 1625
MO-169
217-36CT6
230-75AB-10
230-75AB-01
217-36CTT6
234-75AB-05
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ebonol
Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
217-36CT6
218-40CT3
218-40CT5
MO-169
204sb
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25t65
Abstract: tl741 FBT Hr f8t5 bu 25200 F20T12 270033 TL835 F28T5 TL830
Text: Phillips Desc Philips Naed 36734-2 367342 375196 375196 37519-6 27556-0 27555-2 27558-6 209957 20995-7 38320-8 373902 373902 37390-2 246611 24661-1 299552 29955-2 299560 29956-0 347815 34781-5 348037 34803-7 37474-4 374769 37476-9 27086-8 239442 22300-8 370221
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100/300/W
100/300W
1000PAR64Q/MFL
1000PAR64Q/NSP
1000PAR64Q/WFL
1000T3
1000T3Q/P/CL
00-90A/99EW
25t65
tl741
FBT Hr
f8t5
bu 25200
F20T12
270033
TL835
F28T5
TL830
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10706H
Abstract: 20606H 20202H 27575 EPXA10 23131H 11413H 22626H 0x20101 12928H
Text: Excalibur Solutions— Using the Excalibur Stripe PLLs July 2002, ver. 1.3 Introduction Application Note 177 This application note describes the operational characteristics of the phase-locked loops PLLs that are located in the embedded stripe of Excalibur embedded processor PLDs, and presents various design
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MMA 200 IGBT
Abstract: mpx capacitor x2 158X 940C 942C UL510 capacitor polyester axial lead cornell dubilier film polyester capacitor
Text: Film Capacitors Film Capacitor Selector Guide Form Factor Construction Type Capacitance Capacitance Voltage Temperature Dissipation Range µF Tolerance Range Range Factor .001 - .5 ±5%, ±10% 50-600 Vdc –55 ºC to 125 ºC .75% Max. –55 ºC to 125 ºC
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atmel 720 24c32
Abstract: atmel 24c04 ISO7816-UART saa 1097 PHILIPS A004 nds ATMEL 24c64 Atmel 24C08 ATMEL 24c32 atmel 24c16 BTA 16 6008
Text: PNX8526 User Manual UM10104_1 Programmable Source Decoder with Integrated Peripherals Rev. 01 — 8 October 2003 Revision History: Version Date Document Status Author s 01 8 October 2003 First release Stephen Hibberd PNX8526 Philips Semiconductors Programmable Source Decoder with Integrated Peripherals
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PNX8526
UM10104
PNX8526
atmel 720 24c32
atmel 24c04
ISO7816-UART
saa 1097 PHILIPS
A004 nds
ATMEL 24c64
Atmel 24C08
ATMEL 24c32
atmel 24c16
BTA 16 6008
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Untitled
Abstract: No abstract text available
Text: SPT5240 10-BIT, 400 MHz CURRENT OUTPUT D/A CONVERTER PRELIMINARY INFORMATION DECEMBER 15, 2001 FEATURES APPLICATIONS • • • • 400 MWPS update rate Differential current output +3.3 V power supply Ultralow power dissipation: 140 mW typ @ƒCLK = 400 MHz
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SPT5240
10-BIT,
SPT5240
10-bit
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Untitled
Abstract: No abstract text available
Text: Alle Rechle vorbehallen/ 411 rights reserred 5 3 k 2 1 D C B A C r i m p Hex SW/AF 2,9mm Crimping with HARTI NG C r i m p t o o l : 09 99 000 0196 c o n s t a n t c u r r e n t : 20A A ll O iie n sio n s in • O rig in a l Size O I N A A l ic h l lo le r ie r le HaBe/ free
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05Cla
00Rie.
D-32339
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PBT-GF20
Abstract: PBT-GF20 CONNECTOR PBT-GF-20 PA6-GB20 GF10 PBTgf20 PBTgf20 connector
Text: 16 15 14 13 12 11 I 10 a SYMBOL DEFI NI TI ON A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL DOES NOT REQUIRE INSPECTION. IT MAY BE CONTROLLED ON THE INDIVIDUAL COMPONENT DRAWING. M cm 9 ±0. 1 •* -% . — , n u DWG STATUS ZONE REVISION HISTORY
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16AU99
03JA00
16JN00
02MY00
10JA00
040C99
ID404324
ID404325
ID404326
ID404327
PBT-GF20
PBT-GF20 CONNECTOR
PBT-GF-20
PA6-GB20 GF10
PBTgf20
PBTgf20 connector
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DIN41626
Abstract: harting connector tb 09 99 000 0196 harting crimp
Text: tile Rechte Vorbehalten/ Á I I rights reserrei Crimp Hex C r i mp i n g HARTING constant SW/ AF All Diiensions in • 2, 9mm ¿ J Original Size OIN A I lechn. [harac1er. complementary with Crimp lichl lolerierle HaBe/free si/e Menaces DIN 41626 Dal. tool:
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D-32339
DIN41626
harting connector tb
09 99 000 0196
harting crimp
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el87
Abstract: No abstract text available
Text: SIZE vs. POWER A Method for Determ ining Approxim ate Sizes O btainable for VA Power Ratings NOTES AND TOLERANCES Transformer and Choke Sizes for Military and Industrial Products MIL SIZES T h e fo llo w in g c h a r t s h o w s th e o b ta in a b le VA p o w e r a v a ila b le in th e M IL c a s e s iz e s lis te d b e lo w . U s e th is h a n d y
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Untitled
Abstract: No abstract text available
Text: For Information On The Following 1 . Transformers rated primal y 250 volts delta, seeondarr 4 10572(10 volts. Please C o r tact Ti e 2. Ii>w temperature rise units usir elass 220” C insulation with either lie (.' or 80 C rise operating temperatun Fac tory
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