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    Untitled

    Abstract: No abstract text available
    Text: Chip size 20 x 20 ±3 mil 0.5 x 0.5 ±0.768 mm Chip thickness 10+2 mil (0.25 +0.05 mm) Chip substrate material 99.6% alumina, 2-4p inch finish Resistor material Tantalum nitride, self-passivating Bonding pad size 4 x 6 mil (0.10 x 0.15 mm) min. Number of pads


    OCR Scan     		PDF 250ppmTCR MIL-STD-883

    Untitled

    Abstract: No abstract text available
    Text: bcp semes T H IN -F IL M I The BCP series, single value, back contact resistor chips require only one wire bond save hybrid space and shorten hybrid assembly time. They are manufactured in the smallest chip size available. These chips are manufactured using state-of-the-art thin-film techniques, are 100%


    OCR Scan     		PDF MIL-STD-883. MIL-STD-883