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    256-PIN BGA Search Results

    256-PIN BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    256-PIN BGA Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    256-pin BGA

    Abstract: 24 pin MATRIX led matrix circuits 256-pin
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)


    Original     		BGA-256P-M01 256-pin BGA-256P-M01) BGA256002SC-2-1 wi256-pin 256-pin BGA 24 pin MATRIX led matrix circuits PDF

    led matrix circuits

    Abstract: 256-pin Plastic BGA BGA-256P-M02
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)


    Original     		BGA-256P-M02 256-pin BGA-256P-M02) BGA256004SC-2-1 led matrix circuits 256-pin Plastic BGA BGA-256P-M02 PDF

    256-pin BGA

    Abstract: led matrix circuits 256-pin
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)


    Original     		BGA-256P-M04 256-pin BGA-256P-M04) B256009SC-1-3 256-pin BGA led matrix circuits PDF

    256-pin Plastic BGA

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ


    Original     		BGA-256P-M01 256-pin BGA-256P-M01) BGA256002SC-2-1 o256-pin 256-pin Plastic BGA PDF

    BGA-256P-M02

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)


    Original     		BGA-256P-M02 256-pin BGA-256P-M02) BGA256004SC-2-1 BGA-256P-M02 PDF

    Untitled

    Abstract: No abstract text available
    Text: Up To 4 K Switching Matrix TDM/TSI SWITCHES VOICE/DATA Packaging M 8 40 pin PDIP, 44 pin PLCC, 44 pin QFP MT89L80 256 x 256 8 8 M 8 44 pin PLCC, 48 pin SSOP MT89L85 256 x 256 8 8 M 8 44 pin PLCC, 48 pin SSOP ZL50012 512 x 512 16 16 Per-Stream M 16 160 pin LQFP, 144 ball LBGA


    Original     		MT8981 MT8980 MT8985 MT89L80 MT89L85 ZL50012 ZL50016 ZL50017 MT90820 MT90823 PDF

    c051004

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04) Note: The actual shape of corners may differ from the dimension. 27.00±0.20(1.063±.008)SQ


    Original     		BGA-256P-M04 50mil 256-pin BGA-256P-M04) BGA256001SC-1-2 c051004 PDF

    Untitled

    Abstract: No abstract text available
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M04 256-pin plastic T-BGA Lead pitch 1.27 mm Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04) Note: The actual shape of corners may differ from the dimension.


    Original     		BGA-256P-M04 256-pin BGA-256P-M04) B256009SC-1-4 PDF

    C1995

    Abstract: 256-PIN 256-pin Plastic BGA
    Text: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M01 Lead pitch 50mil Pin matirx 20 Sealing method Plastic mold 256-pin plastic BGA BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ Note: The actual shape of corners may differ from the dimension.


    Original     		BGA-256P-M01 50mil 256-pin BGA-256P-M01) BGA256002SC-2-1 C1995 256-pin Plastic BGA PDF

    BGA-256P-M02

    Abstract: C1995 256-PIN
    Text: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M02 Lead pitch 50mil Pin matrix 20 Sealing method Plastic mold 256-pin plastic BGA BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004) Note: The actual shape of corners may differ from the dimension.


    Original     		BGA-256P-M02 50mil 256-pin BGA-256P-M02) BGA256004SC-2-1 BGA-256P-M02 C1995 PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 587-10-256-08-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 256-08-005 16 X 16 # Of Pins Mill-Max Part Number 256 587-10-256-08-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737


    Original     		C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-10-256-08-007429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 256-08-007 16 X 16 # Of Pins Mill-Max Part Number 256 599-10-256-08-007429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929


    Original     		C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 587-10-256-10-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 256-10-005 20 X 20 # Of Pins Mill-Max Part Number 256 587-10-256-10-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737


    Original     		C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A PDF

    EPF6024A

    Abstract: No abstract text available
    Text: EPF6024A Device Pin-Outs ver. 1.0 Pin Name 1 144-Pin TQFP EPF6024A 208-Pin PQFP EPF6024A 240-Pin PQFP EPF6024A 256-Pin BGA EPF6024A 256-Pin FineLine BGA EPF6024A MSEL (2) 33 46 52 T3 L5 nSTATUS (2) 56 80 92 W11 K8 nCONFIG (2) 53 77 89 Y11 N8 DCLK (2) 128


    Original     		EPF6024A 144-Pin EPF6024A 208-Pin 240-Pin 256-Pin PDF

    XCR3256xl 144

    Abstract: Xilinx XCR3256XL FT256
    Text: R DS013 v1.7 April 11, 2001 XCR3256XL 256 Macrocell CPLD 14 Preliminary Product Specification Features Description • Lowest power 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays • System frequencies up to 140 MHz • 256 macrocells with 6,400 usable gates


    Original     		XCR3256XL DS013 144-pin 208-pin 256-ball 280-ball PQ208 FT256 CS280 XCR3256xl 144 Xilinx XCR3256XL PDF

    L16 eeprom

    Abstract: FT256 PQ208 TQ144 XCR3256XL CS280 DS012 DS013
    Text: R DS013 v1.8 April 19, 2001 XCR3256XL 256 Macrocell CPLD 14 Preliminary Product Specification Features Description • Lowest power 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays • System frequencies up to 140 MHz • 256 macrocells with 6,400 usable gates


