CMOS
Abstract: No abstract text available
Text: 1.0 m CMOS Process XC10 MIXED-SIGNAL FOUNDRY EXPERTS One Micron Modular Mixed Signal Technology Description Key Features Applications Quality Assurance Deliverables The XC10 Series is X-FAB‘s One-Micron Modular Mixed Signal Technology. Main target applications
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ED-712IRV
Abstract: No abstract text available
Text: ED-712IRV AlGaAs/AlGaAs Highspeed IrED Chips 880 nm Features : Typical Applications : • AlGaAs/AlGaAs wafer • Very high power • High speed • High performance • Superior thermal stability • IrDA • Encoder • Data Communication Outline Dimensions : Unit: um
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ED-712IRV
120um
270um
180um
285um
x285um
ED-712IRV
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ED-712IRP
Abstract: No abstract text available
Text: ED-712IRP AlGaAs/AlGaAs Highspeed IrED Chips 865 nm Features : Typical Applications : • AlGaAs/AlGaAs wafer • Very high power • High speed • High performance • Superior thermal stability • IrDA • Encoder • Data Communication Outline Dimensions : Unit: um
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ED-712IRP
120um
270um
180um
285um
x285um
ED-712IRP
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TF208TH
Abstract: TF252TH ultra low idss TF222B TF246 FET electret microphone J-FET ultra low Ciss jfet condenser microphone 3MM
Text: T OP I C S News Release Product Topics Released on Jun. 4, 2008 ECM Junction FET 「TF246」 The industry’s smallest package realizing the miniaturization of ∗1 ∗2 portable equipments. TOP share 53% Further increase to 150MPcs/Month! ∗3 ∗1：Electret Condenser Microphone ∗ 2 : as of Jun. 4, 2008 ∗ 3 : based on Sanyo’s 2007 research
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TF246
150MPcs/Month!
150MPcs/M
-108dB
TF246"
TF208TH
TF252TH
ultra low idss
TF222B
TF246
FET electret microphone
J-FET
ultra low Ciss jfet
condenser microphone 3MM
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GaAs wafer
Abstract: No abstract text available
Text: ED-012IRC GaAs/GaAs IrED Chips 940 nm Features : Typical Applications : • GaAs/GaAs wafer • Good spectral matched to si detector • Peripherals • Photocoupler • Photointerrupter Outline Dimensions : Unit: um 285 270 p-Electrode p-GaAs epi layer
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ED-012IRC
110um
270um
280um
285um
285um
GaAs wafer
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NMOS depletion pspice model
Abstract: NMOS MODEL PARAMETERS SPICE "X-Fab" Core cell library PSPICE MODEL R2R bsim3 ADS bsim3 model SPECTRE MODEL QS 100 NPN Transistor RP20 analog devices transistor tutorials
Text: 1.0 m CMOS Process XC10 MIXED-SIGNAL FOUNDRY EXPERTS One Micron Modular Mixed Signal Technology Description Key Features Applications Quality Assurance Deliverables The XC10 Series is X-FAB‘s One-Micron Modular Mixed Signal Technology. Main target applications
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AT1793S
Abstract: k2313 LY0504 SOP14 PM646
Text: AT1793 Preliminary Product Information 2-Channel Step-Down PWM Controller Features • 4.75V to 26V supply voltage operating. • Efficiency up to 85%. • Typical frequency operation to 1MHz. • Voltage-mode PWM step-down regulation. • 1V±2% internal reference.
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AT1793
QFN-16
OP-14
AT1793
350mm3
AT1793S
k2313
LY0504
SOP14
PM646
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Untitled
Abstract: No abstract text available
Text: CM6100 2 Channel Very Low Capacitance ESD Protection Device in CSP Product Description California Micro Devices' CM6100 is a 4-bump very low capacitance ESD protection device in 0.4mm CSP form factor. It is fully compliant with IEC 61000-4-2. The CM6100 is RoHS II compliant.
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CM6100
CM6100
178mm
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sac105
Abstract: CM6000 CM6100 ww15
Text: 0.4mm Pitch Daisy Chain CM6100 Product Description The 6100 is a 4-bump very low capacitance ESD protection device in 0.4mm CSP form factor. It is fully compliant with IEC 61000-4-2. The CM6100 is RoHS II compliant. Electrical Schematic / Pin Description WHERE X =
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CM6100
CM6100
sac105
CM6000
ww15
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