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    250 MICRO SOLDER BALL Search Results

    250 MICRO SOLDER BALL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMPM3HMFYAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HPFYADFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP128-1420-0.50-001 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HLFYAUG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP64-1010-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation

    250 MICRO SOLDER BALL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    120C

    Abstract: 140C 210C
    Text: Note Number AN-C1-RW-A Development Tools And Methods APPLICATION NOTE CLEARONE REWORK PROCEDURE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using


    Original     		PDF N130MZ327 N163MZ163 N169MZ365 N161MZ612 N169MZ641 120C 140C 210C

    ALIVH

    Abstract: WLCSP smt 250 B 340 smd Transistor WLCSP stencil design AN-1112 national semiconductor pb-free marking 250 micro solder ball 9221 MARKING MARKING SMD IC CODE smd diode ED
    Text: National Semiconductor Application Note 1112 September 9, 2009 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF AN-1112 ALIVH WLCSP smt 250 B 340 smd Transistor WLCSP stencil design AN-1112 national semiconductor pb-free marking 250 micro solder ball 9221 MARKING MARKING SMD IC CODE smd diode ED

    ALIVH

    Abstract: national semiconductor pb-free marking AN-1112 JESD51-3 MARKING CODE SMD IC General Semiconductor smd gm 9221 MARKING
    Text: National Semiconductor Application Note 1112 December 18, 2007 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF AN-1112 ALIVH national semiconductor pb-free marking AN-1112 JESD51-3 MARKING CODE SMD IC General Semiconductor smd gm 9221 MARKING

    AN-1112

    Abstract: ALIVH PCB design for 0.2mm pitch csp package 250 B 340 smd Transistor JESD51-3 MARKING CODE SMD IC
    Text: National Semiconductor Application Note 1112 January 13, 2010 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF AN-1112 AN-1112 ALIVH PCB design for 0.2mm pitch csp package 250 B 340 smd Transistor JESD51-3 MARKING CODE SMD IC

    ALIVH

    Abstract: AN-1112 AN1112 ALIVH PCB joint JESD51-3
    Text: National Semiconductor Application Note 1112 January 13, 2010 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF AN-1112 ALIVH AN-1112 AN1112 ALIVH PCB joint JESD51-3

    ALIVH

    Abstract: JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement
    Text: National Semiconductor Application Note 1412 June 9, 2009 Table of Contents Introduction . Package Construction .


    Original     		PDF AN-1412 ALIVH JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement

    IPC-SM-785

    Abstract: GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
    Text: National Semiconductor Application Note 1112 March 2002 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning


    Original     		PDF AN-1112 IPC-SM-785 GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP

    AN-1112

    Abstract: solder joint reliability IPC-SM-785 Solder paste stencil life thick bga die size Semiconductor smd marking BY SMD 420
    Text: National Semiconductor Application Note 1112 March 2002 Table of Contents Introduction to MICRO SMD . Package Construction .


    Original     		PDF

    stencil tension

    Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
    Text: National Semiconductor Application Note 1112 June 2001 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning


    Original     		PDF AN-1112 stencil tension IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design

    ALIVH

    Abstract: HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC
    Text: National Semiconductor Application Note 1112 September 2005 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF CSP-9-111S2) CSP-9-111S2. AN-1112 ALIVH HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC

    IPC-SM-785

    Abstract: stencil tension AN-1112
    Text: National Semiconductor Application Note 1112 April 2003 Table of Contents Introduction . Package Construction .


    Original     		PDF

    BGA reflow guide

    Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
    Text: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using


    Original     		PDF N163MZ163 N130MZ327 N161MZ612 N169MZ365 N169MZ641 N158MZ395 BGA reflow guide "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile

    smd transistor marking A6

    Abstract: ir sensing circuit using LM358 TRANSISTOR SMD MARKING CODE a6 water level control using lm358 TRANSISTOR SMD MARKING CODE LF temperature control using lm358 LM358I lm358 water level lm358 laser current driver smd transistor marking a7
    Text: LM358BP MICRO SMD QUALIFICATION PACKAGE Winter 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LM358BP AN-1112 LM358 smd transistor marking A6 ir sensing circuit using LM358 TRANSISTOR SMD MARKING CODE a6 water level control using lm358 TRANSISTOR SMD MARKING CODE LF temperature control using lm358 LM358I lm358 water level lm358 laser current driver smd transistor marking a7

    ALIVH

    Abstract: pcb thermal Design guide trace theta layout AN-1412 7x8 64 footprint micro solder ball
    Text: National Semiconductor Application Note 1412 May 2006 Table of Contents Introduction . Package Construction .


