Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET 4G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDB4432BAPC Specifications Features • Density: 4G bits • Organization — 16M words × 32 bits × 8 banks • Data rate: 1066Mbps (max.) • Package: 216-ball FBGA — Package size: 12.0mm × 12.0mm
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216-ball
EDB4432BAPC
1066Mbps
M01E1007
E1891E10
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Untitled
Abstract: No abstract text available
Text: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 15.0mm 15.0mm, 216-ball FBGA EDFA164A1PK Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words 32 bits 8 banks) in one package — Independent 2-channel bus • Package
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216-ball
EDFA164A1PK
1600Mbps
M01E1007
E2052E20
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Untitled
Abstract: No abstract text available
Text: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 15.0mm 15.0mm, 216-ball FBGA EDFA164A1PB Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words 32 bits 8 banks) in one package — Independent 2-channel bus • Package
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PDF
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216-ball
EDFA164A1PB
1600Mbps
M01E1007
E1909E50
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 4G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDB4064B3PB Specifications Features • Density: 4G bits • Organization — 2 pieces of 2Gb (8M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Data rate: 1066Mbps (max.)
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PDF
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216-ball
EDB4064B3PB
1066Mbps
M01E1007
E1831E30
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 8G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDB8164B3PF Specifications Features • Density: 8G bits • Organization — 2 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Data rate: 1066Mbps (max.)
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PDF
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216-ball
EDB8164B3PF
1066Mbps
M01E1007
E1786E30
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 8G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDB8132B3PD Specifications Features • Density: 8G bits • Organization — 16M words × 32 bits × 8 banks × 2 ranks — 2 pieces of 4Gb (× 32) in one package • Data rate: 1066Mbps (max.)
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PDF
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216-ball
EDB8132B3PD
1066Mbps
M01E1007
E1892E20
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Untitled
Abstract: No abstract text available
Text: DATA SHEET 16G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDBA164B1PB Specifications Features • Density: 16G bits • Organization — 4 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Data rate: 1066Mbps (max.)
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PDF
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216-ball
EDBA164B1PB
1066Mbps
M01E1007
E1806E30
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MT42L256M32D2
Abstract: LPDDR2 SDRAM micron MT42L128M32D1 PS 229 ADQ-22 micron lpddr2 MT42L256M32D marking wl4 SMD MARKING code 4N Dual LPDDR2
Text: 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4 Features Options • Ultra low-voltage core and I/O power supplies – VDD2 = 1.14–1.30V
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MT42L256M16D1,
MT42L128M32D1,
MT42L256M32D2,
MT42L128M64D2,
MT42L512M32D4,
MT42L192M64D3,
MT42L256M64D4
09005aef84427aab
MT42L256M32D2
LPDDR2 SDRAM micron
MT42L128M32D1
PS 229
ADQ-22
micron lpddr2
MT42L256M32D
marking wl4
SMD MARKING code 4N
Dual LPDDR2
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SMD MARKING CODE sdp
Abstract: No abstract text available
Text: 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4, MT42L384M32D3 Features Options • Ultra low-voltage core and I/O power supplies – VDD2 = 1.14–1.30V
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MT42L256M16D1,
MT42L128M32D1,
MT42L256M32D2,
MT42L128M64D2,
MT42L512M32D4,
MT42L192M64D3,