    Original     		DS013 XCR3256XL 144-pin 208-pin 256-ball 280-bal0 L16 eeprom FT256 PQ208 TQ144 CS280 DS012 DS013 PDF

    XCR3256XL-10TQ144I

    Abstract: XCR3256 XCR3256XL-10TQ144C FT256 PQ208 TQ144 XCR3256XL XCR3256XL-7PQ208C XCR3256XL-7TQ144C CS280
    Text: R XCR3256XL 256 Macrocell CPLD DS013 v2.3 August 21, 2003 14 Preliminary Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays • System frequencies up to 154 MHz • 256 macrocells with 6,000 usable gates


    Original     		XCR3256XL DS013 144-pin 208-pin 256-ball XCR3256XL-10TQ144I XCR3256 XCR3256XL-10TQ144C FT256 PQ208 TQ144 XCR3256XL-7PQ208C XCR3256XL-7TQ144C CS280 PDF

    CS280

    Abstract: DS012 DS013 FT256 PQ208 TQ144 XCR3256XL XCR3256XL-7PQ208C XCR3256XL-7TQ144C U6-15
    Text: R XCR3256XL 256 Macrocell CPLD DS013 v2.1 January 27, 2003 14 Preliminary Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays • System frequencies up to 154 MHz • 256 macrocells with 6,000 usable gates


    Original     		XCR3256XL DS013 144-pin 208-pin 256-ball CS280 DS012 DS013 FT256 PQ208 TQ144 XCR3256XL-7PQ208C XCR3256XL-7TQ144C U6-15 PDF

    Untitled

    Abstract: No abstract text available
    Text: R XCR3256XL 256 Macrocell CPLD DS013 v2.2 July 15, 2003 14 Preliminary Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays • System frequencies up to 154 MHz • 256 macrocells with 6,000 usable gates


    Original     		XCR3256XL DS013 144-pin 208-pin 256-ball PDF

    CS280

    Abstract: DS012 DS013 FT256 PQ208 TQ144 XCR3256XL D1127 D1554
    Text: R XCR3256XL 256 Macrocell CPLD DS013 v1.9 January 8, 2002 14 Preliminary Product Specification Features Description • Lowest power 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays • System frequencies up to 140 MHz • 256 macrocells with 6,000 usable gates


    Original     		XCR3256XL DS013 144-pin 208-pin 256-ball CS280 DS012 DS013 FT256 PQ208 TQ144 D1127 D1554 PDF

    XCR3256XL-10TQ144I

    Abstract: No abstract text available
    Text: R XCR3256XL 256 Macrocell CPLD DS013 v2.6 April 8, 2005 14 Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.0 ns pin-to-pin logic delays The CoolRunner XPLA3 XCR3256XL device is a 3.3V, 256 macrocell CPLD targeted at power sensitive designs


    Original     		XCR3256XL DS013 144-pin 208-pin 256-ball 280-ball XCR3256XL-10TQ144I PDF

    XCR3256XL

    Abstract: XCR3256XL-10TQ144I XCR3256XL-7TQG144C XCR3256XL-12TQG144I XCR3256XL-10CS280C XCR3256XL-12PQ208I XCR3256XL-10TQG144C marking w13 XCR3256XL-12PQG208I XCR3256XL10TQG144C
    Text: R XCR3256XL 256 Macrocell CPLD DS013 v2.7 March 31, 2006 14 Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.0 ns pin-to-pin logic delays The CoolRunner XPLA3 XCR3256XL device is a 3.3V, 256 macrocell CPLD targeted at power sensitive designs


    Original     		XCR3256XL DS013 144-pin 208-pin 256-ball XCR3256XL-10TQ144I XCR3256XL-7TQG144C XCR3256XL-12TQG144I XCR3256XL-10CS280C XCR3256XL-12PQ208I XCR3256XL-10TQG144C marking w13 XCR3256XL-12PQG208I XCR3256XL10TQG144C PDF

    256-pin Plastic BGA

    Abstract: BGA-256P-M21
    Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M21 256-pin plastic BGA Ball pitch 1.27 mm Package width x package length 27.00 × 27.00 mm Sealing method Plastic mold Mounting height 2.53 mm MAX Weight Approx. 2.7 g BGA-256P-M21


    Original     		BGA-256P-M21 256-pin BGA-256P-M21) BGA256021Sc-3-3 256-pin Plastic BGA BGA-256P-M21 PDF

    XCR3256XL-10TQ144I

    Abstract: CS280 DS012 DS013 FT256 PQ208 TQ144 XCR3256XL XCR3256XL-7PQ208C XCR3256XL-7TQ144C
    Text: R XCR3256XL 256 Macrocell CPLD DS013 v2.5 February 13, 2004 14 Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays The XCR3256XL is a 3.3V, 256 macrocell CPLD targeted at power sensitive designs that require leading edge programmable logic solutions. A total of 16 function blocks provide


    Original     		XCR3256XL DS013 144-pin 208-pin 256-ball 280-ball XCR3256XL-10TQ144I CS280 DS012 DS013 FT256 PQ208 TQ144 XCR3256XL-7PQ208C XCR3256XL-7TQ144C PDF