    Original     		PDF AN-1412 ALIVH pcb thermal Design guide trace theta layout AN-1412 7x8 64 footprint micro solder ball

    lm78l05

    Abstract: zener SMD MARK A9 smd transistor marking A10 marking code hr 31 SMD zener diode 1.6v sot-23 Marking 40g BGA-3000 lm78l05 smd MARKING SMD IC CODE 611
    Text: LM78L05IBP MICRO SMD QUALIFICATION PACKAGE Winter 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LM78L05IBP AN-1112 LM78L05 zener SMD MARK A9 smd transistor marking A10 marking code hr 31 SMD zener diode 1.6v sot-23 Marking 40g BGA-3000 lm78l05 smd MARKING SMD IC CODE 611

    250 micro solder ball

    Abstract: garrou fujitsu reflow profile SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY heller 1700 39ag
    Text: Lead-Free Wafer Level-Chip Scale Package: Assembly and Reliability V. Patwardhan, N. Kelkar, and L. Nguyen National Semiconductor Corporation P.O. Box 58090 M/S 19-100 Santa Clara, California 95052 Abstract This paper discusses the reliability testing results of a


    Original     		PDF

    M39029/1-101

    Abstract: M22885 ms27722-22 MS24523-23 MS27785-30 ms24515 MS27719-23-1 MIL-S-83781 MS24524-23 MS27723-23
    Text: TL Series FEATURES ɀ Qualified to MIL-S-3950 ɀ Environment-proof sealing ɀ 1, 2, and 4 pole circuitry ɀ Standard and pull to unlock levers ɀ 2 and 3 position, maintained, and momentary toggle action ɀ Temperature range: – 85°F to +160°F – 65°C to +71°C


    Original     		PDF MIL-S-3950 32EN1-6 MS21320-4) 41EN1-6 MS24420-1) 42EN1-6 MS24420-2) M39029/1-101 M22885 ms27722-22 MS24523-23 MS27785-30 ms24515 MS27719-23-1 MIL-S-83781 MS24524-23 MS27723-23

    TRANSISTOR SMD MARKING CODE LF

    Abstract: SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin
    Text: LM431 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LM431 AN-1112 TRANSISTOR SMD MARKING CODE LF SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin

    P62BN820MA2636

    Abstract: No abstract text available
    Text: Opti - Cap P62BN820MA2636 MAXIMUM ENVELOPE SEE TABLE Multilayer Capacitor .067 ± .004” .031 ± .005” .031 ± .005” Milli - Cap® .020 ± .002” .005 ± .001” .020 ± .002” .058 ± .003” Termination Metallization: 7.5 ± 4.5 microinches Au over a minimum of 50 microinches Ni


    Original     		PDF P62BN820MA2636 0254um AS9100, P62BN820MA2636

    P21BN300MA3976

    Abstract: No abstract text available
    Text: Opti - Cap P21BN300MA3976 .020” ± .002” .010” ± .001” Multilayer Capacitor .012” ± .002” Milli-Cap® .006” ± .001” .010” ± .002” .020” ± .004” Table 1: Assembly Part Number ® Product Code Milli-Cap MLC DLI Assembly Case Size Material Capacitance Capacitance Tolerance MLC Reference Outline Drawing


    Original     		PDF P21BN300MA3976 P21BN300MA3976 0254um AS9100,

    JESD22-B117

    Abstract: MICRO SWITCH PRESSURE PCB JEDEC JESD22-B117 JESD22-A104-A smd marking 2x5 micro pitch BGA Lead Free reflow soldering profile BGA PCB design for very fine pitch csp package JESD22-A108-A JESD22-A110
    Text: VISHAY SILICONIX Power MOSFETs Application Note 835 PCB Design and Surface-Mount Assembly Guidelines for MICRO FOOT Packages By Changsheng Chen/Greg Getzan Introduction The Vishay Siliconix MICRO FOOT® product family is based on wafer-level chip scale packaging WL-CSP


    Original     		PDF Si8902EDB 25-Apr-08 JESD22-B117 MICRO SWITCH PRESSURE PCB JEDEC JESD22-B117 JESD22-A104-A smd marking 2x5 micro pitch BGA Lead Free reflow soldering profile BGA PCB design for very fine pitch csp package JESD22-A108-A JESD22-A110

    Untitled

    Abstract: No abstract text available
    Text: RFL Series Aluminum Electrolytic Capacitors High R.C., Long Life MERITEK FEATURES • Endurance 105°C 8,000 to 10,000 hours.  Suitable for electronic ballast, adaptor and switching power SPECIFICATIONS Item Characteristic Operating Temp Range - 40 ~ +105C


    Original     		PDF 400VDC 450VDC 120Hz

    JESD22-B111

    Abstract: ALIVH national semiconductor pb-free marking AN-1412 B111 JESD22 JESD22B111 400um ALIVH PCB
    Text: National Semiconductor Application Note 1412 June 2007 Table of Contents Introduction . Package Construction .


    Original     		PDF AN-1412 JESD22-B111 ALIVH national semiconductor pb-free marking AN-1412 B111 JESD22 JESD22B111 400um ALIVH PCB

    CM1300

    Abstract: CM1300-03CP CM1300-03CS CSPRC032A 250 micro solder ball
    Text: CM1300 4 Channel EMI Filter Network Features Product Description • • The CM1300 is a 4-channel low pass EMI filter R-C-R configuration manufactured in a Chip Scale Package (CSP). Many portable applications require the attenuation of signals in the 800-3000 MHz band. California


    Original     		PDF CM1300 CM1300 CSPRC032A 485mm 985mm 178mm CM1300-03CP CM1300-03CS CSPRC032A 250 micro solder ball