MT42L256M64D4,
MT42L384M32D3
09005aef84427aab
SMD MARKING CODE sdp
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LPDDR2 SDRAM micron
Abstract: lpddr2 MT42L256M32D2 LPDDR2 SDRAM micron lpddr2 MT42L128M32D1 micron LPDDR2 X32 35MR11 lpddr2 DQ calibration 216-ball LPDDR
Text: 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4 Features Options • Ultra low-voltage core and I/O power supplies – VDD2 = 1.14–1.30V
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PDF
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MT42L256M16D1,
MT42L128M32D1,
MT42L256M32D2,
MT42L128M64D2,
MT42L512M32D4,
MT42L192M64D3,
MT42L256M64D4
09005aef84427aab
LPDDR2 SDRAM micron
lpddr2
MT42L256M32D2
LPDDR2 SDRAM
micron lpddr2
MT42L128M32D1
micron LPDDR2 X32
35MR11
lpddr2 DQ calibration
216-ball LPDDR
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M1012
Abstract: No abstract text available
Text: 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4 Features Options • VDD2: 1.2V • Configuration – 32 Meg x 16 x 8 banks x 1 die – 16 Meg x 32 x 8 banks x 1 die
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MT42L256M16D1,
MT42L128M32D1,
MT42L256M32D2,
MT42L128M64D2,
MT42L512M32D4,
MT42L192M64D3,
MT42L256M64D4
134-ball
168-ball
216-ball
M1012
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Untitled
Abstract: No abstract text available
Text: Preliminary‡ 4Gb: x16, x32 Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4 Features Options • VDD2: 1.2V • Configuration – 32 Meg x 16 x 8 banks x 1 die
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PDF
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MT42L256M16D1,
MT42L128M32D1,
MT42L256M32D2,
MT42L128M64D2,
MT42L512M32D4,
MT42L192M64D3,
MT42L256M64D4
134-ball
168-ball
09005aef84427aab)
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Untitled
Abstract: No abstract text available
Text: 4Gb: x16, x32 Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4 Features Options • VDD2: 1.2V • Configuration – 32 Meg x 16 x 8 banks x 1 die
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PDF
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MT42L256M16D1,
MT42L128M32D1,
MT42L256M32D2,
MT42L128M64D2,
MT42L512M32D4,
MT42L192M64D3,
MT42L256M64D4
134-ball
168-ball
09005aef84fe5e04
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MT42L256M32D2
Abstract: MT42L128M32D1 lpddr2 DQ calibration MT42L256M16D1 LPDDR2 SDRAM MT42L128M64D2 MT42L256M64D4 mt42L256m16 LPDDR2 SDRAM micron LPDDR2
Text: 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4 Features Options • VDD2: 1.2V • Configuration – 32 Meg x 16 x 8 banks x 1 die – 16 Meg x 32 x 8 banks x 1 die
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PDF
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MT42L256M16D1,
MT42L128M32D1,
MT42L256M32D2,
MT42L128M64D2,
MT42L512M32D4,
MT42L192M64D3,
MT42L256M64D4
09005aef84427aab
MT42L256M32D2
MT42L128M32D1
lpddr2 DQ calibration
MT42L256M16D1
LPDDR2 SDRAM
MT42L128M64D2
mt42L256m16
LPDDR2 SDRAM micron
LPDDR2
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GPIO191
Abstract: No abstract text available
Text: OMAP3515/03 Applications Processor www.ti.com SPRS505 – FEBRUARY 2008 1 OMAP3515/03 Applications Processor • • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • 600-MHz ARM Cortex™-A8 Core • NEON™ SIMD Coprocessor
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OMAP3515/03
SPRS505
600-MHz
OMAP3515
GPIO191
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MPC5675K
Abstract: MPC5675 e200z7d fine BGA thermal profile MPC5674* memory
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5675K Rev. 3, 8/2010 MPC5675K MPC5675K Microcontroller Data Sheet Overview This document provides electrical specifications, pin assignments, and package diagrams for the MPC5675K series
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MPC5675K
MPC5675K
QFN12
OT-343R
32-bit
MPC5675
e200z7d
fine BGA thermal profile
MPC5674* memory
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473-MAPBGA
Abstract: PXS30 B2M1-5 HVD12 LVD12 MPC5561 MPC5604P MPXS3010VMM150 e200z7 e200z7d
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: PXS30 Rev. 1, 09/2011 PXS30 PXS30 Microcontroller Data Sheet The PXS30 family represents a new generation of 32-bit microcontrollers based on the Power Architecture . These devices provide a
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PXS30
PXS30
32-bit
473-MAPBGA
B2M1-5
HVD12
LVD12
MPC5561
MPC5604P
MPXS3010VMM150
e200z7
e200z7d
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: PXS30 Rev. 1, 09/2011 PXS30 PXS30 Microcontroller Data Sheet The PXS30 family represents a new generation of 32-bit microcontrollers based on the Power Architecture . These devices provide a
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PXS30
PXS30
32-bit
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B2M1-5
Abstract: MPC5675K MPC5674 e200z7d 473-pin MPC5673 mpc5675 mobile ddr2 BLDC Driver MPC5674* memory
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5675K Rev. 4, 04/2011 MPC5675K MPC5675K Microcontroller Data Sheet 1 Overview This document provides electrical specifications, pin assignments, and package diagrams for the MPC5675K series of microcontroller units
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MPC5675K
MPC5675K
QFN12
OT-343R
32-bit
B2M1-5
MPC5674
e200z7d
473-pin
MPC5673
mpc5675
mobile ddr2
BLDC Driver
MPC5674* memory
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MT29C4G48MAZBBAKQ-48 IT
Abstract: MT29C8G96MAZBBDJV-48 IT MT29C4G96MAZBBCJG-48 mt29c4g96
Text: Micron Confidential and Proprietary 168-Ball NAND Flash with LPDDR PoP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package PoP Combination Memory (TI OMAP ) MT29C4G48MAZBBAKQ-48 IT: 4Gb x16 (NAND) with 2Gb x32 (LPDDR) MT29C4G96MAZBBCJG-48 IT: 4Gb x16 (NAND) with 4Gb x32 (LPDDR)
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168-Ball
MT29C4G48MAZBBAKQ-48
MT29C4G96MAZBBCJG-48
MT29C8G96MAZBBDJV-48
09005aef855512a5
168ball
MT29C4G48MAZBBAKQ-48 IT
MT29C8G96MAZBBDJV-48 IT
mt29c4g96
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samsung ddr3 ram MTBF
Abstract: KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd
Text: PRODUCT SELECTION GUIDE LCD, Memory and Storage | 1H 2012 + Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks
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BR-12-ALL-001
samsung ddr3 ram MTBF
KLM2G1HE3F-B001
KLM4G1FE3B-B001
KLMAG2GE4A-A001
k4B2G1646
KLMAG
KLM8G2FE3B-B001
K4B2G0446
klm8g
k4x2g323pd
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SGX530
Abstract: GPMC OMAP35xx ETM11 n515 omap3530 TRM TrustZone OMAP3525 OMAP3530 TI GPIO106
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507 – FEBRUARY 2008 1 OMAP3530/25 Applications Processor 1.1 Features • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • 600-MHz ARM Cortex™-A8 Core • NEON™ SIMD Coprocessor
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OMAP3530/25
SPRS507
600-MHz
430-MHz
TMS320C64x
OMAP3530
SGX530
GPMC
OMAP35xx
ETM11
n515
omap3530 TRM
TrustZone
OMAP3525
OMAP3530
TI GPIO106
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OMAP3525
Abstract: OMAP3530 SGX530 OMAP35xx Cortex-A8 Errata cache C64X CPU BW 6122 GPMC OMAP NAND
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507 – FEBRUARY 2008 1 OMAP3530/25 Applications Processor 1.1 Features • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • 600-MHz ARM Cortex™-A8 Core • NEON™ SIMD Coprocessor
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OMAP3530/25
SPRS507
600-MHz
430-MHz
TMS320C64x
OMAP3530
OMAP3525
OMAP3530
SGX530
OMAP35xx
Cortex-A8 Errata cache
C64X CPU
BW 6122
GPMC OMAP NAND
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MIPI dbi
Abstract: TI Sitara ARM MPU PowerVR sgx 545 NCS24 matrix tv m21 service mode manual AM37X 37X CUS CBC 557 B
Text: AM3715/03 www.ti.com SPRS616B – JUNE 2010 – REVISED JULY 2010 AM3715/03 Applications Processor 1 AM3715/03 Applications Processor 1.1 Features • AM3715/03 Applications Processor: – Compatible with OMAP 3 Architecture – MPU Subsystem • 1-GHz ARM CortexTM-A8 Core
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AM3715/03
SPRS616B
AM3715/03
MIPI dbi
TI Sitara ARM MPU
PowerVR sgx 545
NCS24
matrix tv m21 service mode manual
AM37X
37X CUS
CBC 557 B
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